Related by context. All words. (Click for frequent words.) 70 solder reflow 68 reflow soldering 65 flux residues 65 reflow solder 64 reflow 64 Sn Pb 63 thermal impedance 63 reflow profiles 63 wave soldering 63 input capacitance 63 exotherm 62 moisture absorption 62 particulate contamination 62 capacitive loads 61 thermal dissipation 61 #oF [001] 61 eutectic 61 solder pastes 60 dielectric strength 60 #degC [002] 60 solder paste 60 reflowed 60 #oC [001] 60 TDFN packages 60 excellent solderability 60 transmissivity 60 parasitic capacitance 60 SAC alloys 60 4mA 60 1μm 60 galvanic corrosion 60 capacitances 59 solderability 59 spindle speeds 59 frequency harmonics 59 5μm 59 clamping voltages 59 1ppm 59 leakage currents 59 ohmic 59 milliohm 59 rotational torque 59 temperature coefficients 59 output capacitance 59 microvolts 59 mosfet 59 conductivities 59 compressive stress 59 annealing temperature 59 ownership CoO 59 reflow oven 58 dv dt 58 MLCCs 58 voltage transients 58 solder alloys 58 extractables 58 moldability 58 conduction cooling 58 coating thickness 58 8kV 58 mating cycles 58 solderable 58 OCXOs 58 APTIV film 58 ohm cm 58 microampere 58 wetted parts 58 C0G 58 underfill 58 thermal EMF 58 #Â ° F [002] 58 solder alloy 58 thermal gradients 58 capacitive loading 58 degas 57 #μ 57 melt viscosity 57 parasitic inductance 57 TSSOP package 57 warpage 57 thermally stable 57 temperature coefficient 57 #ppm ° C 57 K dielectrics 57 MΩ 57 inductive loads 57 flowability 57 frictional resistance 57 solder mask 57 1mA 57 RDS ON 57 elastic modulus 57 SMT LEDs 57 W mK 57 crystallinity 57 SnPb 57 SN#C 57 IP# sealing 57 solder bumps 57 resistive element 57 magnetic stirrer 57 electroless copper 57 NiPdAu 57 ° C/# ° F [001] 57 impedances 57 2kV 57 UV stabilized 57 channel MOSFETs 57 thermowell 57 +# deg C [001] 57 reflow soldering processes 57 solder joints 57 defect densities 57 di dt 57 bypass capacitor 57 compressibility 57 cm ² 56 5ppm 56 ° C ambient temperature 56 QFN packages 56 ceramic capacitor 56 viscosity fluids 56 -# ° [002] 56 thermal conduction 56 ruggedization 56 termination resistors 56 +# ° F 56 osmotic pressure 56 BGA packages 56 ASTM C# [002] 56 #kV ESD 56 output impedance 56 conductive epoxy 56 input impedance 56 ± #.#mm [002] 56 thermally conductive 56 ENIG 56 coupling capacitance 56 #Vdc [003] 56 hydrolytic stability 56 mount SMT 56 tantalum capacitors 56 overmolding 56 leaded solder 56 clamping voltage 56 piezo actuators 56 inrush current 56 moisture ingress 56 threshold voltages 56 electromagnetic interference EMI 56 +# º C [002] 56 viscosity liquids 56 washdowns 56 SiO 2 56 flexural modulus 56 friction coefficient 56 sensing resistors 56 accuracy repeatability 56 flame retardance 56 austenitic stainless steels 56 voltage MOSFET 56 #F #C [001] 56 durometer 56 DFN package 56 anneal 56 mm ² 56 tensile stress 56 #uA [001] 56 impedance matching 56 μsec 56 magnetic permeability 56 SOIC package 56 tighter tolerances 56 SOT# package [001] 55 superior heat dissipation 55 #pF [001] 55 NTC thermistor 55 photon detection 55 inductance values 55 mechanical potentiometers 55 eutectic solder 55 ° F/# ° C [001] 55 microamp 55 opto couplers 55 #.degree [002] 55 viscosities 55 #.