Related by context. All words. (Click for frequent words.) 74 AlGaN 70 SiO 2 70 hafnium oxide 69 nitride 69 GaN substrates 68 silicon Si 68 crystallinity 68 aluminum nitride 68 silicide 68 ZnO 68 SiC substrates 67 silicon substrates 67 μm thick 67 AlGaN GaN 67 InGaN 66 ZnSe 66 calcium fluoride 66 ferrite 66 eutectic 66 microcrystalline 66 Si substrates 66 substrate 66 undoped 66 LiNbO3 66 nanocrystalline 66 dielectrics 66 silicon nitride 65 MWNT 65 TiN 65 epitaxial layer 65 GaN layer 65 ZnS 65 gate dielectrics 65 SWCNT 65 epitaxial 65 epitaxial layers 65 Si substrate 65 gallium indium arsenide 65 monolithically integrated 65 electrically insulating 65 polycrystalline 64 dopant 64 AlGaAs 64 CdSe 64 epitaxy HVPE 64 intermetallic 64 InN 64 zirconium oxide 64 SiON 64 sapphire substrate 64 AlN substrates 64 hydride vapor phase 64 k dielectric 64 HEMTs 64 GaN 64 doped silicon 64 monolayer 63 III nitride 63 multilayers 63 amorphous silicon Si 63 selenide 63 1μm 63 HfO2 63 tantalum capacitors 63 perovskite 63 compressive stress 63 UVTP 63 transparent conductive 63 silicon germanium SiGe 63 cordierite 63 aluminum nitride AlN 63 substrates 63 electroless nickel 63 nitrides 63 GaP 63 crystallites 63 silicon oxynitride 63 martensite 63 CMOS transistors 63 #.#μm [001] 63 InAs 63 #μm [002] 63 MoS2 62 polydimethylsiloxane PDMS 62 dielectric materials 62 gallium selenide 62 AlN layer 62 gate electrode 62 aluminum oxide 62 mesoporous 62 indium tin oxide ITO 62 HfSiON 62 nitride semiconductor 62 4H SiC 62 wirewound 62 Schottky diode 62 gallium nitride 62 InGaP 62 copper indium gallium 62 nMOS 62 titania 62 HEMT 62 #.#um [001] 62 AlGaInP 62 epiwafers 62 copper metallization 62 X7R 62 magnetron sputtering 62 dielectric layers 62 thermally stable 62 pearlite 62 SiO2 62 GaAs substrates 62 pMOS 62 silicate glass 62 agarose 62 nanometric 62 AFM probes 62 dielectric constant 62 zinc selenide 62 microcavity 61 low k dielectric 61 carbides 61 PZT 61 biaxial 61 martensitic 61 Europium 61 tin Sn 61 electron mobility 61 solder pastes 61 APTIV film 61 pellicle 61 #um [001] 61 Silicon Nitride 61 Zinc Oxide 61 InGaAs 61 ceramic capacitor 61 anodic 61 boron nitride 61 dielectric 61 SiC substrate 61 UNCD 61 SAW oscillators 61 dielectric layer 61 SiC 61 NiSi 61 conductive polymer 61 P3HT 61 2μm 61 indium gallium arsenide 61 epitaxial silicon 61 metallization 61 ZrO 2 61 nanoporous 61 barium titanate 61 SOI wafer 61 amorphous silicon 61 ceramic substrate 61 electrodeposition 61 vapor deposition 61 transparent conductive oxide 61 GaAs substrate 61 nickel silicide 61 QDs 61 photoresists 61 CIGS solar cells 61 MEMS resonators 61 Sn Pb 61 QFN packages 61 silicon substrate 61 chip resistors 61 overmolding 61 metallisation 61 tin oxide 61 austenitic stainless steel 61 MgO 61 oxide semiconductor 60 CIGS copper indium 60 5μm 60 Germanium 60 cerium oxide 60 titanium carbide 60 Polyimide 60 indium phosphide InP 60 wafer bonder 60 passivation layer 60 paramagnetic 60 oxide 60 RO membrane 60 nanodots 60 HVPE 60 semiconductive 60 heterostructures 60 oxide layer 60 Polycrystalline 60 tantalum nitride 60 polyimide 60 MWCNTs 60 crystalline silicon c 60 thickness uniformity 60 underfill 60 nucleation layer 60 Czochralski 60 SOI CMOS 60 electroless copper 60 crystalline Si 60 ceria 60 ZnO nanowire 60 electrically conductive 60 μm