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(Click for frequent words.) 71 CMP slurry 68 chemical mechanical planarization 66 CMP consumables 63 physical vapor deposition 62 epi wafers 62 planarization 62 photoresist strip 61 BEOL 61 thermoplastic compounds 61 micro machining 61 etch deposition 60 indium tin oxide ITO 60 CMP polishing slurries 60 semiconductive 60 Photolithography 60 copper metallization 60 electrodeposition 60 photoresists 60 nanofilm 60 mechanical polishing CMP 60 polishing slurries 60 aluminum nitride 60 fused quartz 59 micromachining 59 thermoplastic resins 59 nanoimprint lithography NIL 59 cored wire 59 electro deposition 59 wafer bonder 59 ultrasonic spray 59 diffusion furnaces 59 sintered 59 Sigma fxP 59 conformal coating 59 Chemical Mechanical Polishing 59 optical metrology 59 etchers 59 plasma etch 59 VECTOR Express 59 ZnS 59 AFM probes 59 optical coatings 59 Kuan Yin Taiwan 59 polishing pads 59 GTAW 59 plasma etching 58 Powerful debug 58 thermoplastic injection molding 58 molding compounds 58 silicone elastomers 58 passivation 58 colloidal silica 58 superabrasives 58 epitaxial wafers 58 millisecond anneal 58 Gallium Arsenide GaAs 58 transparent conductive 58 slurries 58 conformal coatings 58 SOI wafer 58 vapor deposition 58 pyrogenic silica 58 wafer dicing 58 thermosetting 58 photolithography 58 solder spheres 58 magnetron sputtering 58 SMS NIL 58 metallisation 58 oxide nanoparticles 58 fumed silica 58 nano composites 58 composite resins 57 conductive pastes 57 Chemical Mechanical Planarization 57 LiNbO3 57 Czochralski 57 Electrofill 57 Silicon Nitride 57 brightness light emitting 57 AQUANOX A# 57 photoresist stripping 57 liquid crystal polymer 57 Novellus SABRE 57 deep ultraviolet DUV 57 nanopowders 57 sapphire substrate 57 PEEK OPTIMA 57 resin infusion 57 silicide 57 layer deposition ALD 57 bicomponent 57 extruded profiles 57 solder bumping 57 zinc selenide 57 nanometal 57 reactive ion 57 SN#C 57 insulator wafers 57 silicon nitride ceramic 57 microelectronic components 57 dielectric etch 57 gelcoats 57 AlSiC 57 Atotech 57 GER SMH leading 57 thermoplastic polyurethane TPU 57 Cabot Microelectronics 57 CMP polishing 57 polymer formulations 57 solder bump 57 liquid silicone rubber 57 gasketing 57 transparent conductive coatings 57 Silicon Germanium 57 EUV masks 56 Selective Laser Sintering SLS 56 laser scribing 56 Organic Chemical Vapor 56 PEEK polymer 56 copper indium diselenide 56 CdSe 56 dielectric layers 56 thermoplastic elastomer 56 coatings inks 56 thermosetting resins 56 precision metrology 56 nano patterning 56 CMOS wafer 56 semiconductor fabs 56 High Density Interconnect 56 microfabrication 56 crystalline silicon photovoltaic 56 polyurethane elastomer 56 optical waveguides 56 solder paste 56 Solamet 56 Imec performs world 56 photomasks 56 silicon etching 56 polymer emulsion 56 overmolding 56 FEOL 56 inkjet inks 56 gallium selenide 56 thermoplastic polyester 56 electroforming 56 nanoimprinting 56 Cerium oxide 56 ultraviolet curable 56 quartz plates 56 ENIG 56 di selenide CIGS 56 nanotechnology MEMS 56 fxP 56 insulator substrate 56 SOI CMOS 56 dispersible polymer powders 56 furnaceware 56 thermally conductive 56 microelectronic packaging 56 fused silica 56 engineered substrates 56 adhesive sealant 56 metallization 56 Deep