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(Click for frequent words.) 70 wafer bumping 67 Flip Chip 67 wafer dicing 66 wirebond 65 solderable 65 overmolding 65 solder bumps 65 leadframes 65 advanced leadframe 65 eutectic 64 interposer 64 conductive epoxy 64 mount SMT 63 Schottky diode 63 BGA CSP 63 die bonders 63 surface mountable 62 laminations 62 chip resistors 62 indium phosphide InP 62 dielectrics 62 QFN packages 62 QFN 62 FCBGA 62 rigid substrates 62 substrate 62 substrates 61 overmolded 61 flex circuits 61 SnPb 61 exotic alloys 61 silicon substrates 61 BGA packaging 61 underfill 61 PBGA 61 resistive element 61 dielectric layer 61 aluminum nitride 61 indium tin oxide ITO 61 package SiP 61 busbar 60 metallization 60 Ball Grid Array 60 ferritic 60 QFNs 60 laminate substrate 60 wirebonding 60 through silicon vias 60 TiN 60 ferrite 60 GaAs pHEMT 60 BGAs 60 rigid flex 60 cored wire 60 wire bondable 60 singulation 60 CMOS logic 60 LiNbO3 60 compression molded 60 wave soldering 60 pin SOIC 60 eWLB 60 solder alloy 60 X7R 60 SiPs 59 mandrel 59 NiSi 59 leadless 59 epiwafers 59 singlemode 59 tantalum capacitors 59 pcb 59 matte tin 59 CMOS wafer 59 Leadframe 59 multichip 59 coextrusion 59 monolithically integrated 59 ceramic capacitor 59 copper interconnects 59 BGA packages 59 SO8 59 gasketing 59 amorphous silicon Si 59 conformal coating 59 polydimethylsiloxane PDMS 59 radial leaded 59 CMOS transistors 59 encapsulants 59 WLCSP 59 CMOS circuits 59 BEOL 59 4mm x 4mm QFN 59 rollstock 59 reflow soldering 59 excellent solderability 59 electrodeposition 59 MLCCs 59 wirewound 59 wafer probing 59 e beam lithography 58 thermowell 58 photolithographic 58 polyimide 58 interposers 58 toolholders 58 leadless package 58 PHEMT 58 AlSiC 58 PVD coating 58 PWBs 58 threaded fasteners 58 electrically insulating 58 AlN 58 #.#um [001] 58 singulated 58 dielectric layers 58 wafer thinning 58 microstrip 58 silicon substrate 58 thermoplastic elastomer 58 TSSOP 58 silicon Si 58 micromachined 58 Inconel 58 chip resistor 58 LQFP 58 dielectric etch 58 rovings 58 QFN packaging 58 tiny 3mm x 58 CIGS solar cells 58 copper metallization 58 TQFP 58 SOI silicon 58 MLCC capacitors 58 SOI CMOS 58 metallised 58 optocoupler 58 CONNECTORS 58 #nm CMOS [002] 58 Schottky diodes 58 QSOP 58 multilayer ceramic 58 connectorized 58 TDFN 58 injection molding extrusion 57 insulator wafers 57 phototransistors 57 reed switches 57 dielectric materials 57 multilayer PCBs 57 thermally conductive 57 #.# micron CMOS 57 pultrusion 57 hydride vapor phase 57 monolithic CMOS 57 pHEMT 57 metalized 57 electroformed 57 piezo actuators 57 epitaxy 57 rigid substrate 57 solder pastes 57 flex rigid 57 MTP MPO 57 QFN package 57 thermoplastic materials 57 spiral inductors 57 selective soldering 57 silicon germanium SiGe 57 8mm diameter 57 die bonder 57 eutectic solder 57 solder bumping 57 silicon nitride 57 microelectronic packaging 57 Datamate 57 DIN rail mounting 57 sol gel 57 geometries 57 chipscale 57 QFPs 57 optically coupled 57 wafer thickness 57 liquid crystal polymer 57 selective emitter 57 aluminum electrolytic capacitors 57 Si substrates 57 EVG# 57 CAN transceiver 57 dimensionally stable 57 LSA#A 57 solder mask 57 vias 57 8 pin SOIC 57 conductive plastics 57 #μm [002] 57 varistor 57 silicon interposer 57 #.