millimeter mm

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(Click for frequent words.) 68 x 1mm 67 x #.#mm [005] 67 pin BGA 67 x 9mm 66 #.#x#.#mm 66 mm BGA 66 x 5mm 65 7mm x 7mm 65 x 6mm 65 #mm ² [001] 65 5μm 65 mm × 65 #x# mm [004] 65 #.#μm [001] 65 mm QFN package 65 4 x 4mm 64 #mm ² [002] 64 × #mm [002] 64 SOT# [002] 64 x 3mm 64 #x# mm [003] 64 .# micron 64 mm QFN packages 64 5mm QFN package 63 x 7mm 63 Gb NAND 63 DFN packages 63 leadless package 63 5mm x 5mm 63 lead LFCSP 63 mm ² 63 5mm x 63 pin BGA package 63 4U chassis 63 x 8mm 63 3 x 3mm 63 mm QFN 63 #.#mm x [001] 63 #.#um [001] 63 8mm x 8mm 63 x #.#mm package 63 inch sapphire wafers 62 #.#μm CMOS 62 7mm x 62 pin BGA packages 62 mm LFCSP 62 pin LQFP package 62 #x#x#.#mm [003] 62 1Gbit DDR2 62 sq. mm 62 3mm DFN package 62 3 mm DFN 62 LQFP 62 TDFN package 62 6mm x 6mm 62 #.#nm [002] 62 #.#mm x #.#mm [003] 62 ATtiny# 62 #.#μm CMOS process 62 BGA packaging 62 pin QFN 62 3mm x 3mm 62 millimeters mm 61 7 x 7mm 61 #mm# [003] 61 pin TQFP 61 #.#mm x #.#mm [002] 61 crystalline Si 61 capacitance values 61 #.#mm x [003] 61 SOT# [001] 61 #.#u 61 Measuring #mm [001] 61 pin SSOP package 61 SO8 61 TQFP packages 61 pin PBGA package 61 #um [002] 61 micron pixels 61 GB DDR2 61 measuring #.#mm x [001] 61 #x#mm [002] 61 #mm x #.#mm [002] 61 5mm x 6mm x 61 CMOS wafers 61 QMEMS 61 pin LFCSP 61 #cm x 61 wph 61 epiwafers 61 PBGA package 61 nm CMOS 61 pin SOIC packages 61 MSOP packages 61 pin QFN package 61 2mm x 2mm 61 pin SOIC 61 nanometers nm 60 poly crystalline 60 6mm x 60 4mm x 4mm QFN 60 pin MLF 60 Mbit SRAMs 60 #x# mm QFN 60 × #.#mm [002] 60 #.#mm# [001] 60 chipscale 60 silicon oxynitride 60 nm CMOS process 60 gigabit DDR3 SDRAM 60 x #.#mm [003] 60 TDFN packages 60 x 2mm 60 #.#mm thick [002] 60 SOI CMOS 60 #.#um CMOS 60 #.#mm x [002] 60 TQFP package 60 pin SOT 60 MIM capacitors 60 #mm# [002] 60 pin LQFP 60 QFN packages 60 #.#x#.# 60 BGA packages 60 #x#mm [004] 60 ISL#M 60 pin TSSOP package 60 #.#mm x #.#mm x [002] 60 #.# micron CMOS 60 pin TSSOP 60 x #.#mm [001] 60 3mm x 60 POWER5 + 60 rack mountable 1U 60 millimeter wafer fabrication 60 #.#mm [002] 60 MB#R# 60 #.#mm x #mm [002] 59 #μm [002] 59 x 3cm 59 millimeter wafer 59 kbit 59 micrometre 59 NEC Yamagata 59 #nm #nm [002] 59 Mbit MRAM 59 OptoCooler HV# 59 micro SMD package 59 TDFN 59 #.#mm x #.#mm [004] 59 x #.