diameter 60 titanium nitride 60 #nm CMOS [002] 60 varistor 60 PIN diodes 60 anneal 60 conductive epoxy 60 silicon dioxide SiO2 60 Gallium Arsenide 60 indium arsenide 60 solder bumps 60 aqueous dispersion 60 PEDOT PSS 60 highly conformal 60 CIS CIGS 60 cored wire 60 Gallium arsenide 60 Al#O# 60 polymer matrix 60 silicon 59 oxide semiconductors 59 polymeric 59 BJTs 59 monolayers 59 PHEMT 59 zirconium dioxide 59 ferrite core 59 thermoplastic polyester 59 YBCO 59 heterostructure 59 indium tin oxide 59 MOS transistors 59 sintered 59 cementite 59 superlattice 59 #um [002] 59 ferritic 59 low k dielectrics 59 Si wafers 59 TQFP packages 59 W mK 59 layer graphene 59 polyimides 59 thermoplastic polymer 59 FeRAM 59 manganese oxide 59 block copolymer 59 cadmium selenide 59 nanocrystal 59 nanocrystalline diamond 59 manganite 59 antimonide 59 copper interconnects 59 micron thick 59 cm ² 59 nanopowder 59 MLCCs 59 C0G 59 SOI substrates 59 poly Si 59 silica spheres 59 TCXO 59 lattice mismatch 59 indium gallium 59 conductive adhesive 59 Ruthenium 59 oxide particles 59 epitaxial wafers 59 SWNT 59 birefringence 59 FinFETs 59 encapsulant 59 pentacene 59 planar 59 solder bumping 59 lithium niobate 59 CIGS cells 59 crosslinking 59 ferroelectric 59 Silicon dioxide 59 polybutadiene 59 #.# micron node 59 photosystem II 59 defect densities 59 CdS 59 nanoimprint 59 CaCO3 59 conductive coating 59 K dielectrics 59 parasitic capacitance 59 CoO 59 metalorganic chemical vapor deposition 59 gelation 59 CBT resin 59 insulator wafers 59 capacitances 59 interfacial layer 59 thermal decomposition 59 MESFET 59 #.#μ 59 silicon carbide 59 thermo mechanical 59 antireflective coatings 59 CMOS silicon 59 ultrananocrystalline diamond 59 k gate dielectrics 59 thermally conductive 59 Amorphous silicon 58 Nd YAG 58 elastic modulus 58 laser annealing 58 dual damascene 58 silicon oxide 58 micrometer thick 58 indium gallium phosphide InGaP 58 titanium oxide 58 wafer thickness 58 Indium Tin Oxide 58 nematic 58 PIN diode 58 Epson Toyocom 58 transparent electrode 58 conformal 58 ferritic stainless steel 58 CMOS fabrication 58 toroids 58 FinFET 58 polymer membranes 58 .# micron 58 laterally diffused metal 58 fused silica 58 laminations 58 nanopowders 58 SOI silicon 58 annealing 58 InSb 58 nickel hydroxide 58 nonpolar GaN 58 conductive adhesives 58 self assembled monolayer 58 passivation 58 TEOS 58 Schottky barrier 58 Gallium Arsenide GaAs 58 vanadate 58 epitaxy 58 Schottky diodes 58 leadframe 58 Chemical Vapor Deposition 58 cathodic 58 passivated 58 microporous 58 Cu interconnects 58 DFN package 58 bipolar transistor 58 temperature coefficient 58 PbS 58 InGaAs InP 58 isotropic 58 intramolecular 58 organic TFTs 58 voltage divider 58 mechanical polishing CMP 58 Rubidium 58 epi wafers 58 GaAs MESFET 58 microcavities 58 JFET 58 polysulfone 58 polariton 58 polymerisation 58 sigma delta 58 carbon nanotube CNT 58 poly crystalline 58 ArF 58 #x# mm [004] 58 nanotube arrays 58 Fe Mg 58 GaAs InP 58 formate 58 gallium indium phosphide 58 PEEK OPTIMA 58 photoresist 58 QPAC ® 58 encapsulants 58 BEOL 58 vanadium oxide 58 antiferromagnetic 58 GaN wafers 58 PMOS transistors 58 UV NIL 58 LSA#A 58 dielectric strength 58 electrophoretic 58 solder bump 58 multi crystalline wafers 58 thixotropic 58 flexible substrates 58 SOFC stacks 58 nonpolar 58 SiC Schottky