Ball Grid Array

Related by string. * balled . baller . BALL . balling . balls : Secretary Ed Balls . secretary Ed Balls . Super Monkey Ball . Mega Ball number . ping pong balls / GRID . Gris . GRI . grid . gris : Smart Grid Demonstration . smart grid . Vincent Grier . Smart Grid . Renew Grid / arrayed . Arrays . Arrayed . ARRAY . arraying : generating solar arrays . Wi Fi Array . storage arrays . = Array . Very Large Array * *

Related by context. All words. (Click for frequent words.) 75 Flip Chip 70 8mm x 8mm 70 Fine Pitch 69 PQFP 69 BGA packages 68 #.#mm x #.#mm [003] 67 BGA package 67 x 3mm 67 BGA packaging 67 pin MLF 67 FBGA package 67 #.#x#.#mm 67 leadless package 66 WL CSP 66 5mm x 5mm 66 SOIC 8 66 eWLB 66 pin LQFP 66 #x#mm [002] 66 QFN 66 surface mountable 66 #x# mm [004] 66 3mm x 66 #x# mm [003] 66 x 9mm 66 #.#mm x [003] 66 Leadless 66 QSOP 66 7mm x 7mm 66 WLCSP 66 TQFP 65 pin TQFP 65 4mm x 4mm 65 Land Grid Array 65 2mm x 2mm 65 4 x 4mm 65 QFN# 65 4mm x 65 pin 5mm x 65 3mm x 3mm 64 TQFP packages 64 TQFN 64 8 pin MSOP 64 6mm x 6mm 64 FBGA packages 64 SSOP packages 64 Chip Scale 64 5mm x 5mm QFN 64 Wafer Level 64 #.# micron CMOS 64 #.#mm x #.#mm [002] 64 4mm x 4mm QFN 64 Cable Assemblies 64 QFN packages 64 5mm x 64 leadless 64 #x#mm QFN 64 pin SOIC 64 x 1mm 64 3 x 3mm 63 #pin [001] 63 8 pin SOIC 63 8 pin TDFN 63 LQFP package 63 x #.#mm [005] 63 tiny 3mm x 63 pin BGA 63 pin 3mm x 63 DFN# 63 #x#mm [004] 63 BGA CSP 63 DFN packages 63 pin QFN 63 Quad Flat 63 TDFN package 63 pin PDIP 62 DirectFET 62 tiny 2mm x 62 TDFN packages 62 QFPs 62 5mm x 6mm 62 6 pin SOT 62 TDFN 62 pin BGA package 62 monolithically integrated 62 pin TSSOP 62 TSSOP 62 DPAK 62 6mm x 62 Wafer Level Chip 62 nm CMOS process 62 x 5mm 62 2mm x 62 SOT# [001] 62 measuring #.#mm x [001] 62 Industry Highest Density 62 #x# mm QFN 62 PQFN 62 TQFP# 62 pin QFN package 62 mm BGA 61 #mm x #mm [001] 61 SODIMM 61 micro SMD package 61 radial leaded 61 TQFP package 61 7 x 7mm 61 MicroFET 61 pin DIP 61 SO8 61 wirebond 61 PIN photodiodes 61 4mm thick 61 pin TSOP 61 SMT LEDs 61 solder bumps 61 PBGA 61 pin TQFN 61 Leadframe 61 pin LQFP package 61 monolithic CMOS 61 x #.#mm [003] 61 SOP Advance 61 wafer dicing 61 package SiP 61 #mm ² [002] 61 subrack 61 #.#mm x #.#mm x [002] 61 ISL#M 61 mount SMT 60 interposers 60 leadframe 60 powerline modem 60 embedded Wafer Level 60 SOIC packages 60 LQFP 60 x 8mm 60 InGaP HBT 60 CS# [002] 60 lead LFCSP 60 #.