#mm x [003] 57 #AWG 57 crystal resonator 57 density interconnect HDI 57 laser diode modules 57 electroless nickel 57 di selenide CIGS 57 AFM probes 57 Leadless 57 gate dielectrics 57 sintered 57 solder bump 57 C0G 57 Si substrate 57 tantalum capacitor 57 x 3mm 57 insert molding 57 dual damascene 56 SiGe bipolar 56 extruded profiles 56 printed circuit 56 SOI MEMS 56 piezoceramic 56 subminiature 56 pin TDFN package 56 #.# micron node 56 transparent electrode 56 metallisation 56 Czochralski 56 III nitride 56 elastomeric 56 SOI substrates 56 TQFN 56 D2PAK 56 stripline 56 voltage divider 56 pin LQFP 56 pin TSSOP package 56 PA6 56 monolithic microwave integrated 56 pMOS 56 #um [002] 56 conductive adhesives 56 wafer bonding 56 dielectric 56 reactive ion 56 varistors 56 solderless 56 pin DIP 56 mm BGA 56 FinFET 56 brazed 56 reflow solder 56 capacitances 56 4mm thick 56 InP 56 Silicon Germanium 56 electroplated 56 submerged arc welding 56 micromachining 56 5V CMOS 56 circular connectors 56 oxide semiconductor 56 inductors 56 polymer composite 56 thermoset 56 GaAs substrate 56 nanoporous 56 backplane 56 filament winding 56 DIN rail mount 56 organic TFTs 56 ferrite core 56 TVS diodes 56 SiT# 56 germanium substrates 56 indium arsenide 56 Ultem 56 thermo mechanical 56 displays FPD 56 Virtex 5 56 silicon 56 SMT 56 bonder 56 superlattice 56 low k dielectric 56 optical waveguides 56 composite laminates 56 QMEMS 56 Hastelloy C 56 polymer matrices 56 varactors 56 MCP#X 56 planar 56 LQFP package 56 carbon steels 56 microvia 56 #x#mm [002] 56 ZMD# 56 thermocouple 56 W mK 56 pin BGA packages 56 Sn Pb 56 Gallium Arsenide 56 sapphire substrate 56 silicone elastomers 56 wafer probers 56 cemented carbide 56 gate electrode 56 superalloys 56 austenitic stainless steel 56 InGaP 56 #.#mm x #.#mm [003] 56 mm diameters 56 extruded aluminum 56 thermosetting resin 56 MSOP packages 56 solder reflow 56 SOI wafer 56 nanocrystalline 56 multilayers 56 aspheric lenses 56 Inductors 56 SAW oscillators 56 InGaN 55 conductive inks 55 fused silica 55 multilayer printed 55 solder paste 55 epi wafers 55 discretes 55 BJTs 55 biaxial 55 epoxies 55 5mm x 5mm 55 μm thick 55 thermosets 55 pin TQFP 55 crystalline Si 55 FPCs 55 MESFET 55 backshells 55 microcapillary 55 #.#μm [002] 55 micrometer thick 55 indium gallium arsenide 55 ionomer 55 FusionQuad 55 pre preg 55 thermocouples 55 film transistors TFTs 55 formability 55 Qspeed diodes 55 weldable 55 SOIC package 55 optoelectronic packaging 55 coplanar 55 SiP 55 GaAs substrates 55 ZnS 55 forgings castings 55 #L stainless steel 55 SAC# 55 #x# mm [004] 55 SOIC 8 55 thyristor 55 potentiometers 55 coldrolled 55 line BEOL 55 indium phosphide 55 mm ² 55 photodiode 55 SiO 2 55 polytetrafluoroethylene PTFE 55 optical waveguide 55 alumina ceramic 55 electro galvanized 55 wire bonders 55 CBT resin 55 GaN layers 55 wafer bonder 55 flux cored wire 55 GaAs InP 55 MicroLeadFrame 55 eWLB technology 55 piezoelectric ceramic 55 HEMT 55 insulator substrate 55 cuvette 55 nanotube arrays 55 thermoset composites 55 glass frit 55 #.#μm [001] 55 metal matrix composites 55 8mm x 8mm 55 resistor arrays 55 Epitaxial 55 SOI wafers 55 SN#C 55 #x# mm [003] 55 flexible substrates 55 weldments 55 #.