Related by context. All words. (Click for frequent words.) 64 QFNs 63 QFPs 62 BGA CSP 61 solder bumps 60 interposer 60 leadframe 59 BGA packages 59 SnPb 59 underfill 59 #μm [002] 58 vias 58 WLCSP 58 BGA package 58 interposers 57 QFN packages 57 #μm [001] 57 Flip Chip 56 solder paste 56 microvia 56 FPCs 56 Si substrate 55 electrically insulating 55 solder bumping 55 wirebond 55 QFN 55 TSVs 55 solder pastes 55 dielectrics 55 Ball Grid Array 55 coplanarity 55 rigid flex 55 #um [002] 54 BGA 54 through silicon vias 54 singulated 54 density interconnect HDI 54 solder bump 54 PQFP 54 wirebonding 54 eutectic 54 solder mask 54 capacitances 54 substrates 53 FBGA packages 53 solder joints 53 planarity 53 dual damascene 53 #.#in [004] 53 reflow soldering 53 chip resistors 53 PWBs 53 solder 53 laminate substrate 53 BGA packaging 53 FR4 53 silicon substrates 52 conductive adhesive 52 solderable 52 backplane connectors 52 5μm 52 conductive adhesives 52 wave soldering 52 indium tin oxide ITO 52 GaAs substrate 52 multilayer 52 reflow profiles 52 aluminum electrolytic capacitors 52 QSOP 52 dielectric layer 52 low k dielectrics 52 reticles 52 flex circuits 52 Fine Pitch 52 TDFN packages 52 substrate 52 Schottky diodes 52 wafer bumping 52 X7R 51 NiPdAu 51 SMA connectors 51 dielectric layers 51 interchangeable modules 51 SOIC package 51 MOS transistors 51 backplanes 51 MLCCs 51 leadless package 51 mount SMT 51 heterostructure 51 varistors 51 OPTEK 51 leadframes 51 SOI substrates 51 dielectric materials 51 capacitance values 51 SWNT 51 mounting flange 51 RF connectors 51 printed circuit 51 wafer dicing 51 PBGA 51 epitaxial layer 51 embedded passives 50 eutectic solder 50 indium gallium arsenide 50 TOSAs 50 silicon nitride 50 polycrystalline 50 reflowed 50 package SiP 50 solder alloys 50 pin SOIC packages 50 solder alloy 50 deformable mirrors 50 AlGaN 50 defect densities 50 metallisation 50 PIN photodiodes 50 pcb 50 solderability 50 stencil printing 50 reflow 50 dopants 50 conductive epoxy 50 aspheric lenses 50 overmolding 50 overmolded 50 singlemode 50 LVDS interfaces 50 SWCNT 50 solder reflow 50 mask aligners 50 wire bondable 50 nitride semiconductor 50 multilayers 50 solder spheres 50 BJTs 49 ohmic 49 X7R dielectric 49 singulation 49 SO8 49 1μm 49 extruded profiles 49 laminations 49 backplane 49 5V CMOS 49 Leadframe 49 SFP + module 49 photodiode arrays 49 antireflective coatings 49 AdvancedMC module 49 microvias 49 excellent solderability 49 pin BGA package 49 biaxial 49 SMT 49 coplanar 49 monolithically integrated 49 absorber layers 49 piezo actuators 49 preterminated 49 hermetic packaging 49 LQFP package 49 SiPs 49 collimators 49 SMT LEDs 49 Schottky 49 connectors 49 silicon substrate 49 copper metallization 49 silicon interposer 49 HBLEDs 49 chipscale 49 micro SMD package 49 multilayer printed 49 metallization 49 fiber optic transceivers 49 collets 49 Chip Scale 49 nanodots 49 thermally conductive 49 silicon 49 VCOs 49 multipin 49 interdigitated 49 Cu interconnects 49 TiN 49 microlenses 49 accuracy repeatability 49 desoldering 49 microstrip 49 thermistors 49 microelectronic packaging 49 copper interconnects 49 beryllium copper 49 pin SOIC 49 PIN photodiode 49 GaN layer 49 die bonders 49 Silicon Nitride 49 k dielectric 49 CMOS wafers 49 JESD# [002] 49 resistive element 49 dielectric constants 49 feedthroughs 49 MSOP package 49 QFN packaging 49 dimensional tolerances 49 AFM probes 49 μm thick 49 leadless 49 C0G 49 SiO 2 49 ZnSe 48 imprint lithography 48 CONNECTORS 48 flexible substrates 48 warpage 48 CMOS transistors 48 pin SOIC package 48 bypass capacitor 48 2μm 48 FinFETs 48 AdvancedMC modules 48 EUV mask 48 #.