#in [001] 59 Elpida #nm 59 x4 x8 59 W mK 59 WLCSP 59 mm diameters 59 #mm x 59 8mm diameter 59 Vsby 1 59 micron 59 CMOS fabrication 59 TQFP 59 inch wafer fabrication 59 pin DIP 59 MLPQ package 59 pin TDFN package 59 pin 3mm x 59 4mm x 59 VGA TFT LCD 59 TFT LCD module 59 AQ# [001] 59 #GB RDIMM 59 rack mount chassis 59 sapphire wafer 59 Gb NAND flash 59 diode arrays 59 cm diagonal 59 AlGaAs 59 μm thick 59 nanometer node 59 FBGA package 59 multilayer ceramic 59 bipolar transistors 59 QFN# package 59 4mm x 4mm 59 pin SSOP 59 mm wafer fabrication 59 Imprio 59 monolithically integrated 59 GaAs substrates 59 nm immersion 59 PowerDI TM 59 optical transceiver modules 59 nm VCSEL 59 #nm SOI 59 L#A [001] 58 BGA package 58 #nm MirrorBit 58 4U rack 58 thermally enhanced MSOP 58 Gbps transceivers 58 mm DFN package 58 cm ² 58 SSOP packages 58 #Gb MLC NAND 58 #x#x#mm [001] 58 mm 58 GB DDR3 58 PQFN package 58 CRIUS 58 XFP module 58 millimeter silicon wafers 58 #.#mm x #.#mm [001] 58 Yokkaichi Operations 58 wafer thickness 58 Measuring #mm [002] 58 milliohm 58 #pF [001] 58 SOIC 8 58 #.# micron node 58 #mm# [001] 58 DongbuAnam 58 8 pin SOIC 58 micron thick 58 SOIC packages 58 DFN package 58 D2PAK 58 XT #i 58 2mm x 58 #.#in [004] 58 nm wavelengths 58 #mm fabrication 58 pin 4mm x 58 pin TQFN 58 pin QFN packages 58 SOP Advance 58 #cm diagonal 58 #x#x#.# mm 58 gigabit Gb NAND flash 58 Oxide Silicon 58 megabit Mb 58 AIX #G# 58 wafer dicing 58 SiC MOSFET 58 3mm x 3mm x 58 pin SOIC package 58 1μm 58 VECTOR Extreme 58 DDR2 DRAM 58 #mm x #mm [001] 58 Gb sec 58 ADA# 58 pin TQFP package 58 TCS# 58 monocrystalline silicon wafers 58 indium gallium phosphide InGaP 58 radial leaded 58 x #.#cm [001] 58 TPC# H 58 pin MSOP 58 #.#μm [002] 58 2mm x #.#mm 58 inch WUXGA 58 WUXGA resolution 57 ANSI lumen 57 nanometer silicon 57 pin PDIP 57 OptiMOS 57 x 2in 57 MAX# MAX# [001] 57 gigabit Gb 57 Silicon Germanium 57 WxDxH 57 nm SOI 57 inch wafer fab 57 ohm cm 57 InAs 57 micron pixel 57 LQFP# package 57 TO #AB 57 SOIC package 57 fab Fab 57 SPDT switch 57 #nm CMOS [002] 57 #mm x #mm [006] 57 Gbps transceiver 57 mm silicon wafers 57 Dell PowerEdge M# 57 PQFN 57 leadless 57 #Mx# [001] 57 TQFN 57 Fab #i 57 mono crystalline 57 MEMS fabrication 57 x #.#mm [004] 57 microstrip 57 iCoupler 57 Sequans SQN# 57 SiC wafers 57 tiny #.#mm x 57 nanometer lithography 57 5nm 57 PQFP 57 ARM#EJ processor 57 nm DRAM 57 meter rotor diameter 57 8 pin MSOP 57 TQFP# 57 InSb 57 #mm x #mm [005] 57 #.#mm x [005] 57 mm wafer 57 Indium Phosphide InP 57  m 57 nanometer CMOS 57 5V CMOS 57 optically coupled 57 silicon photonic 57 #x#mm package 57 tiny 3mm x 57 Ball Grid Array 57 wafer metrology 57 kilobytes KB 57 defect densities 57 FCBGA package 57 epitaxial wafers 57 MI #XM 57 μm diameter 57 embedded Wafer Level 57 #Gbit [001] 57 3U rack 57 6 pin SOT 57 1U rack 57 pin 5mm x 57 U#A [002] 57 W/cm2 57 Silicon Oxide Nitride 57 #mm #mm [003] 57 3mm DFN 57 pin TQFN package 57 linewidths 57 x 4mm 