Reactive Ion Etch 56 nano imprint 56 indium gallium arsenide InGaAs 56 wafer bumping 56 #nm CMOS [002] 56 multilayer ceramic capacitors MLCC 55 indium gallium 55 CVD etch 55 PWBs 55 indium phosphide InP 55 UHMW PE 55 semiconductor wafer 55 Stanyl ® 55 thermoplastic polyurethane 55 sealants paints 55 GaAs substrates 55 wave soldering 55 silicone elastomer 55 gallium arsenide indium phosphide 55 LPCVD 55 microfine 55 optoelectronic packaging 55 extreme ultraviolet lithography 55 InnerArmor 55 acrylates 55 chromate pigments 55 NdFeB 55 oxide semiconductor 55 polyisoprene 55 electroless copper 55 wafer thinning 55 LTPS TFT 55 ceramic dielectric 55 IGBT Insulated Gate 55 CIGS solar cell 55 vinyl ester resins 55 PEDOT PSS 55 wafer metrology 55 unsaturated polyester resins 55 antireflection 55 thermoset resins 55 Deposition MOCVD Systems 55 ceramic powders 55 cellulose ethers 55 PolyJet Matrix TM 55 opto electrical 55 CBT resin 55 nano coating 55 NEXX Systems 55 corrosion resistant alloy 55 amorphous silicon Si 55 polyamides 55 opto mechanical 55 silicone molding 55 silanes 55 micromachined 55 conductive polymer 55 silicas 55 silicon etch 55 LENS powder 55 bonded abrasives 55 freeze VGF technique 55 Boron Nitride 55 photomask 55 indium phosphide 55 flame retardants antioxidants 55 Gallium Nitride GaN 55 deflashing 55 resins adhesives 55 EVOH 55 imprint lithography 55 electroless nickel 55 semiconductor optoelectronics 55 W1I 55 encapsulants 55 extruded sheet 55 mask aligners 55 latexes 55 nanolithography 55 metallization pastes 55 Silicones 55 low k dielectrics 55 thermoplastic elastomers 55 passivating 55 matrix composites 55 metallizing 55 laser micromachining 55 Solamet ® 55 Gallium Arsenide 55 BASF Catalysts division 55 cemented carbides 55 deep silicon etch 55 dyestuff 55 electroplating 55 silicon germanium SiGe BiCMOS 55 precision dispensing 55 sputter deposition 55 thermoplastic materials 55 antireflection coatings 55 zirconium oxide 55 backside metallization 55 compression molding 55 alumina ceramic 55 pellicle 55 copper electrochemical deposition 55 electroless 55 battery anodes 54 cordierite 54 sintered metal 54 sealants adhesives 54 nano imprint lithography 54 laterally diffused metal 54 Silicon Carbide SiC 54 ionomer 54 transparent electrode 54 HydroFix 54 thermoset composites 54 SOI MEMS 54 zirconium dioxide 54 epitaxy 54 ethylene vinyl acetate 54 microporous membranes 54 carbon nanotubes CNT 54 dielectric materials 54 naturally occurring nanotubes 54 thermoplastic biocomposite compounds 54 CIGS solar cells 54 polyvinyl alcohol 54 Control LACC 54 silicon DRIE 54 e beam lithography 54 electrochemical separations 54 elastomeric seals 54 coatings 54 wafer probing 54 Zytel ® 54 MESFET 54 brazing alloys 54 GaN wafers 54 acrylic latex 54 microcrystalline 54 encapsulant 54 ethylene vinyl alcohol 54 stereolithography 54 biaxially oriented polypropylene 54 adhesives coatings 54 SOI silicon 54 solvents polyols 54 TPUs 54 EDXRF 54 Oxide Silicon 54 boron carbide 54 thermoplastic resin 54 granulates 54 terephthalate packaging 54 Abrisa Technologies 54 ion implanters 54 resistive touch panels 54 exotic alloys 54 Tetra Reticle Clean 54 hardfacing 54 melt processable 54 gallium arsenide gallium nitride 54 powder metallurgy 54 conductive inks 54 antimicrobial additives 54 mask