#μm CMOS process 55 ceramic substrate 55 AVR microcontrollers 55 TDFN package 55 integrated circuits IC 55 8 pin MSOP 55 thermoformable 55 polypropylene resin 55 capacitance values 55 Formex GK 55 metallizing 55 multicrystalline 55 conductive polymer 55 capacitive touch sensor 55 Injection molding 55 rotary actuators 55 serdes 55 #nm #nm [002] 55 #μm thick [002] 55 photoresists 55 integrated passives 55 alloyed steel 55 CMOS processes 55 backplanes 55 CMOS circuitry 55 antireflective coatings 55 polishing pads 55 #nm silicon 55 fluoropolymer 55 thermoform 55 stainless steel fasteners 55 nMOS 55 x #.#mm [005] 55 liquid crystal polymers 55 strain gage 55 imprint lithography 55 laser welding 55 RF connectors 55 silicon oxynitride 55 conductive adhesive 55 titanium carbide 55 APTIV film 55 Picogiga delivers advanced 55 ferrules 55 PIN diodes 55 nitride semiconductor 55 Backplane 55 fusion splice 55 thermoforming 55 hardcoat 55 CMP consumables 55 DFN# 55 pin SSOP 55 aluminum housings 55 transparent conductive 55 impedance matching 55 nm CMOS 55 encapsulant sheets 55 thermoplastic rubber 55 SSOP packages 55 InGaP HBT 55 crystalline silicon c 55 MOS transistors 55 8 pin TDFN 55 BGA package 54 AEC Q# qualified 54 DIN rail mounted 54 TGA# SL 54 FEOL 54 polyvinylidene fluoride PVDF 54 opto electronic 54 5μm 54 laser micromachining 54 nanometer CMOS 54 prepregs 54 TQFP package 54 mounting flanges 54 SiON 54 GaAs MESFET 54 RoHs compliant 54 circuit MMIC 54 flanges 54 phenolic resins 54 microporous 54 ISL#M 54 CPC# [001] 54 mount inductors 54 EMI Filters 54 AlGaAs 54 ATtiny# 54 PQFP 54 pin BGA 54 SMA connectors 54 polyethylene fiber 54 thermoset composite 54 wafer uniformity 54 toolholder 54 silicon wafer 54 InGaAs 54 meltblown 54 thermo compression 54 structural adhesives 54 Indium Phosphide 54 solder alloys 54 oxide layer 54 UVTP 54 density fiberboard 54 PMOS transistors 54 #mm# [002] 54 SOI substrate 54 crystalline silicon wafers 54 bicomponent 54 projected capacitive touch 54 Z Foil 54 defect densities 54 SOIC 54 silicide 54 TQFP packages 54 measuring #.#mm x [001] 54 mechanical polishing CMP 54 DFN package 54 galvannealed 54 thermally enhanced 54 cermet 54 block copolymer 54 waveguides 54 resin infusion 54 3mm x 3mm 54 CMOS wafers 54 HBLEDs 54 pin SOT 54 AlGaN 54 silicon oxide 54 silicate glass 54 CMOS IC 54 triplexer 54 superabrasives 54 amorphous silicon 54 epoxy resin 54 PHY# [001] 54 VICTREX PEEK polymer 54 Elastomeric 54 semiconductor wafer 54 aluminum extrusions 54 fluoropolymer coatings 54 TPEs 54 piezo ceramic 54 urethane 54 SiC substrate 54 austenitic 54 MSOP package 54 DirectFET MOSFET 54 lidding 54 diplexers 54 M# connectors 54 MEMS resonators 54 pin TSSOP 54 PowerDI TM 54 PoE PD 54 thinner wafers 54 balun 54 DryLin 54 indium gallium phosphide 54 hafnium oxide 54 Expanded Polystyrene EPS 54 parasitic inductance 54 SiC substrates 54 vertical cavity 54 prepreg 54 photolithography 54 CIGS solar cell 54 TSVs 54 InSb 54 thermoplastic polyurethane TPU 54 5mm x 5mm QFN 54 photodiode arrays 54 CIGS photovoltaic PV 54 MIC#/# 54 adhesive bonding 54 #um [001] 54 nickel hydroxide 54 elastomer 54 CIGS copper indium 54 TDFN packages 54 2mm x 3mm DFN 54 heat spreaders 54 #nm CMOS [001] 54 Chip Scale 54 fiber optic transceivers 54 1mm x 1mm 54 cordsets 54 solderability 54 tin oxide 54 lanthanum aluminate 54 martensitic stainless steel 54 Micromorph 54 SWCNT 54 thermoformed 54 static dissipative 54 CAN transceivers 54 wafer metrology 54 PTFE 54 transparent electrodes 54 Gallium Arsenide GaAs 54 AirMax VS 54 polyphenylsulfone 54 #.