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(Click for frequent words.) 70 etching 60 etches 57 etched 55 lithography 55 engrave 52 inscribe 51 photoresist 50 millisecond anneal 49 photolithography 49 lithographic 48 electron beam lithography 48 etcher 48 BEOL 47 photoresist strip 47 metallization 47 engraves 47 reactive ion 46 PECVD 46 photoresists 46 engraving 46 laser engraving 45 silicon etch 45 inscribes 45 engraved 45 polymer extrusion 45 planarization 45 physical vapor deposition 45 photomasks 45 chemically etched 45 stencil 45 photolithographic 45 EUV mask 45 immersion lithography 44 maskless 44 gate dielectrics 44 low k dielectric 44 PVD CVD 44 Etching 44 imprint lithography 44 EUV masks 44 copper metallization 44 e beam lithography 44 line BEOL 44 nano patterning 44 plasma etch 43 nm lithography 43 focused ion beam 43 FEOL 43 defectivity 43 nitride 43 nanoimprint lithography NIL 43 imprinted 43 solder paste 43 Photolithography 43 CMP slurries 43 metallisation 42 micron 42 litho 42 metrology 42 emboss 42 laser engraved 42 TiN 42 etching DRIE 42 ArF immersion lithography 42 silicon DRIE 42 encapsulant 42 dielectrics 42 dot peen 42 inscribing 42 molding 42 epitaxy 42 chemical mechanical planarization 42 dielectric etch 42 micromachining 42 overlay metrology 42 photoresist stripping 42 microcontact printing 42 wafer bonding 42 laser etching 42 etchers 42 embossing 42 solder bump 42 silicon 42 patterning 42 deep silicon etch 42 nano imprint 41 glass substrate 41 nickel silicide 41 #nm node [001] 41 EUV lithography 41 substrates 41 flexo plate 41 solder mask 41 nm immersion 41 nanometer 41 dual damascene 41 chisel 41 mechanical polishing CMP 41 Inscribed 41 inscribed 41 anodising 41 silicon wafer 41 k dielectrics 41 plasma etching 41 passivation layers 41 solder reflow 41 UV NIL 41 Ti TiN 40 CMOS oscillators 40 vapor deposition 40 bond aligner 40 UV curing 40 #.#μm [002] 40 5μm 40 stencil printing 40 mask aligners 40 Silicon Nitride 40 nanoparticle inks 40 nanoimprint lithography 40 EUV 40 ion implant 40 epitaxial 40 passivation 40 solder paste printing 40 electroformed 40 #nm silicon 40 electroplated 40 EUVL 40 CMOS wafers 40 nano imprint lithography 40 sintered 40 molten solder 40 nanolithography 40 Lithography 40 metallic inks 40 advanced leadframe 40 reflow 40 nm node 40 #nm DRAM 40 electroless 40 anneal 40 silicide 40 coater developer 40 conductive inks 40 layer deposition ALD 40 nitrided 40 electrodeposition 40 micro vias 40 photomask 40 thermoform 40 UV curable 40 metalizing 40 deep ultraviolet DUV 40 #nm CMOS [002] 39 microlithography 39 #nm #nm [005] 39 backside metallization 39 scribed 39 lamination 39 silicon wafers 39 nanometer scale 39 dielectric 39 barium titanate 39 photopolymer 39 dye inks 39 sub micron 39 high voltage BCDMOS 39 Langmuir Blodgett 39 Esatto Technology 39 ArF 39 VECTOR Express 39 sputter deposition 39 electroplating 39 piezo ceramic 39 scribing 39 goatskin parchment 39 DRIE 39 submicron 39 substrate 39 fused quartz 39 wafer 39 underfill 39 wirebond 39 laminations 39 anodic 39 UV inks 39 nanopatterning 39 laser etched 39 stereolithography 39 emitting laser VCSEL 39 XT #i 39 EVG# 39 resists scratches 39 Aera2 39 nanotubes nanowires 39 Etched 39 ferroelectric random access 39 permanently etched 39 Tetra Reticle Clean 39 optical lithography 39 coaters 39 coextruded 39 