#um [001] 60 ARM#EJ processor 60 #um [002] 60 wafer bumping 60 5mm x 6mm x 60 TO #AB 60 MSOP packages 60 optical transceiver modules 60 SOI CMOS 60 LQFP packages 60 LFCSP 60 interposer 60 QMEMS 60 LQFP# [002] 60 pin TQFN package 60 2μm 60 mux demux 60 subminiature 60 #mm# [002] 60 TSSOP packages 60 #um [001] 60 SOT# [002] 60 QFNs 60 5mm QFN package 60 LQFP# [001] 60 Ultra Miniature 59 through silicon vias 59 3mm x 3mm DFN 59 Mini ITX Motherboard 59 Fanless 59 chipscale 59 parasitic inductance 59 SO DIMM 59 #mm x #.#mm [002] 59 FBGA 59 VCXO 59 Silicon Germanium 59 thermally enhanced 59 QFN package 59 ZMD# 59 MI #XM 59 PQFN package 59 SOIC package 59 NAND Flash Memory 59 PowerDI TM 59 Arria GX FPGAs 59 7mm x 59 Bump Adapters 59 #.#um CMOS 59 #mm ² [001] 59 Altera Stratix III 59 Industry Smallest 59 triplexer 59 MICRO FOOT 59 C0G 59 advanced leadframe 59 pin SOT 59 TOSAs 59 #μm [002] 59 #x#x#.#mm [003] 59 #.#μm [001] 59 5V CMOS 59 ATmega#P [001] 59 pin QFP 59 3mm DFN package 59 DrMOS 59 PBGA package 59 SOI substrates 59 Schottky diode 59 SiT# 59 GX# [003] 59 Schottky diodes 59 Oxide Silicon 58 MMA#L 58 x 6mm 58 Backplane 58 Compact PCI 58 × #mm [002] 58 #x#x#.# mm 58 eWLB technology 58 FPC connector 58 TFBGA 58 AL# [001] 58 Datamate 58 ATtiny# 58 x 2mm 58 CMOS Image Sensors 58 pin MSOP 58 UMC #.#um 58 1mm x 1mm 58 iSPAN 58 SOIC 58 pin 4mm x 58 Multilayer Ceramic 58 #μm [001] 58 Highly Integrated 58 Fusion Splicer 58 CX# [001] 58 laser diode modules 58 Silicon Oxide Nitride 58 AEL# 58 SiPs 58 EMIF# 58 iSSD 58 TDA# [001] 58 transceiver module 58 pin QFN packages 58 #x#mm package 58 Serial EEPROM 58 pin BGA packages 58 Mbit SRAMs 58 CONNECTORS 58 indium gallium phosphide InGaP 58 multichip 58 bonder 58 pin PBGA 58 X7R 58 high voltage BCDMOS 58 CMOS Image Sensor 58 nanometer CMOS 58 MOSFETS 58 tiny #.#mm x 58 pin SOIC packages 58 CMOS logic 58 RFX# 58 pMOS 58 SPDT switch 58 Scale Package 58 RFCMOS 58 transceiver IC 58 Package PoP 58 LiNbO3 58 FusionQuad 58 pin #x#mm 58 3mm thick 58 2mm x #.#mm 58 Intel LGA# [001] 58 #nm CMOS [002] 58 4Gb Fibre Channel 58 #mm x #mm [007] 58 Z Foil 58 DDR2 memory controller 58 TCXO 58 MicroLeadFrame 58 QSFP 57 TrueStore 57 #x#mm QFN package 57 STB# [002] 57 array BGA 57 Micro DIMM 57 diode arrays 57 PowerPAK 57 aluminum nitride 57 #GbE switches 57 CY#C# 57 #.#pF 57 InGaP 57 multilayer ceramic 57 #.#μm [002] 57 #.#mm thick [002] 57 Metrology System 57 IGBT Insulated Gate 57 capacitances 57 capacitive touch sensor 57 Altera FPGAs 57 Form Factor SFF 57 Sequans SQN# 57 pin TDFN package 57 #x#mm [003] 57 3 mm DFN 57 PHY# [001] 57 interchangeable modules 57 Thinlam 57 wire bondable 57 pHEMT 57 Form factor Pluggable 57 3mm x 3mm x 57 CoolMOS 57 QFN# package 57 ESD Protection 57 ISL#E [002] 57 Laser Modules 57 epiwafers 57 FCBGA 57 epi wafers 57 ROHS compliant 57 LMX# 57 TQFN package 57 compact #x#mm 57 SO DIMM memory 57 TC#XBG 57 VME#x 57 #.