#in [004] 54 EMIF# 54 borosilicate 54 solder 54 Fine Pitch 54 Tantalum Capacitors 54 BiCMOS 54 K dielectrics 54 CIGS cells 54 Schottky 54 low k dielectrics 54 zirconium hafnium 54 Bulk Metal 54 busbars 54 SOT# [002] 54 DFN packages 54 Polyimide 54 ENIG 54 glass substrate 54 nm wavelengths 54 k dielectric 54 Flash microcontroller 54 3Xnm 54 fusion splicing 54 polybutylene terephthalate 54 silicon CMOS 54 weldability 54 5mm x 54 anneal 54 beamsplitters 54 Metallization 54 PCB layout 54 3mm x 54 encapsulant 54 analog ICs 54 LVDS interfaces 54 Thermoflex 54 HardCopy 54 metal oxide varistors 54 nitinol 54 photodetectors 53 GaN substrates 53 solder joints 53 MWNT 53 MMICs 53 UHMW 53 2μm 53 Serial EEPROMs 53 #.#x#.#mm 53 3mm DFN 53 nm CMOS process 53 furnaceware 53 transparent conductive coatings 53 injection moldable 53 #.#mm thick [002] 53 Stratix III FPGAs 53 μm diameter 53 DFB lasers 53 CMOS fabrication 53 EMI shielding 53 #.#um CMOS 53 feedthrough 53 fused quartz 53 thermally bonded 53 PZT 53 #.#um [002] 53 x 5mm 53 Powerful debug 53 polycrystalline diamond 53 Galvalume 53 pin SOIC package 53 thermoplastic polyester 53 microcrystalline 53 wirewound resistors 53 alloy 53 aluminum nitride AlN 53 polyimides 53 LMX# 53 silicon germanium SiGe BiCMOS 53 pin PDIP 53 Zener diodes 53 spherical bearings 53 SMT LEDs 53 Substrate 53 XFP module 53 PVDF 53 toroids 53 semiconductive 53 Thermoplastic Elastomer 53 polycrystalline 53 Indium Phosphide InP 53 ArF immersion lithography 53 capillary electrophoresis 53 EXTreme 53 focused ion beam 53 axial leaded 53 streptavidin 53 gear reducers 53 microcavity 53 Arria GX FPGAs 53 conductive ink 53 DIN rails 53 compression molding 53 tungsten carbide 53 precision machined 53 JFET 53 bimetal 53 #x# mm QFN 53 polyvinyl butyral PVB 53 #V MOSFET [002] 53 electron beam welding 53 multicrystalline silicon cells 53 clad laminates 53 LFCSP 53 VCSELs 53 1mm thick 53 micro machining 53 linear motors 53 epitaxy HVPE 53 PBGA package 53 boards PCBs 53 #mm ² [001] 53 poly crystalline 53 thermoformed packaging 53 SOIC packages 53 bipolar transistors 53 PIN photodiodes 53 pore sizes 53 wafer 53 HEMTs 53 reflowed 53 ferrule 53 daughtercards 53 Cree GaN 53 thermo plastic 53 ballscrew 53 crystal oscillators 53 flexographic plates 53 boundary scan 53 solder spheres 53 mandrels 53 cone woofers 53 AQ# [001] 53 Cable Assemblies 53 PVD coated 53 acetal 53 piezoresistive 53 metals alloys 53 lithographic processes 53 TOSA ROSA 53 CdSe 53 multilayer ceramic capacitors MLCC 53 resins additives 53 5mm QFN package 53 7 x 7mm 53 aramid 53 thermoplastic elastomers 53 silicone rubber 53 mask aligner 53 nonlinear optical 53 copolymer 53 precise tolerances 53 thermoelectric cooler 53 multilayer ceramic capacitors 53 indium gallium phosphide InGaP 53 nanofilm 53 extruded aluminum chassis 53 heatpipe 53 6mm x 53 2mm x 2mm 53 nano patterning 53 metallized 53 electro mechanical components 53 nanopowder 53 nanoimprint lithography NIL 53 extrusion coating 53 mm dia 53 GaAs 53 nm nodes 53 PQFN package 53 discharge ESD protection 53 TO #AB 53 polymeric 53 colloidal silica 53 temporary wafer bonding 53 spherical roller bearings 53 LTPS TFT 53 CMOS