diodes 58 GaN layers 58 ENIG 58 GaN nanowires 58 polyacrylonitrile 58 CMOS logic 58 borosilicate glass 58 VCSELs 58 uniaxial 58 gallium indium 58 imprint lithography 58 TiO 58 microstructured 58 #μm thick [002] 58 NWs 58 polymerized 58 #nm lithography [001] 58 aluminosilicate 58 Silicon Germanium 58 submicron 58 reflow soldering 58 silicon germanium 58 photopolymers 58 #μm [001] 58 SAC# 57 silicon carbide substrates 57 polyetheretherketone PEEK 57 bilayer 57 unreacted 57 #nm wavelength [001] 57 Transparent Conductive Oxide TCO 57 CVD diamond 57 nanostructured surfaces 57 GaN substrate 57 dopants 57 DSSCs 57 mask aligner 57 bandpass filters 57 leakage currents 57 PEDOT 57 microcrystalline silicon 57 aluminum electrolytic capacitors 57 optically transparent 57 conductivities 57 ultrahigh purity 57 VUV 57 fxP 57 tantalum capacitor 57 hydroxyapatite 57 PE# [001] 57 threshold voltages 57 electroless 57 SIMOX 57 modulus 57 transparent conductive coatings 57 Gallium Nitride 57 TiO 2 57 planarization 57 Micromorph 57 ElectroPhen 57 silanes 57 Chemical Vapor Deposition CVD 57 FEOL 57 Grätzel cells 57 SiC wafers 57 Complementary Metal Oxide Semiconductor 57 gallium nitride GaN 57 chalcogenide 57 chemically inert 57 tensile stress 57 ferrites 57 epitaxially 57 #nm silicon 57 photolithographic 57 vertical cavity 57 photonic bandgap 57 indium gallium nitride InGaN 57 CRIUS 57 MWCNT 57 photonic crystal 57 ferromagnetic 57 tetragonal 57 oxide nanoparticles 57 Aluminum Nitride 57 SnO2 57 Dektak 57 Epitaxial 57 leadframes 57 polyamides 57 thermostable 57 copper indium diselenide 57 YAG lasers 57 SN#C 57 silicone elastomers 57 crosslinked 57 pHEMT 57 pulsed laser deposition 57 multichip 57 strontium titanate 57 GaN LEDs 57 optical waveguide 57 melt viscosity 57 UV absorbance 57 InP 57 TFTs 57 photodiode 57 DFB lasers 57 CNTs 57 electroactive 57 electroluminescence EL 57 lanthanum aluminate 57 resistive element 57 superlattices 57 metal oxide 57 PVDF 57 leaded solder 57 Langmuir Blodgett 57 nanofabricated 57 intergranular 57 Qdot 57 electrolyte membranes 57 CMOS oscillators 57 microbolometers 57 CMOS RF CMOS 57 absorbance 57 phototransistors 57 through silicon vias 57 scintillator 57 TCXOs 57 halide 57 gate dielectric 57 thermosetting 57 PLLA 57 CIGS Copper Indium 57 etching DRIE 57 Cadmium Telluride 57 nanocluster 57 oxynitride 57 polymer membrane 57 ATRP 57 austenitic stainless steels 57 zinc oxide ZnO 57 5V CMOS 57 CaO 57 cadmium chloride 57 sSOI 57 varistors 57 SiGe bipolar 57 PIN photodiodes 57 QFN package 57 Tetratex 57 phototransistor 57 anatase 57 laser diode modules 57 thermal conduction 57 nano particulate 57 mount inductors 57 Cadmium Telluride CdTe 57 metallic alloys 57 crystallite 57 parasitic inductance 57 nanoparticulate 57 Metallization 57 Ti TiN 57 polymer electrolyte 57 micropores 57 glass substrate 57 MWNTs 57 cuprous oxide 57 QMEMS 57 absorption spectroscopy 57 Mosfets 57 multicrystalline silicon 57 aluminum gallium indium 57 chipscale 57 Insulator SOI 57 polyurethane resins 57 germanium 57 monocrystalline silicon 57 weldability 57 atomically smooth 57 UV absorbers 57 silicon waveguide 57 #.#μm CMOS process 56 wirebond 56 anomalous dispersion 56 Mg Fe 56 semiconductor nanowires 56 hydride 56 chalcogenide glass 56 #.#x#.