#in [004] 55 coplanarity 55 voltage MOSFETs 55 HASL 55 #us [002] 55 chemically resistant 55 QFNs 55 gelation 55 dimensionally stable 55 flame retardancy 55 zener diodes 55 external EEPROM 55 conductive adhesives 55 denaturation 55 BGA packaging 55 #ns [002] 55 oxidisation 55 Deg C 55 volumetric efficiency 55 UVTP 55 fluid viscosity 55 selectivities 55 transient voltages 55 reflow solderable 55 laminating adhesives 55 Thermocouples 55 PVC CPVC 55 Quiescent current 55 +# ° C [002] 55 5mA 55 #nA [001] 55 +# deg C [002] 55 1ns 55 bending radii 55 resists corrosion 55 defectivity 55 #V ac 55 ˚ F. 55 nitrided 55 phonon scattering 55 oxide thickness 55 viscous fluids 55 thermally activated 55 RFI EMI 55 wafer thickness 55 light fastness 55 input voltage transients 55 thermowells 55 PID controller 55 #Ω [002] 55 #.#kV [001] 55 planarity 55 W/cm2 54 cam lobe 54 synchronous MOSFET 54 SOT# [002] 54 demagnetization 54 weld bead 54 5kV 54 electrolytic capacitor 54 enthalpy 54 kΩ 54 1kV 54 weld slag 54 IP#K 54 +# degreesC 54 breakdown voltages 54 LED brightness 54 #um [002] 54 voltages 54 +# º C [001] 54 light transmittance 54 Vcore 54 DrMOS 54 chip resistors 54 cleanability 54 #.#Ω 54 Si substrate 54 RO membrane 54 busbars 54 dielectric constants 54 JEDEC Level 54 SAC# 54 recrystallization 54 degreesC 54 Halifax Weather Overcast 54 Schottky diodes 54 μW 54 PIN diodes 54 impedance 54 DUTs 54 metallic ions 54 1μA 54 IP# NEMA 54 toolholder 54 k dielectric 54 μV 54 output voltage 54 8kV ESD 54 transmittance 54 sonication 54 opto coupler 54 LDO voltage regulators 54 harmonic filters 54 conformal coating 54 MgO 54 crystal oscillator 54 instrumentation amplifier 54 dielectric constant 54 hermeticity 54 solvent evaporation 54 regrind 54 ° -# ° [001] 54 eSIP 54 overmold 54 outfeed 54 TiN 54 +# ° C. [001] 54 convection cooling 54 mK 54 thermocouples 54 #.#pF 54 electromigration 54 hydrophobicity 54 nsec 54 emittance 54 ± #kV 54 ± #ppm [001] 54 varistor 54 spherical aberrations 54 nMOS 53 #ns [001] 53 hardcoat 53 √ Hz 53 mΩ 53 pcb 53 intermetallic compounds 53 thermocouple 53 Vrms 53 capacitance 53 sensing resistor 53 thermally induced 53 ^ sup -1 53 SiO2 53 chipscale 53 º Fahrenheit 53 parasitic capacitances 53 tensile modulus 53 #.#mA [002] 53 neointimal proliferation 53 power dissipation 53 thermal foldback 53 #.#μA 53 +# degC [001] 53 martensitic 53 impedance measurements 53 mbar 53 varistors 53 #mA [003] 53 ambient temperatures 53 IP# enclosure 53 DIN rails 53 oC 53 deg F 53 moisture vapor 53 #mohm 53 overvoltage protection 53 TappingMode 53 cyclic loading 53 phototransistor 53 helical gear 53 ml min 53 wet granulation 53 capacitance values 53 Z Foil 53 inductive sensor 53 intermodulation distortion 53 arbitrary waveforms 53 enzymatic degradation 53 tensile strengths 53 Rdson 53 8mm diameter 53 #mV [002] 53 kerf 53 thermal conductivity 53 voltage CMOS 53 conformality 53 AST# 53 resistive loads 53 antireflective coatings 53 dewpoint temperature 53 wirewound 53 transistor leakage 53 C 53 torque transducer 53 wafer uniformity 53 interfacial tension 53 2ppm 53 NiSi 53 IEC #-#-# [002] 53 overcurrent 53 ° C/# 53 repeatable measurements 53 dB insertion loss 53 temperature gradients 53 #.