compatible 53 thermoplastic composite 53 airgap 53 intermetallic 53 GaN layer 53 Cadmium Telluride CdTe 53 RFCMOS 53 Insulator SOI 53 ZnO 53 TQFP# 53 Cold Cathode Fluorescent Lamps 53 extruded sheet 53 PEX tubing 53 amplifier modules 53 extrusion molding 53 bandpass filters 53 2Gbit 53 ultrasonic welding 53 wafer processing 53 toolholding 53 photopolymer 53 transistor arrays 53 inductance 53 epitaxial wafers 53 7mm x 53 coated polyester 53 PEDOT PSS 53 1μm 53 aluminum heatsink 53 polybutadiene 53 Link Microtek 53 ferrite cores 53 monocrystalline silicon 53 GaAs HBT 53 bipolar CMOS DMOS 53 mounting flange 53 mask ROM 53 thermistors 53 nanolayers 53 ATmega#P [001] 53 zirconium oxide 53 aluminized 53 EEPROMs 53 bonders 53 2mm thick 53 molded foam 53 UV stabilized 53 5kV 53 BiFET 53 electroluminescence EL 53 barium titanate 53 wafer foundries outsource 53 polymer 53 FR4 53 glulam 53 thermistor 53 nickel alloy 53 RF Microwave 52 silicon photonic 52 borosilicate glass 52 c Si 52 aluminum electrolytic 52 PECVD 52 voltage MOSFETs 52 microfluidic chips 52 coiler 52 VARTM 52 thermoplastic polymer 52 UMC #.#um 52 #.#μm CMOS 52 homopolymers 52 pre pregs 52 semiconductor wafers 52 die castings 52 TFTs 52 pin TSOP 52 hardfacing 52 thermoplastic elastomer TPE 52 capacitive touch panels 52 Amorphous silicon 52 SPDT switch 52 magnetic encoders 52 shaft diameters 52 thermoplastic resins 52 electroless 52 TrueStore 52 thermoplastic compounds 52 #Gbit [001] 52 solid carbide 52 SO8 package 52 gallium indium arsenide 52 auxetic 52 #/#T 52 biocompatible polymers 52 deburring 52 magnetostrictive 52 AlN layer 52 #x#mm QFN 52 transceiver modules 52 gallium nitride 52 pin TQFN package 52 rigid foams 52 flux cored wires 52 nanocrystalline diamond 52 Helios XP 52 polymer substrate 52 macroporous 52 crystallinity 52 tinning 52 NdFeB 52 thermosetting 52 electrogalvanized 52 optical isolators 52 Cu interconnects 52 microtubes 52 GaAs gallium arsenide 52 ZnSe 52 engineered substrates 52 LQFP# [001] 52 3mm x 3mm DFN 52 Bragg grating 52 warpage 52 ridge waveguide 52 IC packaging 52 x 9mm 52 epoxy adhesives 52 SDRAMs 52 resistors capacitors 52 Mbit SRAMs 52 1Gbit DDR2 52 4 x 4mm 52 Germanium 52 extruded polystyrene 52 mask aligners 52 nm VCSEL 52 VCSEL 52 voltage CMOS 52 wafer prober 52 polyetheretherketone PEEK 52 tiny 2mm x 52 TSSOP# 52 workpieces 52 StratEdge 52 QSFP + 52 aspheres 52 nanoimprint 52 CMOS 52 nickel silicide 52 pin 4mm x 52 heat shrinkable tubing 52 parasitic capacitance 52 coreless 52 anodising 52 tantalum nitride 52 #μm [001] 52 ferrites 52 silicone tubing 52 8kV 52 aramid fibers 52 Hysol 52 line FEOL 52 automated wafer bonding 52 Mach Zehnder modulators 52 Photolithography 52 CdTe Si 52 annealing 52 phototransistor 52 pin TQFN 52 hermetic packaging 52 Valox 52 FPC connectors 52 desoldering 52 TOSAs 52 LabChip 52 bond aligner 52 Vectran 52 multilayer 52 monofilaments 52 extruded 52 Mbit MRAM 52 walled carbon nanotube 52 nematic 52 PEDOT 52 SWNT 52 reflow 52 modular conveyors 52 solventless 52 silicon etch 52 Pseudo SRAM 52 crosslinked 52 wedge bonder 52 6mm x 6mm 52 piezoelectric actuators 52 HV# [001] 52 microfabrication techniques 52 antifuse 52 Novellus SABRE 52 NMOS 52 TSSOP packages 52 ATA# [002] 52 polyamides 52 optical coatings 52 crystalline silicon 52 pulsed laser deposition