#um [001] 48 planar 48 planar magnetics 48 #.#mm# [002] 48 multichip 48 Datamate 48 termination resistors 48 DIMM 48 Backplane 48 SOIC 48 wafer probing 48 3Xnm 48 reflow oven 48 analog circuitry 48 micromachined 48 gate dielectrics 48 dimensionally stable 48 intermetallic 48 CMOS fabrication 48 backside metallization 48 reflow solder 48 Resistive 48 pinouts 48 voltage dividers 48 dielectric etch 48 Mosfets 48 silicon germanium SiGe 48 ASICs FPGAs 48 #.#x#.#mm 48 DIN rails 48 wafer thickness 48 optical transceiver modules 48 polyimide 48 uniaxial 48 TSSOP packages 48 conformal coating 48 matte tin 48 carbides 48 mm BGA 48 flanges 48 thermo mechanical 48 ferrule 48 surface mountable 48 threaded fasteners 48 busbars 48 beamsplitters 48 Wafer Level 48 gasketing 48 eWLB 48 advanced leadframe 48 bonders 48 amorphous silicon Si 48 toolholders 48 8kV 48 silicide 48 resistor arrays 48 SFP + transceivers 48 photomultipliers 48 decoupling capacitors 48 Schottky diode 48 SOI wafer 48 SOIC packages 48 HASL 48 DIN rail mount 48 QFN package 48 CAN transceiver 48 wirewound 48 ohmic contacts 48 wafer metrology 48 microswitches 48 μm 48 polymer matrices 48 subrack 48 MAX# integrates 48 TSSOP package 48 SiC substrates 48 radial leaded 48 piezoelectric ceramic 48 capacitive sensor 47 micromirror 47 x 1mm 47 SN#C 47 stripline 47 optical encoders 47 motor windings 47 #x#mm [002] 47 optocoupler 47 RJ# connectors 47 TDFN package 47 pentacene 47 dielectric 47 PEEK OPTIMA 47 varactors 47 countersunk 47 mandrels 47 MLCC capacitors 47 SiGe bipolar 47 DIN connectors 47 detector arrays 47 #.#pF 47 SMDs 47 sub micron 47 #.#mm x [003] 47 LTPS TFT 47 self assembled monolayer 47 busbar 47 weldments 47 DIN rail mounted 47 parasitic inductance 47 SFP modules 47 epi wafers 47 graphene layers 47 #x# mm [004] 47 multilayer ceramic 47 SAC# 47 optical isolators 47 LiNbO3 47 K dielectrics 47 HV# [001] 47 thermosets 47 cylindrical roller bearings 47 thinner wafers 47 photodiode 47 TQFN 47 DIN rail 47 #.#mm x #.#mm [003] 47 TQFP packages 47 GaN wafers 47 capacitive touch sensor 47 AlN layer 47 subminiature 47 nMOS 47 ferrules 47 backshells 47 strain gage 47 rigid substrates 47 electroplated 47 PCB fabricators 47 pearlite 47 spiral inductors 47 discretes 47 nano imprint 47 bonder 47 NiSi 47 concentricity 47 zirconium oxide 47 X5R 47 PCB layout 47 conformal coatings 47 pMOS 47 x 9mm 47 XMD MSA 47 AlN 47 AlGaAs 47 capacitive loading 47 superior heat dissipation 47 glass substrate 47 shaft diameters 47 impedance matching 47 Gallium Arsenide 47 silicon Si 47 #mm ² [001] 47 μm diameter 47 reflow temperatures 47 planarization 47 RoHs compliant 47 indenter 47 geometries 47 SPDT switch 47 nm CMOS 47 passivated 47 TSSOP 47 RF Microwave 47 AlSiC 47 8mm diameter 47 FFC FPC 47 epoxy matrix 47 tensile modulus 47 cored wire 47 SFP transceivers 47 boards PCBs 47 GaAs gallium arsenide 47 thermally constrained 47 PIN diodes 47 DFN# 47 SOIC 8 47 indium gallium phosphide InGaP 47 APTIV film 47 microfabricated 47 ferrite 46 bypass capacitors 46 transparent conductive coatings 46 chip inductors 46 #pF [001] 46 TO #AB 46 CMP consumables 46 MicroTCA chassis 46 5mm x 6mm 46 #x# mm [003] 46 aluminum nitride 46 CMOS logic 46 phototransistor 46 CIGS solar cells 46 ceramic sleeve 46 coaxially 46 Sn Pb 46 #.