aligner 54 superabrasive 54 millisecond annealing 54 coated abrasives 54 Fiberglass Reinforced 54 welding machining 54 TSX VENTURE ZMS FRANKFURT 54 CMOS fabrication 54 inkjet printing systems 54 epiwafers 54 ferrites 54 manufactures integrated circuits 54 DSS furnaces 54 ferrite 54 tin oxide 54 germanium substrates 54 acrylic resins 54 dielectric layer 54 MEMS fabrication 54 glass substrate 54 polyurethane coatings 54 liquid chromatographs 54 metalcutting 54 nanoparticle inks 54 coating resins 54 silicon MEMS 54 zinc oxides 54 thermoset composite 54 Printing Inks 54 insert molding 54 III nitride 54 thermoplastic olefin 54 aluminum gallium indium 54 gallium indium 54 CIGS copper indium 54 computational lithography 54 heterojunction bipolar transistor 54 epitaxial wafer 54 fluoropolymers 54 magnesium fluoride 54 SiC substrates 54 polyurethane foams 54 unsaturated polyester 54 CIGS solar 54 acrylic emulsion 54 specialty surfactants 54 BiFET 54 aspheric lenses 54 SiC wafers 54 silicon PV modules 54 ethylene vinyl acetate EVA 54 VICTREX PEEK polymer 54 Gallium arsenide 54 cemented carbide 54 electron beam welding 54 prophy paste 54 nitriding 54 2Xnm 54 phenolic resins 54 Silicon Carbide 54 electroplated 54 Transparent Conductive Oxide TCO 54 magnesium alloys 54 OTCBB QPCI 53 Dektak 53 micro optics 53 String Ribbon 53 ALD Atomic 53 functionalizing 53 structural adhesives 53 acrylic monomers 53 wire bonders 53 texturizing 53 Enthone 53 Cadmium Telluride 53 semiconductor wafers 53 X ray diffraction XRD 53 AlGaAs 53 polyphenylsulfone 53 photoresist 53 pulsed laser deposition 53 Vor ink 53 copper indium gallium diselenide 53 Nasdaq LTXX 53 Polycrystalline 53 Helios XP 53 thermoplastic molding 53 micro electro mechanical 53 polyimide 53 AlGaInP 53 ownership CoO 53 high voltage BCDMOS 53 sapphire wafers 53 Styrenic 53 optically pumped 53 vinyl esters 53 shot peening 53 polymethyl methacrylate PMMA 53 PVD coating 53 Esatto Technology 53 ultrahigh purity 53 semiconductor fabrication 53 DPSS lasers 53 SOI wafers 53 transparent electrodes 53 peening 53 polyvinyl butyral 53 carbon nanotube interconnects 53 polyester resins 53 ceramic proppants 53 leadframes 53 nylon #,# 53 Kalrez ® 53 copper electroplating 53 photopolymer 53 expandable polystyrene 53 carbon nanotube CNT 53 injection molding extrusion 53 PP polypropylene 53 polymer powders 53 silicon 53 silicon wafer 53 #.# micron node 53 thermoplastic polyurethanes 53 phototransistors 53 nanocrystalline 53 Makrolon polycarbonate 53 ceramics fracture proppants 53 titanium pigment 53 temporary wafer bonding 53 carburizing 53 patented Laser Assisted 53 EVG# 53 superalloy 53 polymer composite 53 microstructured 53 decorative laminates 53 DFM DFY 53 ANTARES 53 photomultipliers 53 decorative laminate 53 barium titanate 53 silicate glass 53 nano tubes 53 weld overlay 53 Rilsan ® 53 monocrystalline silicon 53 microwave integrated circuits 53 monocrystalline silicon wafers 53 cadmium zinc telluride 53 Nasdaq NVLS 53 TDK EPC 53 Electronic Materials 53 discrete semiconductors 53 injection moldable 53 transparent conductive films 53 dielectrics 53 metallurgically bonded 53 epitaxy HVPE 53 Si substrates 53 microlithography 53 inconel 53 Advanced Packaging 53 corrosion resistant coating 53 opto electronic components 53 Chemical Vapor Deposition 