low k dielectrics 39 reflective coatings 38 siloxane 38 inkjet printing 38 #nm immersion 38 nanometer silicon 38 annealing 38 k dielectric 38 solder bumps 38 AlGaN 38 high-k/metal gate 38 wave soldering 38 ion beam 38 sprayable 38 electron beam welding 38 affix 38 laser scribing 38 edge roughness LER 38 line FEOL 38 polycrystalline 38 wafer thinning 38 extreme ultraviolet lithography 38 wafer bonder 38 dye sublimation 38 acid etching 38 thermal conduction 38 molecular imprinting 38 silicate glass 38 nm SRAM 38 forever etched 38 Carbon nanotube 38 adhesive vinyl 38 micro machining 38 #nm [001] 38 Extreme Ultraviolet EUV 38 microstructures 38 Engraved 38 ownership CoO 38 transparent conductive 38 zirconium nitride 38 metallizing 38 lithographically 38 LightScribe discs 38 metalised 38 molding compounds 38 Sokudo 38 optical waveguides 38 dielectric constant 38 aluminum brazing 38 chemical vapor deposition 38 silicon substrate 38 coatings 38 CoO 38 XeF2 38 BinOptics 38 solder pastes 38 conformal coating 38 ultrahigh purity 38 embosses 38 semiconductor wafers 38 LPCVD 38 chemically amplified 38 inkjet printhead 38 reticles 38 perfluoroelastomer 38 incised 38 #.#um [001] 38 micrometer sized 38 laminating 38 manufacturable 38 optically transparent 37 seam sealer 37 fused silica 37 polishing 37 mandrels 37 microfabrication 37 electrolytic 37 Si substrate 37 ferrite 37 polymer extrusion technologies 37 MOCVD 37 atomically smooth 37 polyimide 37 Lamination 37 ASML lithography 37 degas 37 optical coatings 37 GDSII 37 roughening 37 #nm/#nm 37 grease pencil 37 digest ICP AES 37 #nm immersion lithography 37 thermo conductive 37 unpatterned 37 conductive adhesives 37 adsorb 37 dielectric layers 37 silicon nitride 37 collodion 37 DongbuAnam 37 CMP slurry 37 1μm 37 insulator wafers 37 micrometer thick 37 membrane switches 37 UNCD 37 VUV 37 intergranular 37 semiconductor lithography 37 #nm nodes 37 nonvolatile memories 37 k gate dielectric 37 coreless 37 molded 37 planarity 37 computational lithography 37 reticle inspection 37 TSV 37 microelectronic 37 coextrusion 37 bipolar transistors 37 SRAM DRAM 37 nanometric 37 delaminate 37 indium tin oxide ITO 37 conductive epoxy 37 NiSi 37 PZT 37 insert 37 nanoimprint 37 crystalline silicon solar 37 Etch 37 EUV resists 37 embosser 37 hardcoat 37 deburring 37 FinFETs 37 intaglio printing 37 laser micromachining 37 Solamet ® 37 AlN 37 numerical aperture 37 ion implantation 37 sol gel 37 extrusion 37 optical metrology 37 electrochemical 37 photographic emulsion 37 UV varnish 37 glass frit 37 Photoresist 37 #nm ArF 37 patterned wafers 37 transistor arrays 37 UV LED 37 annealed 37 graven 37 pour molten 37 weldability 37 conductive adhesive 37 roughen 37 archival inks 37 resharpening 37 thermoset composite 37 foil stamping 37 polymer nanocomposites 37 nanometer nm 36 Aerosol Jet 36 creasing 36 Insulator 36 stamper 36 furnaceware 36 Solamet 36 fabricate nanoscale 36 machining 36 pastes 36 SOI Silicon 36 SUSS MicroTec 36 DUV 36 lithographic printing 36 heat shrinkable 36 Eco Solvent 36 Aspect Ratio Process 36 solder bumping 36 reflowed 36 electron beam 36 flexo printing 36 laser annealing 36 semiconductor 36 insert molding 36 etch deposition 36 chemically inert 36 .# micron 36 varnish 36 frits 36 #.