#mm 56 cadmium sulphide 56 thermomechanical 56 PA6 56 bismuth telluride 56 bandgap 56 poly L lysine 56 macroporous 56 micromachining 56 Rilsan ® 56 optically coupled 56 surface mountable 56 BeO 56 sputter deposition 56 x 9mm 56 silane 56 Fig. 2b 56 Bulk Metal 56 nanobelts 56 etalon 56 thermal conductivity 56 semiconducting material 56 wettability 56 oligomer 56 GaN transistor 56 microfabricated 56 electrolytic capacitor 56 CaF2 56 photodiode arrays 56 silicon nanowire 56 layer deposition ALD 56 Applied Endura 56 chromium oxide 56 Gallium Nitride GaN 56 dispersive 56 epitaxially grown 56 fluoropolymer 56 UV LEDs 56 germanium substrates 56 SDS PAGE 56 nanofilm 56 functionalized 56 photocatalysts 56 #.#uF 56 nano imprint lithography 56 microstructures 56 multicrystalline 56 athermal 56 monocrystalline ingots 56 epiwafer 56 electrochemically 56 aluminum electrolytic 56 dimensionally stable 56 nanocrystals 56 nonlinear optical 56 stabilized zirconia 56 hexamers 56 AlSiC 56 NMOS 56 moisture absorption 56 GaN wafer 56 Lithium Niobate 56 millisecond annealing 56 flowability 56 Ti 4V 56 absorption coefficient 56 AIX #G# 56 flux residues 56 #.# micron CMOS 56 aluminum gallium nitride 56 Stanyl 56 defectivity 56 photolysis 56 Fig. 1A 56 nanodiamond 56 dielectric etch 56 CMOS compatible 56 microchannel plate 56 mosfet 56 thermosets 56 anisotropic 56 silicon dioxide 56 #nm #nm [002] 56 nano coating 56 Tunable 56 coercivity 56 Schottky 56 nanocages 56 optical waveguides 56 liquid silicone rubbers 56 #.#μm [002] 56 SiR#DP 56 TOSAs 56 QCLs 56 monochromator 56 lamella 56 e beam lithography 56 lanthanide 56 TDFN package 56 MSOP packages 56 deep silicon etch 56 mask ROM 56 crystal resonator 56 furnaceware 56 nanocomposite material 56 MOS transistor 56 tetramer 56 selective emitter 56 Nova NanoSEM 56 nitrogen doped 56 transmissivity 56 homopolymer 56 Boron Nitride 56 Chip Scale 56 PVD coating 56 ohmic contacts 56 photodetectors 56 SiT# 56 nano porous 56 3mm x 56 fluorosilicone 56 μm 56 processability 56 bilayers 56 homopolymers 56 Bragg grating 56 polymer 56 pyrite marcasite 56 silicone encapsulation 56 microvia 56 multilayer ceramic 56 conductivity 56 ohm cm 56 nitriding 56 SiGe 56 differential scanning calorimetry 56 Z Foil 56 sapphire wafer 56 self assembled monolayers 56 photopolymer 56 graphene layers 56 spinel 56 dielectric breakdown 56 glass frit 56 wettable 56 ferritic grades 56 halides 56 sol gel 56 nanoparticle inks 56 antireflective 56 thermodynamically stable 56 DMOS 56 semiconducting 56 alkene 56 nm wavelengths 56 polyaniline 56 VICTREX PEEK 56 Silicon wafers 56 x 3mm 56 interlayer 56 carbon airgel 56 zero valent iron 56 crystalline silicon 56 Carbon nanotube 56 varactors 56 Î ¼ 56 solder reflow 56 colloidal silica 56 σ 56 titanate 56 thermally activated 56 ReRAM 56 Aluminum Oxide 56 plasma etch 56 micro machining 56 Nanofiltration 56 passivation layers 56 piezoelectric ceramic 56 bipolar CMOS DMOS 56 silicon CMOS 56 capacitance 56 ultrathin layer 56 UV coatings 56 monodisperse 56 nacre 56 poly silicon 56 argon fluoride 56 micromorph 56 SiGe C 56 carbon nanotubes CNT 56 downconverter 56 hetero junction 56 indium phosphide 56 coextruded 56 sapphire wafers 56 hydrolysis 56 insulator substrate 56 Copper Indium Gallium Selenide 56 siloxane 56 PECVD 56 reactive ion 55 5mm x 5mm 55 cermet 55 Ultem 55 electrochemical capacitors 55 dielectric constants 