#μ 57 SMA connectors 57 millimeter mm 57 emitting lasers 57 AEC Q# qualified 57 2mm x 3mm DFN 57 Tunable 57 4GB DDR3 57 micromachined 57 DFN package 57 CAN transceiver 57 SOT# package [002] 57 LED UV curing 57 #Msps [002] 57 PE# [001] 57 Inductors 57 XC# [002] 57 #GbE switch 57 CMOS transistors 57 mm × 57 DirectFET MOSFET 57 #Mx# [001] 57 TrenchFET 57 tantalum capacitors 57 1Gbit DDR2 57 XR#M# 57 pin SSOP 57 BiCMOS 57 Demodulator 57 Structured ASICs 57 factor pluggable 57 VIISta 57 crystal resonator 57 Indium Phosphide InP 57 HEMT 57 EP#S# 57 Reaper HPC 57 backplane connector 57 4GB DDR3 #MHz 57 DC Converters 57 #nm CMOS [001] 57 3U rack mount 57 ACPL #J 57 SFP + modules 57 VESA mounting 57 fiber optic transceivers 57 MirrorBit NOR 57 voltage CMOS 57 GaAs InP 57 #nm 1Gb 57 TVS Diodes 57 nm CMOS 57 low capacitance ESD 57 copper metallization 57 Complementary Metal Oxide Semiconductor 57 AVR microcontrollers 57 #nm silicon 57 #.#in [004] 57 Toshiba Develops 57 SATA SSDs 57 XD# [001] 56 5μm 56 ATR# [002] 56 Metallization 56 Wafer Level Packaging 56 Nanometer 56 imprint lithography 56 Form Factor Pluggable 56 FinFETs 56 overmolded 56 Serial EEPROMs 56 RFID inlay 56 MxL#SF 56 Stratix III FPGAs 56 SiGe bipolar 56 pin LFCSP 56 6U VPX 56 GaAs pHEMT 56 GaAs MMIC 56 4U chassis 56 EMI Filters 56 InfiniBand DDR 56 pin SOIC package 56 pin SSOP package 56 NANDrive 56 #μm thick [002] 56 mm QFN 56 Crystal Oscillator 56 Signal Conditioning 56 #mm x 56 MSA transponders 56 TLP# 56 CMOS fabrication 56 X5R 56 ECOPACK 56 HMC#LP#E 56 GDM# 56 OCXO 56 backplane connectors 56 Cree GaN 56 PHEMT 56 hermetically sealed ceramic 56 SOT# package [001] 56 TDA# [002] 56 #mm# [001] 56 #Mbit [002] 56 3mm DFN 56 daughtercards 56 R8C/Tiny 56 CameraChip 56 Varistors 56 laterally diffused metal 56 pin TQFP package 56 Stratix IV FPGA 56 SO8 package 56 TSSOP# 56 Mini ITX motherboard 56 photodetectors 56 #mm x #mm [005] 56 IXP# [002] 56 TGA# SM 56 indium phosphide InP 56 HCS# 56 inductive sensors 56 MB#Q# 56 VME VXS 56 #x#x#mm [001] 56 #μF [001] 56 PIN photodiode 56 DDR2 SODIMM 56 High Linearity 56 aluminum housings 56 ARM9 core 56 CMOS Silicon 56 Schottky rectifiers 56 Virtex 5 56 pin TSSOP package 56 optocoupler 56 Epitaxial 56 1mm thick 56 leadframes 56 mm ² 56 pin SOT# 56 Intel #GME 56 #GBASE KR 56 OP# [003] 56 Kilopass XPM 56 Gallium Nitride 56 MIM capacitors 56 OCTEON Plus 56 QFP package 56 Xilinx FPGA 56 AlSiC 56 density interconnect HDI 56 SMARTMOS 56 #.