53 On Insulator SOI 53 Si wafers 53 projected capacitive touch 53 conductive coating 53 coextruded 53 passivation layers 53 overlay metrology 53 thermoplastic polymer 53 glass frit 53 IQ Aligner 53 ion implantation 53 Chemical Vapor Deposition CVD 53 mixed signal RFCMOS 53 tool steels 53 fluorochemical 53 Tungsten carbide 53 thermoelectric coolers 53 Zinc Oxide 53 hydride vapor phase 53 photovoltaic PV module 53 polyvinyl chloride resin 53 C0G 53 metal matrix composites 53 TGA# SL 53 GER SMH 53 methacrylate 53 microelectromechanical systems MEMS 53 inherently flame retardant 53 Alanod Solar 53 polymer extrusion 53 .# micron 53 WACKER SILICONES 53 inertial MEMS 53 EPDM rubber 53 Asymtek Nordson 53 nanocoatings 53 nanotube arrays 53 transparent conductive oxides 53 nano coatings 53 Cereplast bio 53 PVC resins 53 Scanning Probe Microscope 53 semiconductor nanostructures 53 #nm immersion lithography 53 film transistors TFTs 53 epiwafer 53 polyester resins alkyd resins 53 chemically resistant 53 ultrasonic vibration 53 gallium phosphide 53 DSi etch 53 Thermoset 53 line BEOL 53 hollow fiber 53 abrasive waterjet 53 Photomask 53 wafer bonders 53 photovoltaic module 53 SUSS MicroTec 53 Semiconducting 53 polyester vinyl ester 53 UVTP 53 ultrapure 53 MLCC capacitors 53 aluminosilicate 53 silicon Si 53 siloxane 52 polymer substrates 52 thermosets 52 organic TFTs 52 yttrium barium copper 52 polyisocyanurate insulation 52 VISIONPAD ™ 52 electrically insulating 52 underfill 52 polymer coated 52 coating 52 VUV 52 microfabrication techniques 52 plastics fibers 52 polyaspartic 52 Wafer Level Camera 52 thermal oxidation 52 titanium carbide 52 cermet 52 conductive coatings 52 acrylic polymers 52 #nm #nm [002] 52 Epitaxial 52 indium oxide 52 EMI RFI shielding 52 liquid crystal polymers 52 extruded polystyrene 52 precision microsurgery instrumentation 52 ZMD AG 52 ArF 52 including monolithic refractories 52 gallium nitride GaN 52 SOI Silicon 52 Silicon carbide 52 EcoQuik 52 indium gallium phosphide InGaP 52 multilayer ceramic 52 QMEMS 52 Vespel ® 52 UMC #nm 52 nickel silicide 52 polycrystalline diamond 52 ion implant 52 Uhde Inventa Fischer 52 roofing membranes 52 transistor arrays 52 polymer matrices 52 opto electronic 52 CyberDisplay #K 52 thermo mechanical 52 silicone adhesives 52 nanostructured silicon 52 PolyJet 52 monosilane 52 polybutylene terephthalate 52 thermoplastics elastomers 52 YAG lasers 52 compressive stresses 52 styrene butadiene 52 nickel hydroxide 52 laser optics 52 resins additives 52 flux residues 52 RF Microwave 52 density interconnect HDI 52 reed switches 52 sol gel 52 waterjet cutting 52 aluminum electrolytic 52 NASDAQ MFLO 52 CdTe Si 52 resorbable biomaterials 52 aqueous cleaning 52 paints sealants 52 forgings castings 52 HV CMOS 52 thermoformed packaging 52 microvia 52 polydimethylsiloxane PDMS 52 repellent nano 52 nanoporous 52 purity silicon 52 #,# propanediol PDO 52 GxT 52 die bonders 52 metallic interconnects 52 ultrafiltration membrane 52 ULTEM 52 UV NIL 52 cubic boron nitride 52 silicon carbide ceramic 52 nano structured 52 Inc. NASDAQ MTSN 52 putties 52 extreme ultra violet 52 thermoplastic TPV 52 super alloys 52 gas chromatographs 52 mount SMT 52 fluoropolymer 52 silicone carbide 52 epitaxial deposition 52 styrenic 52 aluminum nitride AlN 52 aluminosilicate