#nm [002] 53 absorbance 53 optocoupler 53 #pF [002] 53 #.degree [001] 53 phototransistors 53 Vdd 53 BJTs 53 thermal coefficient 53 Inductance 53 MLPQ package 53 μS cm 53 #degreesC 53 cordierite 53 input voltages 53 μH 53 4kV 53 degF 53 co planarity 53 #.#V voltage 53 Resistive 53 antistatic properties 53 neutral pH 53 paramagnetic 53 #.#VI O 53 electrically insulating 53 emissivity 53 photobleaching 53 thrombus formation 53 photon flux 53 NiCd 53 optocouplers 53 ballscrew 53 passivated 53 cranking amps 53 VSDs 53 synchronous rectifier 53 4mm thick 53 bend radius 53 metallisation 53 #V AC input 53 ° C 53 planarization 53 Electrostatic Discharge ESD 53 solder paste printing 52 #.#uA 52 #Vac 52 zener diode 52 autosampler 52 pMOS 52 5mm x 6mm 52 thermo mechanical 52 Foil resistors 52 electrostatic discharges 52 ferrite core 52 convection cooled 52 roughening 52 Akulon 52 V ac 52 channel MOSFET 52 harmonic distortion 52 anneals 52 coupling capacitor 52 electrically noisy 52 microamps 52 FieldFox RF VNA 52 Capacitance 52 tensile strain 52 ° C. 52 mOhm 52 geosynchronous orbit reached 52 Mostly Cloudy Currently 52 urine albumin 52 backpressure 52 EMI electromagnetic interference 52 ˚ F 52 flowrate 52 e beam lithography 52 compressive load 52 SO8 52 absolute TCR 52 +# VDC 52 solvent inks 52 pipe diameters 52 reagent consumption 52 moistures 52 bandpass 52 micro amps 52 prefilter 52 halide 52 eluent 52 coil voltages 52 FLD glass 52 Reflow 52 laminations 52 polyimides 52 brightness HB LEDs 52 #V MOSFETs [002] 52 weatherability 52 pellicle 52 silicide 52 ± 8kV 52 Arria GX FPGAs 52 X7R dielectric 52 epitaxial layer 52 hafnium oxide 52 insulative 52 reaction kinetics 52 decoupling capacitor 52 inrush currents 52 axial radial 52 megohms 52 ferritic 52 carbides 52 austenitic stainless steel 52 electron scattering 52 μg ml 52 PWBs 52 microwatt 52 singulation 52 wetted surface 52 LPCVD 52 weldability 52 processability 52 fluxes 52 timebase 52 IGLOO FPGAs 52 3mm x 52 ADIS# 52 weld seams 52 organic solvents 52 grease lubrication 52 megapascals 52 shaft diameters 52 oxidative stability 52 ppm ° C 52 SO8 package 52 static dissipative 52 noise ratio SNR 52 baseplate 52 self lubricating 52 conductive adhesive 52 stiction 52 elution 52 #oC [002] 52 ductility 52 regenerable 52 IP# compliant 52 fluorescence intensity 52 viscosity 52 dV dt 52 femtogram 52 formability 52 highpass filter 52 Input Voltage 52 VESA mounting 52 pyrolytic 52 +# deg [002] 52 coupling capacitors 52 k dielectrics 52 motor windings 52 #μA [002] 52 serum homocysteine 52 mA max 52 #us [001] 52 photoconductive 52 Zener diodes 52 acrylamide formation 52 aqueous cleaning 52 preheater 52 electrostatic discharge ESD 52 ambient temperature 52 fluorescence emission 52 μl 52 deadtime 52 volts AC 52 DFN packages 52 VCXO 52 embrittlement 52 FM#CL# 52 voltage derating 52 Voltages 52 wirebond 52 Pb 52 oxyhemoglobin 52 corrosion resistance 52 reflow ovens 52 pin TDFN package 52 #.