#μm CMOS process 56 #GbE SFP + 56 port #GBASE T 56 transistor HEMT 56 SKY# #LF 56 defect densities 56 RJ# connector 56 MAX# MAX# [001] 56 capacitance values 56 STV# 56 pin TQFP packages 56 Tsi#A 56 NLP# [001] 56 PLL synthesizer 56 Insulator SOI 56 silicon oxynitride 55 LSISAS# 6Gb s 55 IR#S 55 XPort# 55 copper interconnects 55 Samsung Develops 55 3U VPX 55 linewidths 55 ARM#T 55 singulated 55 poly crystalline 55 HEMTs 55 DDR2 DRAM 55 underfill 55 PCI Express Gigabit Ethernet 55 zirconium oxide 55 Mbit SRAM 55 OC-#/STM-# [001] 55 ATmega#P [002] 55 phototransistors 55 silicon germanium SiGe 55 QFN packaging 55 #nm Process 55 Agilent Technologies Introduces 55 RoHs compliant 55 MLCCs 55 IXP# [001] 55 solderable 55 Mixed Signal IC 55 HV# [001] 55 QSFP + 55 heat spreaders 55 photomultipliers 55 Impinj AEON 55 AQ# [001] 55 3mm x 3mm QFN 55 #.#μm CMOS 55 2mm x 2mm DFN 55 #.#mm x [002] 55 connectorized 55 ESD protection 55 Mach Zehnder modulator 55 Power Amplifiers 55 bipolar transistors 55 Optical Transceiver 55 Load Cell 55 #.#x#.# 55 mosfets 55 Flex OneNAND 55 MD# [004] 55 Laser Diode Driver 55 SSOP 55 multilayer ceramic capacitors MLCC 55 1RU rack 55 Ethernet GbE 55 solder bumping 55 OPTIMASS 55 SP#E 55 SFP transceiver 55 fxP 55 Universal Asynchronous Receiver 55 XtremeDSP TM 55 mm x 55 ASICs FPGAs 55 optically coupled 55 LVDS interfaces 55 PaxScan 55 STLC# 55 HV# [003] 55 Backplanes 55 MirrorBit R 55 GX FPGAs 55 laser annealing 55 IGBT modules 55 Stratix II 55 TAS# [001] 55 conductively cooled 55 transceiver modules 55 QT# [001] 55 SFP transceivers 55 MS# [003] 55 MCS# 55 PowerPAK SO 8 55 MSOP package 55 RF connectors 55 RDS ON 55 chip resistors 55 5mm thick 55 Powerful debug 55 XFP module 55 #x#x# mm [001] 55 TSSOP package 55 sq. mm 55 SAW oscillators 55 flange mount 55 4Mbit 55 ETX module 55 PCM# [002] 55 singlemode 55 3Xnm 55 D2PAK 55 fully synthesizable 55 nm wavelengths 55 mm QFN package 55 Silicon Nitride 55 #Gbps Ethernet switch 55 Wafer Scale 55 input capacitance 55 #.#uF 55 GGL# 55 bump micro SMD 55 ferrite beads 55 #Kbyte [001] 55 Austriamicrosystems 55 JEDEC compliant 55 PolarPro 55 Optocoupler 55 WinPath3 55 leadless chip 55 VCXOs 55 MICRF# 55 MAX# integrates 55 PWBs 55 OptoCooler HV# 55 E pHEMT 55 LSI TrueStore 55 GaAs MESFET 55 Schottky Diodes 55 #.#mm x #.#mm x [003] 55 tunable XFP 55 BGAs 55 CdTe Si 55 TLV#AIC# 55 High Voltage CMOS 55 #μF [002] 55 Application Specific Integrated Circuits 55 SiON 55 VCSELs 55 ASML TWINSCAN 55 Bluetooth transceiver 55 Xenpak 55 ISL#E [001] 55 MB#R# 55 SiR#DP 55 Non Volatile 55 Quik Pak 55 Muxponder 55 MLC NAND Flash 55 Availability Samples 55 1GB DDR2 54 Zener diodes 54 layer ceramic capacitor 54 iCoupler 54 #GBASE SR 54 NCV# 54 XENPAK 54 pin QFP package 54 MV# [003] 54 AirMax VS 54 varactors 54 monitor photodiode 54 HMC# [001] 54 electron mobility 54 TFT LCD module 54 HVIC 54 Single Wafer 54 SDRAMs 54 wafer bonder 54 #.