# micron node 46 SiO2 46 XFP module 46 ownership CoO 46 heat spreaders 46 tin whisker 46 Ohm impedance 46 #μF [001] 46 #.#μm [001] 46 TQFP package 46 glass frit 46 #.#mm x #.#mm [002] 46 epoxies 46 Formex GK 46 silicone elastomers 46 Polycrystalline 46 #.#V voltage 46 CMOS circuits 46 mounting flanges 46 #nm #nm [005] 46 modular conveyors 46 crystal resonator 46 SiT# 46 zener diodes 46 Agilent Medalist 46 circular connectors 46 piezoceramic 46 CMOS IC 46 flex rigid 46 impedances 46 tin whiskers 46 Mini DIMMs 46 elastomeric 46 pin BGA 46 VESA mounting 46 indium tin oxide 46 SiP 46 DB9 connector 46 photonic crystal fibers 46 #pin [001] 46 measuring #.#mm x [001] 46 electrically conductive 46 ENIG 46 GaAs MMIC 46 poly crystalline 46 QSFP 46 compressive stress 46 DDR3 DIMMs 46 SAW oscillators 46 backplane traces 46 EMI RFI shielding 46 dopant 46 inductors 46 varistor 46 rollstock 46 electromigration 46 multilayer ceramic capacitors 46 electromechanical relays 46 multichip modules 46 PICMG specification 46 tantalum capacitor 46 Vor ink 46 coextrusion 46 amorphous silicon 46 thermoplastic materials 46 SFP transceiver 46 torque wrenches 46 Structured ASICs 46 wafer thinning 46 electroless nickel 46 hafnium oxide 46 OP# [003] 46 HDI PCBs 46 #AWG 46 wafer uniformity 46 voltage MOSFET 46 capacitors 46 Epitaxial 46 bilayers 46 silicon oxide 46 variable resistor 46 flux residues 46 5mm x 5mm 46 countersink 46 fusion splicers 46 CAN transceivers 46 selective soldering 46 peening 46 phototransistors 46 MWNT 46 InGaAs 46 solder paste printing 46 wafer prober 46 EUV masks 46 antireflection coatings 46 bandgaps 46 capacitive loads 46 #.#μ 46 isotropic 46 coated polyester 46 tighter tolerances 46 oxide layer 46 voltage MOSFETs 46 #.#mm [002] 46 Mbit MRAM 46 SAC alloys 46 submicron 46 TFTs 46 adhesive bonding 46 RGB pixels 46 ZIF 46 OptoCooler 46 SOI CMOS 46 lithographic processes 46 crystallinity 46 OTDRs 46 SECS GEM 46 Reflow 46 quartz oscillators 46 eWLB technology 46 hardfacing 46 potentiometers 46 photoresists 46 8mm x 8mm 46 sol gel 46 ceramic powders 46 TGA# SM 46 geometries shrink 46 DIP switches 46 Leadless 46 Multilayer 46 receptacle connector 46 wafer 46 FinFET 46 photolithographic 46 nanoimprint 46 diplexers 46 #.#mm diameter [002] 46 piezo ceramic 46 indium phosphide InP 45 Silicon Via TSV 45 2Xnm 45 output capacitors 45 toroidal transformers 45 threshold voltages 45 Integrated Circuits ICs 45 low k dielectric 45 transconductance 45 InGaN 45 superlattice 45 mm ² 45 SOT# package [001] 45 nanochannels 45 Silicon Germanium 45 feedthrough 45 VME#x 45 GaAs MESFET 45 boundary scan 45 SOI wafers 45 Amorphous silicon 45 M# connectors 45 flux cored wires 45 #nm #nm [002] 45 MESFET 45 aluminum fins 45 e beam lithography 45 LQFP 45 aluminum heatsink 45 InAs 45 spherical bearings 45 wafer probers 45 micrometre scale 45 deep submicron 45 CMOS circuitry 45 electroformed 45 SMEMA 45 silicone encapsulation 