#um [001] 52 oscillator frequency 52 airflows 52 UV irradiation 52 digital isolator 52 pushbutton switch 52 degreesF 52 matte tin 52 g m² 52 electron mobility 52 overvoltage 52 voltage #.#V 52 thermal conductivities 52 hysteresis 52 bipolar transistors 51 extrudate 51 absorption coefficient 51 piezo actuator 51 #.#uF 51 ingression 51 μs 51 Cpk 51 emf 51 scfm 51 5V input 51 +# ° F. 51 corrosion abrasion 51 H#SO# 51 SMA connectors 51 Stratix III FPGAs 51 passivating 51 inductance 51 pre preg 51 fpm 51 conductivity 51 PNP transistors 51 #ppb [003] 51 mW/cm2 51 DIN rail 51 #μs [002] 51 lowpass filter 51 water vapor permeability 51 pin SOIC packages 51 Â ° C. 51 singlemode 51 edge roughness LER 51 IEC #-#-# [003] 51 51 #μm [002] 51 serum magnesium 51 MIL HDBK #F 51 #psi [003] 51 isotherm 51 stray inductance 51 thermal annealing 51 equilibration 51 carbon steels 51 overvoltage overcurrent 51 inductive sensors 51 rms jitter 51 workpieces 51 Illumi Lite LED 51 ° C ambient 51 vaporisation 51 alien crosstalk 51 QFN packaging 51 intergranular corrosion 51 μA 51 intermetallic 51 interfacial layer 51 flexural strength 51 dc voltage 51 handwheel 51 barium sulfate 51 interrupt latency 51 mount inductors 51 pore sizes 51 defluxing 51 non linearities 51 TCXO 51 Sitrans 51 QFPs 51 coercivity 51 spall 51 backwashing 51 IEC EN #-#-# 51 passband 51 differential impedance 51 Cu interconnects 51 polyurethane adhesive 51 Shutter speeds 51 #VAC [002] 51 osmolality 51 wirebonding 51 corrosive environments 51 μm diameter 51 #μA [001] 51 byte FIFO 51 outgassing 51 impedance mismatches 51 rigid substrates 51 solventless 51 shaft misalignment 51 current sensing resistor 51 nickel hydroxide 51 transconductance 51 electroless nickel 51 1uA 51 voltage outputs 51 coplanar 51 luminous efficacy 51 gasketing 51 windings 51 outgas 51 voltage coefficient 51 GaAs MESFET 51 singulated 51 Mosfets 51 EMI RFI 51 OCXO 51 g/m2 51 ultrahigh purity 51 UV lamp 51 VOC emission 51 wirewound resistors 51 RC oscillator 51 MAX#E 51 #bar [001] 51 MSOP package 51 runnability 51 cathodic 51 LVDTs 51 ± #V [002] 51 #Â ° C 51 nitrogen oxide burners 51 Agilent B#A 51 impedence 51 cored wire 51 cuvette 51 passivation 51 photocurrent 51 AEC Q# qualified 51 superparamagnetic 51 Mosfet 51 pF 51 Fig. 2b 51 CMOS transistors 51 shunt resistors 51 electrical resistivity 51 cogging 51 integral nonlinearity INL 51 TCXOs 51 copper metallization 51 HEMTs 51 X7R 51 metallization 51 fA 51 ZrO 2 51 leach kinetics 51 +# oC 51 UV wavelengths 51 digital potentiometers 51 overmolded 51 voltage lockout UVLO 51 low viscosity fluids 51 sealability 51 voltage spikes 51 concentricity 51 submicrometer 51 UV coatings 51 electrostatic discharge 51 pneumatic cylinders 51 intrinsic jitter 51 ° C ± 51 polyphenylsulfone 51 busbar 51 lamp ballasts 51 silicone tubing 51 #Vac input 51 cooling fins 51 V dc 51 airheater 51 photomultipliers 51 oxidation 51 roof penetrations 51 mA output 51 Bulk Metal 51 micron particle 51 JFET 51 dual damascene 51 Schottky diode 51 mounting flange 51 analyte 51 PSA nadir 51 photodiode 51 reed switches 51 Pressure Transducer 51 MAX#/MAX# [001] 51 #mm ² [001] 51 T5 lamps 51 magnetostrictive 51 VDDQ 51 Nd YAG 51 UV VIS 51 quiescent currents 51 Total Harmonic Distortion 51 Schottky barrier 51 #ksps 51 PWM signal 51 #.