clay 52 rigid foams 52 Rastek UV wide 52 elastomeric coatings 52 RF shielding 52 electroless nickel immersion 52 Inc. NASDAQ RTEC 52 DPN ® 52 HTS wires 52 crystalline silicon wafers 52 Copper Indium Gallium 52 optical transceiver modules 52 Valox 52 specialty polymers 52 copper indium gallium 52 ion implantation equipment 52 crystalline silicon c 52 silicone rubbers 52 electrochemical sensor 52 produced plasma LPP 52 rollstock 52 anodizing 52 Injection molding 52 silicones 52 silicon carbide SiC 52 silicon micromachining 52 Fluorochemicals 52 MEMS resonators 52 Aixtron MOCVD 52 powder coatings 52 lithium niobate 52 conductive epoxy 52 millimeter silicon wafers 52 CIGS photovoltaic PV 52 extrusion molding 52 injection molders 52 silicon substrates 52 SOI substrates 52 Flip Chip 52 TSX V ZMS 52 tellurium selenium iridium 52 intermetallic 52 polytetrafluoroethylene PTFE 52 coil coatings 52 polyethylene fiber 52 Datamate 52 CVD diamond 52 embedded nonvolatile memory 52 micronized 52 pultrusion 52 wafer prober 52 UV curable coatings 52 extrusion thermoforming 52 hardcoat 52 superalloys 52 silicon ingot 52 RBP Chemical Technology 52 eutectic solder 52 coolants lubricants 52 semiconductor 52 abrasives 52 Ferro Corporation http:/www.ferro.com 52 vertical cavity 52 Thermally Conductive 52 Indium 52 thermally activated 52 Inc. NASDAQ AXTI 52 expandable polystyrene EPS 52 #nm silicon 52 HBLED 52 Amorphous Silicon 52 tin plating 52 silicon photonic 52 silicon ingots 52 dedicated semiconductor foundry 52 rubbery polymer 52 Electrografting 52 EOSINT M 52 fluorosilicone 52 styrene acrylonitrile SAN 52 Ultem 52 Indium Phosphide InP 52 carbide insert 52 cellulose acetate fibers 52 sprayable 52 UV VIS 52 electro optic polymer 52 castings forgings 52 nucleation layer 52 microfiltration membrane 52 Silicon wafers 52 additive fabrication 52 nitrile rubber 52 photochromics 52 brazing 52 deburring 52 MEMS MOEMS 52 Silicon CMOS Photonics 52 lithographic sheet 52 Titanium Dioxide TiO2 52 nanopowder 52 TMOS display 52 nonvolatile static random 52 Auria Solar 52 microelectromechanical 52 rheology modifier 52 solder mask 52 silicon oxynitride SiON 52 wafer bonding 52 pneumatic conveying systems 52 MLCCs 52 CMOS MEMS 52 Micrel Semiconductor 52 hermetic packaging 52 adhesives resins 52 Physical Vapor Deposition 52 laminate substrates 52 monolithically integrated 52 carbides 52 solar PV module 52 polypropylene compounds 52 foams plastics 52 masterbatches 51 nanoclay 51 interfacial layer 51 micro electromechanical systems 51 Indium phosphide 51 Metrology System 51 ArF immersion lithography 51 boron nitride 51 calcium fluoride 51 Alchimer 51 silicone sealants 51 #.#um CMOS 51 TurboDisc K#i 51 epoxy potting 51 advanced leadframe 51 CMP slurry formulation 51 extrusion coating 51 rotomolding 51 Electrovert wave soldering reflow 51 meltblown 51 dual damascene 51 ultrafiltration UF 51 cryogenic gases 51 fluoropolymer tubing 51 Nasdaq MSCC 51 silicon nitride 51 Aluminum Oxide 51 Vertical Cavity Surface Emitting 51 hydrophilic foam 51 solder reflow 51 Er YAG 51 anneal 51 laser interferometer 51 microdevices 51 metalorganic chemical vapor deposition 51 thermoset 51 indium tin oxide 51 carbide inserts 51 Raman spectrometers 51 quantum dot QD 51 solder bumps 51 multicrystalline wafer 51 flex circuits 