45 multiaxis 45 #mm# [001] 45 quickturn 45 epiwafers 45 weldability 45 BEOL 45 3D TSV 45 QSFP + 45 PQFN 45 tolerancing 45 Xilinx FPGA 45 lattice mismatch 45 flux cored 45 cemented carbides 45 solderless 45 Nanowires 45 IC substrate 45 co planarity 45 toolholder 45 IPMs 45 Si substrates 45 AEC Q# automotive 45 +# ° C. [001] 45 dc dc converters 45 lithographic patterning 45 5mm x 45 nitride 45 polymeric 45 extrudate 45 JFET 45 slitter rewinders 45 thermowell 45 #L stainless steel 45 MIL PRF 45 DIMM modules 45 MEMS oscillators 45 input capacitance 45 amorphous silicon PV 45 Photolithography 45 electroless 45 polycrystalline diamond 45 pin BGA packages 45 tantalum capacitors 45 ultrasonic transducers 45 DFN package 45 UVTP 45 nm CMOS process 45 projected capacitive touch 45 conductive plastics 45 waveguides 45 reed switches 45 CMOS wafer 45 AirMax VS 45 shrinking geometries 45 colloidal crystals 45 Schottky rectifiers 45 FusionQuad 45 #.#uF 45 DFN packages 45 Agilent B#A 45 TOSA ROSA 45 PC/# PC/#-Plus 45 bending radii 45 tribological 45 Cadmium Telluride CdTe 45 twinax 45 UL #V 0 45 boron nitride 45 numerical aperture 45 High Density Interconnect 45 microfabrication techniques 45 Picogiga delivers advanced 45 UNCD 45 nanocrystalline 45 subwavelength 45 fused quartz 45 Compact PCI 45 epitaxial layers 45 MAX# MAX# [001] 45 GaAs pHEMT 45 #μm thick [002] 45 intermetallic compounds 45 MWNTs 45 mechanical polishing CMP 45 #kHz switching frequency 45 #mm# [002] 45 conductive inks 45 breakdown voltages 45 ROHS compliant 45 germanium substrates 45 HEMTs 45 chamfering 45 SOI substrate 45 #.# micron CMOS 45 organic TFTs 45 copper nanorods 45 wirewound resistors 45 Inconel 45 workpieces 45 #x#mm package 45 rigid substrate 45 #G DPSK 45 density fiberboard 45 laser micromachining 45 x 3mm 45 delaminations 45 mil spec 45 ZnS 45 magnetically coupled 45 IP# sealing 45 TQFP# 45 UV stabilized 45 linewidths 45 Wafer Level Chip 45 input impedance 45 ESD protection 45 #nm immersion lithography 45 sapphire substrate 45 Mil PRF # 45 Inductors 45 cordsets 45 poly Si 45 3mm x 45 monolayer 45 tin oxide 45 HfSiON 45 PC/# 45 crystalline Si 45 Samtec 45 #mm diameter [001] 45 galvanic corrosion 45 SchmartBoard 45 delaminate 45 MLCC 45 Rapid prototyping 45 valve manifolds 45 VCSELs 45 brazed 45 integrated passives 45 diameter wafers 45 connectorized 45 nanometer scale 44 #x# mm QFN 44 nitrided 44 UltraFLEX 44 MIL DTL # 44 conductively cooled 44 CdSe 44 backplane connector 44 x 5mm 44 microcavity 44 firestop 44 FEOL 44 soldering 44 electrodeposition 44 Josephson junction 44 op amps 44 transistor arrays 44 mandrel 44 pneumatically actuated 44 ferrite core 44 indium arsenide 44 CIGS cells 44 epitaxial structures 44 crystal lattices 44 thermal impedance 44 exacting tolerances 44 mosfet 44 HTS wires 44 piston pumps 44 8 pin MSOP 44 sintered 44 polarizers 44 UL#V 0 rated 44 SMA connector 44 optical waveguides 44 platens 44 wafer foundries 44 microtubes 44 formability 44 pore sizes 44 3U VPX 44 impedance mismatches 44 fusible 44 Kinsus 44 micromachining 44 parasitic capacitance 44 Metallization 44 SOT# [001] 44 ARM#EJ processor 44 pipe diameters 44 reflow solderable 44 monolithic microwave integrated 44 weldable 44 #nm immersion 44 corrugation 44 piezoelectric actuators 44 