57 SATA SSDs 57 MirrorBit Quad 57 oxide semiconductor 57 wafer bonder 57 5mm x 6mm 57 Mbit SRAM 57 QVGA LCD 57 #-#,# mm 57 MBd 57 2U rackmount 57 2U rack 57 leadframes 57 LQFP package 57 μm 57 Industry Highest Density 57 photocoupler 57 QFN packaging 57 phototransistors 57 Gb Ethernet ports 57 silicon germanium SiGe 57 #x#x#mm [002] 57 Toshiba Yokkaichi Operations 57 #Mbyte [001] 57 GFlops 57 WL CSP 57 transistor arrays 57 micron diameter 57 Gigabit DDR2 SDRAM 57 #MB DDR2 [001] 57 Gbit NAND flash 57 DDR2 memory controller 57 #nm 8GB 57 discharge ESD protection 57 #mm x #.#mm [001] 57 dielectric etch 56 wafer probing 56 Fab #A 56 Schottky rectifiers 56 wirebond 56 GaN layers 56 hafnium oxide 56 FCBGA 56 x 4cm 56 MB#K# 56 #.#uF 56 #:#.#-#.# 56 #μF [001] 56 4RU 56 #mA output [002] 56 copper metallization 56 SiC substrates 56 #MSPS 56 MirrorBit ORNAND 56 shaft diameters 56 insulator wafers 56 Gb s gigabits 56 x #mm [001] 56 Follow Vishay 56 pin SOT# 56 millimeter diameter 56 RF transistors 56 PROLITH 56 #.#mm x [004] 56 LQFP# [002] 56 PIC#F# [002] 56 mm wafer fab 56 2μm 56 Gb DDR3 56 crystal resonator 56 amorphous silicon Si 56 solder bump 56 fiber optic transceivers 56 amorphous silicon TFT 56 ° C. Brush 56 Agilent #A [001] 56 wafer bumping 56 DDR2 SODIMM 56 Kbit 56 indium gallium arsenide InGaAs 56 Gigabyte GB 56 #mm x #mm [007] 56 x #.#in [002] 56 LQFP# [001] 56 #bit ADCs 56 MOCVD reactor 56 LMX# 56 multicrystalline 56 #nm NAND flash 56 #nm Virtex 56 GB DDR2 memory 56 solar PV module 56 Megabit Mb 56 OLED microdisplay 56 E pHEMT 56 QSOP 56 digital multimeter DMM 56 produced plasma LPP 56 CIGS Copper Indium 56 #mm x #mm x 56 MAX# integrates 56 #mm x #.#mm [003] 56 #.#mm [005] 56 PBGA 56 mW cm 2 56 SKY# #LF 56 Gbit DDR3 56 backplane connectors 56 nm SRAM 56 5mm x 5mm QFN 56 numerical aperture NA 56 bump micro SMD 56 TWINSCAN XT 56 fused quartz 56 InGaP HBT 56 furnaceware 56 QXGA 56 #/#-inch diameter 56 TLP# 56 2Gbyte 56 × #cm 56 pin QFP 56 #Gbps Ethernet switch 56 #.#kV [001] 56 EUV masks 56 6nm 56 1GB DDR2 56 laterally diffused metal 56 1RU rack 56 Westmere processors 56 dielectric layers 56 8Gbit 56 #Mx# [002] 56 optical waveguides 56 2Gbit 56 +# oC 56 CMOS logic 56 ZXLD# 56 3mm thick 56 PaxScan 56 #.#mm x #.#mm x [004] 56 PIN photodiode 56 GaSb 56 MK#GAH 56 monolithic CMOS 56 ferrite core 56 Virtex 5 56 #Mbit equivalent 56 pin TQFP packages 56 #nm CMOS [001] 56 laser interferometer 56 2Xnm 56 nonpolar GaN 56 Powerful debug 56 Structured eASIC 56 #nm nanometer 56 ADXL# 56 nm NAND flash 56 x#.# x#.