# micron node 36 nm 36 formability 36 mandrel 36 transistor 36 x ray optics 36 nanocrystalline 36 semiconductor wafer 36 copper electroplating 36 coating 36 porous substrates 36 checkering 36 lithographic patterning 36 Hideki Matsui Johnny Damon 36 eutectic 36 millimeter silicon wafers 36 thermochromic 36 polyurethane adhesive 36 FeRAM 36 carbon nanotubes CNT 36 PVD coating 36 Schottky 36 laminates 36 monochromator 36 soldering 36 antifuse 36 electro deposition 36 dopant 36 electrochemical deposition 36 SOI CMOS 36 semiconductor fabrication 36 Focused Ion Beam 36 brightfield 36 Thinfilm 36 mask aligner 36 CMOS wafer 36 elution 36 rheology modifier 36 numerical aperture NA 36 density interconnect HDI 36 polydimethylsiloxane 36 CIGS 36 heterostructure 36 dielectric materials 36 selective soldering 36 ZnSe 36 dichromate 36 analyte 36 Instant Krazy Glue 36 carborundum 36 printability 36 multilayers 36 nanostructure 36 static dissipative 36 X ray microscopy 36 Calibre LFD 36 multilayer 36 nanoimprinting 36 laser interferometer 36 PET preforms 36 chipless RFID 36 vias 36 SiC 36 Laminated 35 #nm RF CMOS 35 gloss varnish 35 pMOS 35 inks dyes 35 NuFlare 35 flexible substrates 35 latex caulk 35 megasonics 35 MEMS fabrication 35 electrophotography 35 silicon micromachining 35 photodetector 35 pigmented inks 35 Calibre DFM 35 X ray metrology 35 density fiberboard 35 argon fluoride 35 deflashing 35 CMOS compatible 35 silicon nanocrystals 35 SOI wafer 35 nanocrystal 35 IQ Aligner 35 metallic alloys 35 k gate dielectrics 35 lithography simulation 35 fluoropolymer 35 leadframe 35 brightness LED 35 stamped 35 #μm thick [002] 35 Patterning 35 CMOS fabrication 35 recognition MICR 35 Helios XP 35 inlaying 35 sublimation 35 MIG welding 35 microfabrication techniques 35 polycrystalline diamond 35 adhesive sealant 35 maskless lithography 35 photodiode 35 μm diameter 35 stencils 35 thermo plastic 35 BiCMOS 35 chalcogenide 35 offset litho 35 weld 35 reflow soldering 35 extendibility 35 titanium carbide 35 nanodots 35 CMOS transistors 35 crystallinity 35 toner refill 35 kerf 35 sister Waltraute 35 conformal coatings 35 serigraphy 35 AlGaN GaN 35 polish 35 wafer thickness 35 corrugation 35 crystallization 35 micromachined 35 TSVs 35 Kalrez ® 35 flexo plates 35 carbon nanotube CNT 35 planar 35 cermet 35 inscriptions etched 35 2μm 35 encrustation 35 crystalline silicon c 35 embedded nonvolatile memory 35 cored wire 35 sandblast 35 abrasion resistant steel 35 UV curable ink 35 microelectronic devices 35 powder coating 35 nanocoating 35 PCB layout 35 TIG welding 35 integrated circuits 35 incising 35 microfluidic 35 inlay 35 silicone gasket 35 LTPS TFT 35 nanoscopic 35 adhesive 35 Silicon Germanium 35 ceramic dielectric 35 silicon substrates 35 VCSEL 35 soleplate 35 protective coatings 35 #nm lithography [001] 35 aluminum oxide 35 ink 35 #nm [002] 35 bonder 35 UV inkjet 35 imprints 35 CMOS logic 35 inscriptions 35 dimensionally stable 35 semiconductor nanostructures 35 silica substrate 35 peening 35 abrading 35 oxide layer 35 magnetron sputtering 35 resin composites 35 chamfering 35 ASML TWINSCAN 35 weldable 35 soldered 35 inkjet printable 35 photodetectors 35 warpage 35 marbleized 35 micrometer 35 vertical cavity 35 phototypesetting 35 waviness 35 ellipsometry 35 thermoplastic polyurethane TPU 35 solvent inkjet printers 35 embossers 35 UVTP 35 lithographic plates 35 geometries shrink 35 wet collodion 35 cylinder bores 35 temporary wafer bonding 35 threshold voltages 35 VIISta 34 hafnium oxide 34 Chemical Mechanical Planarization 34 flexography 34 JENOPTIK GmbH 34 epitaxial deposition 34 SiGe bipolar 34 Novelis Fusion TM 34 LPKF 34 #nm transistors 34 lithographers 34 wafer bumping 34 photorefractive 34 carve 34 Shrinky Dink 34 singulation 34 NovaScan 34 nm nodes 34 pHEMT 34 nanocrystalline silicon 34 epoxy resin 34 SOI silicon 34 GaN 34 fusible 34 #.