#mm [002] 54 BigIron MG8 54 thyristor 54 nMOS 54 GaN transistor 54 nm SOI 54 SOI substrate 54 #nm #nm [002] 54 Mini ITX motherboards 54 #MSPS 54 optical waveguide 54 #Mx# [002] 54 Gallium Arsenide 54 photolithographic 54 CMOS wafer 54 Imprio 54 TOSA ROSA 54 uPD# [001] 54 PowerBook G4 #mb SO 54 EoS 54 8GB DDR2 54 thermal dissipation 54 SODIMMs 54 DIN rail mounted 54 rack mountable 1U 54 coaxial connectors 54 aluminum electrolytic capacitors 54 DIN rail mounting 54 TJA# 54 axial leaded 54 XMD MSA 54 Bulk Metal 54 Polycrystalline 54 transimpedance amplifier 54 Photolithography 54 x 7mm 54 gigabit Gb NAND flash 54 ZigBee modules 54 TRF# [002] 54 TEA# 54 VIISta HC 54 Flash microcontroller 54 Conduction Cooled 54 mm LFCSP 54 Serial Flash 54 #pF [001] 54 magnetic encoders 54 epitaxial wafers 54 #.#V CMOS 54 MB#C# [001] 54 Power MOSFETs 54 MCP#X 54 PIN diodes 54 Embedded Processor 54 Pseudo SRAM 54 AFBR 54 hydride vapor phase 54 Dell PowerEdge Dual Core 54 SiliconDrive II 54 Explosion Proof 54 #nm DRAM 54 magnetostrictive 54 LTPS TFT 54 DIMM modules 54 1Mbit 54 #G DQPSK 54 ferrite core 54 UD5 54 DDR3 DIMMs 54 Lynx2 54 PIC#F#J# MCU 54 TPC# H 54 Laminator 54 Tsi# 54 photodiode array 54 dsPIC#F# 54 packaging WLP 54 fused quartz 54 millisecond annealing 54 TSOT 54 micro machining 54 SHELLCASE 54 Laser Marking 54 reflow soldering 54 2Gbit 54 Laser Diode 54 PHY transceiver 54 VCOs 54 PMOS transistors 54 MLCC capacitors 54 On Insulator SOI 54 Nova NanoSEM 54 crystalline Si 54 Ultra Dense 54 hi rel 54 NCP# [002] 54 midspans 54 SFP + optical 54 conduction cooled 54 SFP + transceivers 54 thermally enhanced TSSOP 54 Polyester Film 54 photodetector 54 AMD Geode GX 54 #.#mm x [001] 54 photodiode 54 Package SiP 54 CMOS compatible 54 Stratix II FPGAs 54 overmolding 54 planarization 54 vertical cavity 54 4Gbit 54 Optical Modulator 54 JFET 54 CIGS Copper Indium 54 wavelength tunability 54 Flash microcontrollers 54 Silicon Optix Realta HQV 54 oxide semiconductor 54 Processor Cores 54 LVDS interface 54 CPC# [001] 54 silicon MEMS 54 LC connectors 54 TPCA# H 54 CMOS circuits 54 Injection molded 54 CMOS RF transceiver 54 Ethernet AVB 54 Low Leakage 54 PAM# [002] 54 Op Amps 54 Hastelloy C 54 VPX REDI 54 Optical Switch 54 RoHS Compliant 54 SAS RAID 54 daughterboard 54 TM# [002] 54 serial EEPROMs 54 ML#Q# 54 #nm laser [001] 54 LPDDR 54 AdvancedMC module 54 FCBGA package 54 #Kbyte [002] 54 Kontron CP# [002] 54 Heatsink 54 Gallium Arsenide GaAs 54 Measuring #mm [002] 54 solder bump 54 bipolar CMOS DMOS 54 8G FC 54 AKU# 54 capacitors inductors 54 MCF# 54 SFP modules 54 polyethylene fiber 54 SiC substrates 54 .