# 56 pMOS 56 4mm thick 56 QFN# 56 6T SRAM 56 CCFL LCD 56 2mm x 2mm DFN 56 cm -2 56 2nm 56 mu m 56 nm nodes 56 KosaiPM 56 dimensional tolerances 56 indium gallium phosphide 56 optical waveguide 56 mm2 55 capacitances 55 CRIUS II 55 VIISta 55 SOFC stacks 55 tiny 2mm x 55 #mm wafer fab 55 pixel CCD 55 tuner IC 55 PIN photodiodes 55 TSSOP 55 fusion splice 55 Si substrate 55 gigabit NAND flash 55 subwavelength 55 PowerBook G4 #mb SO 55 ceramic capacitor 55 CMP consumables 55 SOI substrates 55 photolithographic 55 LSISAS# 55 mW/cm2 55 Northbridge chipset 55 Yokkaichi Japan 55 RF LDMOS 55 #nm MLC 55 wirewound 55 Flash microcontrollers 55 DarkChip 55 SM# [001] 55 package SiP 55 cm diameter 55 SiGe C 55 surface mountable 55 2U enclosure 55 film transistor TFT 55 AOZ# 55 microwatt 55 in. dia 55 RFMD GaN 55 DirectFET ® 55 chip resistor 55 QFN 55 Cortex M0 processor 55 Silicon Germanium SiGe 55 wire resistive touchscreen 55 DFN# 55 AccelArray 55 #x#x#mm [003] 55 Mach Zehnder 55 ferroelectric liquid crystal 55 SiT# 55 heterostructure 55 mm diameter 55 eWLB 55 DWDM SFP 55 varactors 55 #nm #nm #nm 55 #nm SRAM 55 x8 PCI Express 55 MHz DDR3 55 #G DQPSK 55 Platform FPGAs 55 Micron Boise Idaho 55 LSA#A 55 diameter rotors 55 microbolometer 55 #nm lithography [002] 55 AT# [001] 55 8 pin TDFN 55 nanometers nanometer 55 #nm DRAM 55 crystalline silicon c 55 OptoCooler 55 #nm silicon 55 multicrystalline module 55 #μF [002] 55 laser diode modules 55 #.#cm x #cm 55 x 7cm 55 serdes 55 QFP package 55 WL CSP package 55 HRTEM 55 inch diagonal XGA 55 Soitec produces 55 #nm FPGA 55 1mm x 1mm 55 inch wafers 55 Agilent U#A 55 3U rack mount 55 crystalline PV modules 55 JESD# [002] 55 #x#x# mm [001] 55 g cm 55 TSMC #nm process 55 triplexer 55 GaAs fab 55 hydride vapor phase 55 narrow bezel 55 GaAs pHEMT 55 areal densities 55 DDR DRAMs 55 micrometers thick 55 #nm wavelength [001] 55 TSOT 55 CY#C# 55 #.#mm# [002] 55 SanDisk iSSD 55 AXi 55 TGA# SM 55 mm x 55 microampere 55 mOhm 55 XRT#L# 55 OSTAR Compact 55 Chip Scale 55 #Kbyte [001] 55 SO DIMM 55 GaN transistor 55 TC#XBG 55 nH 55 indium phosphide InP 55 wire resistive touch 55 CIS CIGS 55 #.#cm thick [001] 55 wire bondable 55 SMT LEDs 55 #mm wafer 55 TSSOP# 55 micro machining 55 picometers 55 e beam lithography 55 55 ATmega#P [001] 55 #nm laser [002] 55 #μm thick [002] 55 backside illumination BSI 55 LX#T 55 Nanometer 55 magnetic encoder 55 line BEOL 55 GHz RF transceiver 55 LQFP packages 55 SO8 package 55 Scale Package 55 rackmount servers 55 nm MirrorBit 55 #x#mm [005] 55 k gate dielectrics 55 x 5cm 55 CMOS transistors 55 1U 2U 55 nm lithography 55 #Kbyte [002] 55 #.#x#.#x#.# 55 cRIO 55 #.#-# mm 55 TSMC #.#um 54 inch transflective 54 pin #x#mm 54 subrack 54 oxide thickness EOT 54 megapixel #/#.