#um [002] 34 LiNbO3 34 colorfast 34 laser sintering 34 thermoplastic polyester 34 CVD diamond 34 optical microscopy 34 Maskless 34 inkless 34 compression molding 34 functionally graded 34 rotogravure printing 34 resin infusion 34 lithographically patterned 34 III nitride 34 FOBA 34 nanomechanical 34 Ascentis Express 34 squeegee blades 34 #/#nm 34 microporous 34 SiON 34 emery 34 efface 34 MEMS resonators 34 logic CMOS 34 PEALD 34 scanning electron microscope SEM 34 SMS NIL 34 VICTREX PEEK polymer 34 UV cured 34 metallic interconnects 34 CMOS 34 VFFS 34 halftone 34 EBDW 34 deep sub micron 34 Novellus 34 carbide insert 34 Insulator SOI 34 UV reactive 34 diecutting 34 Flip Chip 34 airgap 34 CCD detector 34 wafer dicing 34 nonporous 34 K dielectrics 34 ITRS roadmap 34 polyurethane coatings 34 seamless extruded 34 rigid substrate 34 primer sealer 34 incused 34 nanofilm 34 Photomask 34 extrudate 34 HKMG 34 thermo mechanical 34 molders 34 ferroelectric 34 metallic foils 34 blot 34 imprinting 34 gallium nitride GaN 34 sacrificial anode 34 heat sealable 34 ferromagnetic 34 chromatographic 34 nanoindentation 34 micro electromechanical systems 34 erase 34 Obducat 34 wafer probing 34 immortalizing 34 solution processible 34 thermoforming 34 nanometer spatial 34 UV coating 34 conventional lithographic 34 stain 34 plastisol 34 pellicle 34 film transistors TFTs 34 RET OPC 34 electroless nickel 34 indium arsenide 34 linewidths 34 diffractive optical elements 34 corrosion abrasion 34 thermally activated 34 force microscopy AFM 34 Novellus Systems Inc NVLS.O 34 rheological 34 copings 34 hardened steels 34 Schottky barrier 34 Strained silicon 34 imbed 34 Ball Grid Array 34 copper interconnects 34 Alchimer 34 c Si 34 microfine 34 nonreflective 34 surface passivation 34 Imprio 34 silicon crystals 34 flexographic plates 34 geometries 34 MOS transistors 34 #nm CMOS [001] 34 bevel 34 foundry 34 SiC Schottky diodes 34 electrophoretic 34 NSR S#C 34 AlGaAs 34 Affixing 34 highly conformal 34 FEOL cleaning 34 crystal lattices 34 embossed 34 pre preg 34 cemented carbide 34 ethylene tetrafluoroethylene 34 saddle stitching 34 repels moisture 34 filament winding 34 absorber layer 34 ceramic glazes 34 laminators 34 nanoscale patterning 34 parametric yield 34 weld seam 34 reconfigurable logic 34 expunge 34 crystalline 34 spectral imaging 34 nodular iron 34 nitriding 34 UHMW 33 nanocomposite 33 elute 33 electron tunneling 33 nanosized 33 nanostructured 33 nanometer node 33 blacken 33 etchant 33 immortalize 33 GTAW 33 encapsulation 33 aligned carbon nanotubes 33 interfacial layer 33 gasketing 33 #μm [001] 33 laminate substrates 33 nanowire transistors 33 stain repellency 33 barium ferrite 33 Cerium oxide 33 scratchproof 33 wafer processing 33 biomolecule 33 pigment ink 33 nano imprinting 33 brazed 33 AlN substrates 33 urethane coating 33 #.