# micron 54 pin leadless 54 k dielectric 54 TiN 54 RF amplifier 54 BiFET 54 TVP# 54 monolithic microwave integrated 54 ARM#EJ S 54 Silicon Via TSV 54 bandpass filters 54 wafer 54 Schottky 54 STw# 54 IxYukon 54 photocoupler 54 #mm x #mm x 54 low k dielectrics 53 S#E [003] 53 Mindspeed Transcede 53 ADN# 53 sensing resistor 53 silicon oscillators 53 metallisation 53 ZnSe 53 8Gbit 53 MSC# [001] 53 SiP 53 Freescale MPC# 53 DAC# 53 Clearview xPAK 53 Procelerant 53 Efficeon TM# 53 baseband IC 53 wirewound 53 kbit 53 amplifier modules 53 RF Microwave 53 PicoGuard 53 stereo CODEC 53 MB#K# 53 varistors 53 dielectrics 53 amplifiers EDFAs 53 nitride semiconductor 53 DC DC CONVERTERS 53 MLPQ package 53 thermal impedance 53 #nm wavelength [001] 53 multichip package 53 Inductor 53 Coldfire 53 micromirror 53 ADV# [001] 53 conductive epoxy 53 MLC NAND flash 53 #V MOSFETs [002] 53 #.#um [002] 53 3U CompactPCI 53 CompactPCI ® 53 PowerPAK SC 53 GbE switches 53 Stepper Motor 53 OptiMOS 53 #.#mm# [001] 53 micron 53 nickel hydroxide 53 2Gb DDR3 53 FLCOS 53 transistor arrays 53 Patch Panels 53 CIGS copper indium 53 XR#V# [002] 53 Plasmonic 53 TI OMAP#x 53 Kbit 53 IO Accelerator 53 ultrasmall 53 XWAY 53 Gallium arsenide 53 liquid crystal polymer 53 Registered DIMM 53 Altera Stratix IV 53 #Kbytes [001] 53 XR#V# [001] 53 SODIMM socket 53 Attenuator 53 X7R dielectric 53 #LP [002] 53 tuner IC 53 Multimode 53 Gb NAND 53 nano patterning 53 #GBASE T PHY 53 TFTs 53 RFR# 53 TMS#C#x 53 MAX#E 53 analog circuitry 53 #x#x#mm [002] 53 Double Sided 53 OSTAR ® 53 Solid Capacitors 53 #G transceiver 53 LMV# 53 Structured eASIC 53 Solamet ® 53 Chip Resistors 53 CMOS imager 53 QFP 53 SFP + module 53 magnetic encoder 53 Broadcom BCM# [001] 53 Multilayer 53 MEMS microphone 53 voltage MOSFET 53 #ksps 53 AT#C# [002] 53 ETXexpress 53 Intel PXA#x 53 heatspreaders 53 stripline 53 Si#DP 53 Ultra Low Voltage 53 Vishay Siliconix 53 integrated passives 53 transistor pHEMT 53 QLP 53 SnPb 53 hermetic packaging 53 CMOS IC 53 LSI 3ware 53 LTPS TFT LCD 53 2Gb DDR2 53 2GB DDR 53 multi threaded CMT 53 PIN diode 53 Rugged COTS 53 PZT 53 XFP transceiver 53 FPC connectors 53 #V MOSFET [002] 53 Field Effect Transistor 53 #.#mm thickness [002] 53 NanoBridge 53 Evaluation Kits 53 silicon tuners 53 #.# micron node 53 multilayer ceramic capacitors 53 ballscrews 53 Spinpoint F3 53 SO DIMMs 53 reflow oven 53 #/#/#Base-T 53 #x#mm [005] 53 Input Voltage 53 breakdown voltages 53 HCMOS 53 coplanarity 53 NMOS 53 zener diodes 53 UCC# 53 #.#u 53 E StaX 53 Pulse Width Modulation PWM 53 XE# [001] 53 busbars 53 mask aligner 53 #MHz PXA#

Back to home page