#-inch 54 inch Wide XGA 54 #x#x# inches [002] 54 micron wafers 54 #GB DDR3 54 Gallium Nitride 54 multicrystalline solar cells 54 laser scribing 54 cryogenically cooled 54 x 6in 54 #.#pF 54 Intel Xeon CPUs 54 SOIC 54 SiS# chipset 54 NEMA 4X enclosure 54 nanometer billionth 54 HS# blades 54 CMOS compatible 54 DDR3 modules 54 LTPS LCD 54 CMOS IC 54 OPTIMASS 54 planar waveguide 54 nanometers billionths 54 dBi gain 54 High Voltage CMOS 54 5 axis CNC 54 linearly polarized 54 micrometer scale 54 absorption coefficient 54 LDMOS RF power 54 VCXO 54 axis accelerometers 54 DIN rail mountable 54 measuring #mm x 54 SD P# 54 inch diagonal display 54 diameters ranging 54 bit RISC processor 54 compact 2U 54 2kV 54 SFP + transceivers 54 micron pixel pitch 54 laser micromachining 54 bit RISC CPU 54 rpm spindle 54 LVCMOS 54 deep ultraviolet DUV 54 3U chassis 54 Si TFT 54 MegaRAID SATA 54 DDR2 SO DIMM 54 carbon nanotube CNT 54 XFP optical 54 XDR DRAM 54 1mm thick 54 #u [001] 54 x #.#cm [003] 54 mm equiv 54 epi wafers 54 rotary potentiometer 54 PJD# 54 μF 54 mm dia 54 #nm node [002] 54 #mm silicon wafer 54 LTPS TFT 54 GDDR memory 54 epitaxial deposition 54 weighs #.#kg [001] 54 transceiver module 54 CyberDisplay #K 54 #Kbytes [002] 54 #GBASE T PHY 54 #nm 1Gb 54 monocrystalline wafers 54 μm particle 54 ZMD AG 54 CY# [003] 54 SFP + optical 54 #mm wafer fabrication 54 NXT #i 54 #x#x# mm [003] 54 microns thick 54 microbolometers 54 Land Grid Array 54 SOT# package [001] 54 Insulator SOI 54 sub Angstrom 54 GHz Dual Core 54 3Xnm 54 #.#mm thick #mm 54 #GbE switch 54 transistor HEMT 54 pulse durations 54 micrometer 54 conductivities 54 SiPs 54 #.#mm [003] 54 logic elements LEs 54 micrometer thick 54 FinFET 54 Pseudo SRAM 54 Kingston HyperX memory 54 Damaging hail 54 mono crystalline solar 54 sapphire wafers 54 #Gbyte [002] 54 #nm wavelengths 54 mm fab 54 microns millionths 54 SOI wafer 54 megapixel CMOS image 54 ion implanters 54 fully synthesizable 54 aluminum gallium indium 54 8GHz 54 silicon epitaxial 54 STK# [001] 54 nm 54 Intel Nehalem microarchitecture 54 HxWxD 54 nano imprint 54 gallium phosphide 54 AFBR 54 leadless packages 54 EasyTube ™ 54 measures #.#mm x 54 TMP# 54 DIN rail mounted 54 measures #mm x 54 TQFN package 54 controller ICs 54 packaging WLP 54 ⁰ C 54 CIGSe 54 HEMT 54 SiGe bipolar 54 #.# inch XGA 54 rigid substrate 54 ZMD# 54 4Mbit 54 Buried Wordline technology 54 #.#mx [001] 54 nano patterning 54 M#K 54 JFET 54 varistor 54 voltage divider 54 nanometer nm NAND flash 54 UMC #.