51 extrusion billet 51 zirconium nitride 51 asphalt emulsions 51 aqueous dispersion 51 alloy steels 51 thermoplastic resin distribution 51 cadmium sulfide 51 expandable foam 51 CIGS Copper Indium 51 zirconate 51 Strained silicon 51 dielectric deposition 51 SnO2 51 Heidelberg Instruments 51 integrated circuits IC 51 epoxy adhesives 51 gallium indium arsenide 51 PVOH 51 String Ribbon solar 51 fluoropolymer coatings 51 lubricant additive 51 InGaP 51 laser sintering 51 X ray diffractometer 51 conductive adhesive 51 Victrex PEEK 51 DongbuAnam 51 multicrystalline silicon wafers 51 alloys titanium 51 Plasma Enhanced 51 nanometer silicon 51 laser annealing 51 solder pastes 51 nanocomposite coatings 51 micro optic 51 Polyimide 51 Frankfurt W1I 51 hot melt extrusion 51 vinyl acetate ethylene 51 CIGS photovoltaic 51 Nd YAG 51 PET preforms 51 Laurent Malier CEO 51 nickel manganese 51 perfluoroelastomer 51 vacuum brazing 51 line FEOL 51 Laser Marking 51 Applied Baccini 51 Co2 laser 51 Intel IBIST 51 polyurea coatings 51 CRIUS 51 semiconductor foundries 51 AMLCD 51 Nasdaq LTXX leading 51 Morgan Advanced Ceramics 51 oxo derivatives 51 HamaTech APE 51 GaAs AlGaAs 51 stereolithography SLA 51 laser sintering systems 51 SWIR cameras 51 Soitec produces 51 #mm silicon wafers 51 X7R 51 TiN 51 NuFlare 51 titanium nitride 51 anticorrosive 51 molecular sieve 51 low k dielectric 51 blowmolding 51 Scanning Probe Microscopes 51 cathode materials 51 Titanate 51 hafnium oxide 51 rigid polyurethane foams 51 electrochemical deposition 51 industrial degreaser 51 indium gallium phosphide 51 Suprema TM 51 rainscreen cladding 51 toolholding 51 standalone metrology 51 microfocus X ray 51 glacial acetic acid 51 CdTe PV 51 SpecMetrix 51 Tessera Licenses 51 nanoparticle characterization 51 activated carbons 51 fluorochemicals 51 photoresist coaters cleaners 51 rigid PVC 51 displays FPD 51 adsorbents 51 nm SOI 51 PZT 51 NASDAQ CCMP 51 SIMOX SOI wafers 51 thermoplastic elastomers TPEs 51 PET resins 51 bismuth telluride 51 die castings 51 transparent conductive oxide 51 PVC CPVC 51 NiSi 51 bulk solids 51 thermoplastic rubber 51 engineering thermoplastics 51 Stocking distributor 51 electro mechanical components 51 Fortron PPS 51 overmolded 51 polyphenylene sulfide 51 photolithographic 51 wire bonder 51 polyvinylidene fluoride PVDF 51 Adhesives Sealants 51 Nihon Superior 51 cadmium selenium 51 multilayer ceramic capacitors 51 APTIV film 51 Silicon Oxide Nitride 51 AQUANOX ® A# 51 thermosetting resin 51 additive masterbatches 51 ellipsometry 51 microcapillary 51 adhesives 51 flux cored wires 51 adhesives sealants 51 JPK Instruments AG 51 emulsion polymers 51 nanoengineered 51 silicone adhesive 51 JENOPTIK GmbH 51 Nasdaq CCMP 51 solid carbide 51 tungsten carbide 51 threaded fasteners 51 upgraded metallurgical 51 lithography simulation 51 adhesive tapes 51 Encapsulants 51 accuracy repeatability 51 passivation layer 51 thermal lamination 51 implantable fixation devices 51 optoelectronic components 51 Physical Vapor Deposition PVD 51 SAC# 51 semiconductor fabricators 51 PVB interlayer 51 aramid fiber 51 lubricant additives 51 ceramic substrates 51 chalcogenide 51 Ge substrates 51 SiGen 51 microstructures industries 51 Ductile Iron 51 amorphous silicon TFT 51 ceramic coatings 51 #nm HKMG 51 electron beam lithography