55 Indium phosphide 55 ZnO nanowires 55 Field Effect Transistor 55 finely dispersed 55 biphenyl 55 amperometric 55 SOI wafers 55 hafnium 55 bistable 55 optocoupler 55 osteoconductive 55 #μ 55 zirconia 55 rigid foams 55 rigid polyurethane foam 55 Fig. 1c 55 adduct 55 alloying elements 55 antireflection 55 sub micron 55 copper indium 55 MEMS oscillators 55 Thin Film Transistors 55 thermal conductivities 55 micrometer sized 55 LPCVD 55 PVD CVD 55 aluminum silicate 55 gallium arsenide 55 UV LED 55 ethylene vinyl acetate 55 Heterojunction 55 fluorogenic 55 polydimethylsiloxane 55 calcined kaolin 55 multilayer ceramic capacitors 55 absorber layer 55 BiFET 55 polymeric membranes 55 interposer 55 gallium arsenide gallium nitride 55 Substrates 55 output capacitors 55 nanosphere 55 superalloy 55 graphitic carbon 55 silicone carbide 55 transparent conductive oxides 55 solubilizing 55 silicon etch 55 CNano 55 Si TFT LCD 55 superparamagnetic 55 manganese dioxide 55 silicon nanocrystals 55 cuvette 55 sulfonated 55 superconductive 55 magnetostrictive 55 Fe Ni 55 porous silicon 55 SFP transceivers 55 nano particle 55 monocrystalline wafers 55 CdTe 55 photonic crystal fibers 55 interfacial 55 reflow solder 55 #x#mm [002] 55 colloidal crystals 55 nanosized 55 W/cm2 55 DEV DA TOMAR NEXT 55 UV lasers 55 FLD glass 55 ArF immersion lithography 55 elastic moduli 55 oxide thickness 55 photocurrent 55 chemically reactive 55 TDK EPC 55 copper electroplating 55 UV VIS 55 adsorbents 55 DPAK 55 sintering 55 plasma etching 55 ferroelectric RAM 55 twin screw extruder 55 boron nitride nanotubes 55 arsenide 55 nanocomposite materials 55 solder paste 55 diopside 55 hydroperoxide 55 VCSEL 55 ferroelectricity 55 photostability 55 fibrillar 55 breakdown voltages 55 Nanorods 55 piezo actuators 55 nanorod 55 hydroxides 55 XRT#L# 55 cadmium sulfide 55 Vor ink 55 polysiloxane 55 cathodes 55 yttrium oxide 55 capacitors 55 EO polymer 55 CMOS 55 photoresist stripping 55 ductility 55 carbon nanofibers 55 thermoplastic polyurethane TPU 55 pore sizes 55 supercritical fluid 55 resists corrosion 55 QFNs 55 antifuse 55 copper indium gallium diselenide 55 multilayer ceramic capacitors MLCC 55 borane 55 Mbit SRAMs 55 Photolithography 55 spherical particles 55 complexation 55 MOCVD 55 ZrO2 55 coating thickness 55 Crystal Oscillator 55 permittivity 55 adsorbent 55 silica substrate 55 analyte 55 SOI substrate 55 rigid substrate 55 capacitor 55 rectifier diode 55 #nm [002] 55 metallic nanoparticles 55 polishing pads 55 capacitance values 55 fig. S6 55 coplanar 55 reflow soldering processes 55 alkali metal 55 Diamon Fusion ® 55 electron doped 55 pin TQFP packages 55 regenerable 55 vinyl esters 55 atomically thin 55 ceramic membranes 55 PowerPAK SO 8 55 plagioclase 55 wafer bonding 55 phthalocyanine 55 lanthanum oxide 55 flake graphite 55 line BEOL 55 solder alloys 55 planar waveguide 55 PowerPAK 55 Ge substrates 55 PBGA package 55 pyrophosphate 55 #nm SOI 55 EVG# 55 aryl 55 InGaP HBT 55 microreactors 55 planar lightwave circuits 55 epitaxial graphene 55 solder alloy 55 donor acceptor 55 dihydrogen 55 SO8 package 55 polycrystalline diamond 55 epitaxial deposition 55 passive matrix 55 nanostructure 55 elution 55 cuprate 55 eutectic solder 55 palladium Pd 55 GaN HEMTs 55 Nitride 55 wire bondable 55 octyl 55 polarizers 55 photocatalyst