#um 54 GaAs FET 54 #μm [001] 54 DMOS 54 BrightView display 54 7mm thick 54 transceiver IC 54 SATAII 54 triaxial 54 #nm SoC 54 terrestrial concentrator 54 XR#V# [002] 54 thermally enhanced 54 Gigahertz GHz 54 GaN HEMTs 54 EFEM 54 UMC #nm 54 inch widescreen #:# 54 inch rack mountable 54 FPF# 54 #GBASE SR 54 2mm x 3mm DFN 54 Cortex M4 processor 54 amorphous TFT LCD 54 3mm x 3mm DFN 54 ProASIC Plus 54 Westmere EP 54 consumes #mW 54 SMD LEDs 54 RU chassis 54 embedded EEPROM 54 iSPAN 54 #.#μ 54 silicon carbide substrates 54 cone woofer 54 PAM# [002] 54 Stratix III FPGAs 54 #mm silicon wafers 54 hollow cylinders 54 TAS# [001] 54 nanometer transistors 54 nanowatts 54 crosspoints 54 TFBGA 53 GaP 53 BiCMOS 53 4Gb NAND flash 53 LDO voltage regulator 53 MSOP package 53 epitaxial wafer 53 x #mm WDH [002] 53 DarkChip3 53 CMOS silicon 53 ASML TWINSCAN 53 TMS#C# DSP 53 AEC Q# qualified 53 ZnSe 53 Dual Core Opteron 53 3nm 53 X ray microscopy 53 Sigma fxP 53 fpgas 53 eWLB technology 53 DC DC CONVERTERS 53 reactive ion 53 #.#mm diameter [002] 53 UVision 53 GaN wafers 53 TFT LCD display 53 #.#GHz Quad Core [002] 53 #.#in TFT [001] 53 rack mountable chassis 53 C0G 53 GaAs substrate 53 #/#.#in 53 Gaussian beam 53 Wide XGA 53 pin SOT# package 53 XA Spartan 3A 53 LFCSP 53 MAX#/MAX# [002] 53 2G HTS wire 53 PF# [002] 53 MetaSDRAM 53 powerline modem 53 FBGA 53 ATR# [002] 53 Copper Indium Gallium Selenide 53 Mini ITX motherboard 53 silicon waveguides 53 Kameyama Plant No. 53 ARM9 core 53 nMOS 53 consumes #.#W 53 Agilent B#A 53 ATMEL 53 CdTe Si 53 kS s 53 niobium titanium 53 Gallium Arsenide GaAs 53 photomultipliers 53 compact #x#mm 53 parasitic inductance 53 JFETs 53 XinTec 53 #um [001] 53 X7R 53 computational lithography 53 #bit ADC 53 aspherical lens 53 x #in 53 DAPDNA 53 XR#M# 53 UXGA resolution 53 4GB DDR2 53 reinforced thermoplastic 53 iSSD 53 motherglass 53 EP#S# 53 SIMOX 53 epiwafer 53 nm wavelength 53 Polycrystalline 53 +# º C [002] 53 ALD Atomic 53 monocrystalline silicon 53 inch GaAs wafer 53 inch wafer fabs 53 VQFN 53 VGA TFT 53 SMD LED 53 NASDAQ MXIM introduces 53 QFPs 53 #mm x #mm [002] 53 synchronous buck converter 53 dB insertion loss 53 SDRAMs 53 CryptoRF 53 Gallium arsenide 53 ARM#EJ S 53 heat shrinkable tubing 53 RLDRAM 53 interposers 53 EMIF# 53 HV# [001] 53 embedded SerDes 53 x #.#cm [002] 53 #x#x#.#mm [001] 53 threshold voltages 53 thermoelectric cooler 53 NL#BC# [002] 53 Micrometer 53 Compact Flash socket 53 multijunction solar cells 53 MSC# [001] 53 ArF dry 53 NOR Flash memory 53 #cm x #cm x 53 insulator SOI technology 53 SAW oscillators 53 multicrystalline ingots 53 Dektak 53 mm wafer fabs 53 ARM#EJ S processor 53 f#.# f#.# 53 superlattice 53 Altera Stratix II 53 Hitachi Travelstar 53 solar photovoltaic PV modules 53 DIMM socket

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