pin TQFP 44 MAX#E 44 silicon nanocrystals 44 paramagnetic 44 optical coatings 44 passivation layer 44 tensile stress 44 OSAT 44 Injection molding 44 PQFN package 44 EMI Filters 44 controller ICs 44 COMs 44 LED binning 44 microfluidic chips 44 μTCA 44 strontium titanate 44 DongbuAnam 44 GaN substrates 44 DVI cables 44 compressive stresses 44 Multilayer Ceramic 44 axial leaded 44 U#A [002] 44 Printed Circuit Board 44 PZT 44 digital potentiometers 44 Automated Optical 44 Land Grid Array 44 GMAW 44 PX# [003] 44 1mm x 1mm 44 sapphire wafers 44 #Ω [002] 44 tensile strengths 44 thermomechanical 44 conductive coating 44 polymethyl methacrylate PMMA 44 ceramic capacitor 44 MEMS resonators 44 anneal 44 graphene sheets 44 anodic 44 Laser diodes 44 inductive sensors 44 PHEMT 44 dipole antennas 44 Cable Assemblies 44 photonic devices 44 photopolymer 44 F#x [001] 44 oxide semiconductor 44 LSA#A 44 submerged arc welding 44 nm node 44 PaxScan 44 di selenide CIGS 44 RoHS compliance 44 defectivity 44 CEMs 44 monochromator 44 wafer bonding 44 Agilent U#A 44 C4NP 44 5kV 44 multilayer ceramic capacitors MLCC 44 capacitance 44 4Gbit 44 Beralcast R 44 diameters 44 GaN layers 44 injection molded parts 44 nm lithography 44 ammeters 44 optoelectronic packaging 44 liquid crystal polymer 44 inductance 44 epitaxy 44 thermally enhanced 44 nano patterning 44 YBCO 44 Printed circuit 44 thermoplastic elastomer 44 magnetron sputtering 44 leadless packages 44 Potentiometer 44 nanometer node 44 4 x 4mm 44 regrind 44 aramid fibers 44 serial EEPROMs 44 RJ# connector 44 nm nodes 44 zinc oxide ZnO 44 thermally activated 44 #bit MCUs 44 superabrasives 44 colloidal silica 44 gate electrode 44 windings 44 3U CompactPCI 44 3mm x 3mm 44 silicon crystals 44 capacitor 44 mount inductors 44 receptacle connectors 44 titanium carbide 44 inductance values 44 encapsulants 44 reflow soldering processes 44 servomotor 44 digitisers 44 magnetostrictive 44 microfine 44 wafer bonder 44 thermoform 44 4mA 44 UV NIL 44 conductivities 44 Si TFT 44 gate dielectric 44 XENPAK 44 lens tints 44 GaAs 44 dielectric strength 44 VPX REDI 44 plasma cutters 44 PVD coating 44 thermocouple 44 pin TSSOP package 44 barium titanate 44 polydimethylsiloxane PDMS 44 bend radii 44 workholding 44 MOS transistor 44 SAW filter 44 silicon foundries 44 TMP# 44 rigid foam insulation 44 pin QFN 44 ceramic substrate 44 Soldering 44 copper heatpipes 44 #Ω [001] 44 CVD etch 44 bilayer 44 6mm diameter 44 hydrophobic surfaces 44 ZnO 44 RoHS compliant 44 machined 44 heat shrinkable tubing 44 UHMW 43 silicon wafer 43 conduction cooling 43 aluminum electrolytic 43 spindle speeds 43 laser annealing 43 Gallium Arsenide GaAs 43 bandgap 43 dielectric thickness 43 Wafer Level Packaging 43 Pseudo SRAM 43 silica spheres 43 sensor actuator 43 TFPV 43 ferro electric 43 SMD LED 43 capillary tubing 43 nickel silicide 43 DrMOS 43 Foundation fieldbus 43 triplexer 43 optically transparent 43 ballscrews 43 nano imprint lithography 43 micromirrors 43 bulk solids 43 injection molding extrusion 43 pre pregs 43 pin TQFP packages 43 pluggable transceiver 43 Printed Circuit Boards 43 #.#μF 43 impedance 43 rovings 43 micro inverters 43 thermoset composites 43 nonvolatile memories 43 PEDOT 43 nucleation layer 43 resistors capacitors 43 composite laminates