# micron CMOS 33 printhead 33 epiwafer 33 Nitinol 33 RFID transponder 33 printing inks 33 indelibly inked 33 microstructured 33 indium phosphide 33 resists abrasion 33 RF CMOS 33 Artistri 33 Flex OneNAND 33 elemental composition 33 molder 33 indium gallium arsenide InGaAs 33 noncorrosive 33 crystallite 33 NdFeB 33 wafer fabrication 33 smudge 33 micro fluidic 33 aluminum nitride 33 monolithically integrated 33 integrated metrology 33 epi wafers 33 subnanometer 33 Opti Probe 33 HEMT 33 InP 33 pultruded fiberglass 33 semiconductor metrology 33 high-k/metal-gate 33 HfSiON 33 micromechanical 33 carbon nanotube 33 Inlays 33 programmable microcontrollers 33 resin 33 chiseling 33 rigid PVC 33 metallic nanostructures 33 parison 33 insulating glass 33 Lexan Thermoclear sheet 33 scrubbing brush 33 RRAM 33 overmolding 33 SiO 2 33 glass ionomer 33 interposer 33 thinset 33 alloying 33 backplanes 33 smaller geometries 33 silicone caulk 33 nanodevice 33 copperplate 33 chine colle 33 Vistec Semiconductor Systems 33 foam mattress topper 33 quasicrystalline 33 processless 33 pigment inks 33 lidding 33 MIG welder 33 predrilled holes 33 taggant 33 EUV Lithography 33 graphene nanostructures 33 gesso 33 fiber reinforced thermoplastic 33 acrylic polymer 33 FDSOI 33 Cadmium Telluride CdTe 33 TSMC #nm process 33 crayon pencil 33 gluer 33 tin plating 33 PETG 33 glass substrates 33 zirconia 33 microscale 33 hexagonal shaped 33 DPSS lasers 33 subwavelength 33 self adhesive 33 superlattice 33 EUV resist 33 porous silica 33 accuracy repeatability 33 micrometre scale 33 SOI substrates 33 Viton ® 33 inks toners 33 HAMR 33 2Xnm 33 P3HT 33 silica spheres 33 Gbit NAND flash 33 pen nib 33 photopolymer plates 33 STT RAM 33 ultrasonic welding 33 sealability 33 SEMATECH 33 SiC substrates 33 defect densities 33 epoxy primer 33 extreme ultra violet 33 RFCMOS 33 putties 33 faster makeready 33 adhesive remover 33 FinFET 33 Cu interconnects 33 Lexan EXL 33 #μm thick [001] 33 coated polyester 33 gate electrode 33 silicon carbide SiC 33 label applicators 33 chemically resistant 33 MetaPULSE 33 surface texturing 33 pontil 33 PEDOT 33 inkjet inks 33 polymer composite 33 semiconducting nanowires 33 immersion litho 33 thinner wafers 33 pulsed laser deposition 33 amorphous silicon Si 33 nanoporous 33 tensile stress 33 polyurethane coating 33 parasitic extraction 33 polyvinyl butyral 33 nanostructured materials 33 paints primers 33 Simitri 33 deep submicron 33 extrude 33 CIGS solar cells 33 ReRAM 33 Grätzel cells 33 photopolymers 33 electrodeposited 33 molds 33 Kodak inkjet 33 programmable microcontroller 33 wafer metrology 33 metalcutting 33 injection moldable 33 wafers 33 discolor 33 rubbings 33 staining 33 laminate 33 carbon nanotubes nanowires 33 Super Spacer 33 thermal inkjet 32 optoelectronic 32 parachuting rat 32 HBLED 32 micromechanics 32 squeegee blade 32 MOS transistor 32 aspheric 32 piezo inkjet 32 anodizing 32 correction OPC 32 inks coatings 32 dremel 32 inorganic semiconductors 32 nanopillar 32 microfabricated 32 Flakes melted 32 lightly moistened 32 CIGS cells 32 4Gb NAND flash 32 spintronic 32 electron optics 32 anilox 32 sublimation printing 32 engineered substrates 32 JEOL 32 micrometre 32 brush applicator 32 anodization 32 Mattson Technology 32 crystalline semiconductors 32 KBA Cortina 32 ultrahigh resolution 32 absorber layers 32 nanocomponents 32 Santoprene TPV B# 32 epoxy coating 32 thermoformers 32 macroporous 32 colorimetry