#ppm [001] 51 gamma irradiation 51 kilopascals 51 MIC#/# 51 martensite 51 #kA [001] 51 hydrogen peroxide H#O# 51 silicon oxynitride 51 optical encoders 51 solder 51 OSNR 51 bend radii 51 χ 51 dephasing 51 UHPLC 51 platens 51 DIN connectors 51 hermetic sealing 51 Silicon Nitride 51 metastable 51 TMP# 51 calcium fluoride 51 quartz oscillators 51 temperature setpoint 50 NMOS 50 stainless steel housings 50 + #kV 50 reed relays 50 +# degrees Centigrade 50 thermistor 50 DIN rail mounting 50 snubber circuits 50 protein adsorption 50 enzymatic digestion 50 VICTREX PEEK 50 freezeproof 50 conventional photolithography 50 photoresists 50 passivation layer 50 observability 50 matrix interferences 50 triac 50 3mm x 3mm 50 #nA [002] 50 Sulfur compounds 50 silicone encapsulation 50 photolithographic 50 frequency transducers 50 SAR ADC 50 coarser grind 50 backflush 50 intermodulation 50 bottomhole pressure 50 MLCC capacitors 50 ACPL K# 50 MWCNTs 50 AWG wires 50 #Â º [001] 50 #C #F [003] 50 gearset 50 Photoelectric Sensors 50 ± #ppm [002] 50 gigapascals 50 UCC# 50 RF connectors 50 pulse width modulation 50 JTAG port 50 exothermic reaction 50 AQ# [001] 50 substrates 50 volts mil 50 siloxane 50 Thermal conductivity 50 2μm 50 ammonium ions 50 ratiometric 50 feedthrough 50 nickel alloys 50 wavefront distortion 50 gate dielectrics 50 5V CMOS 50 nanoparticle arrays 50 toroidal transformers 50 eco solvent 50 IP# weatherproof 50 #mV [001] 50 chlorine sanitizer 50 carcinogenic polycyclic aromatic hydrocarbons 50 TVS diodes 50 radial leaded 50 shrinking geometries 50 impermeability 50 rancidity 50 flexure 50 kV HBM 50 gate electrode 50 shot peening 50 Lead Pb 50 SPDT switches 50 reverse polarity protection 50 electromotive force 50 friability 50 wettability 50 2dB 50 decoupling capacitors 50 balancer shaft 50 derate 50 harmonic currents 50 hydrolysis resistance 50 water repellency 50 #VDC [002] 50 galvanic isolation 50 EMIF# 50 pearlite 50 CMOS circuits 50 viscoelastic properties 50 Varistors 50 pin 4mm x 50 lattice mismatch 50 flowrates 50 Perkinamine 50 kinematic viscosity 50 EMI RFI shielding 50 cementite 50 transgene expression 50 magnetisation 50 oxidise 50 solubilization 50 isostatic 50 oxidative degradation 50 ionic contaminants 50 thinner wafers 50 #.#W [003] 50 MTTF 50 CY# [003] 50 ESD electrostatic discharge 50 voltage overshoot 50 sunscreen SPF 50 Kraton G# 50 x 3mm 50 variable resistor 50 printability 50 PWM pulse width modulation 50 electrostatic filter 50 Tensile strength 50 NIST traceable 50 psec 50 jitter measurement 50 luminous flux 50 snubbers 50 0 dBm 50 voltage divider 50 degC 50 IP# rating 50 Calcium chloride 50 hydrophobic compounds 50 ZnSe 50 Coriolis meters 50 #msec 50 capacitive sensor 50 Fig. 3b 50 Conductive Polymer 50 inductive load 50 selective soldering 50 sorption 50 Schottky rectifiers 50 BLDC motor 50 AlN 50 nitriding 50 D2PAK 50 collimators 50 mV V 50 parasitics 50 NEMA 4X enclosure 50 stripline 50 dewetting 50 NaOH 50 ppm deg 50 #.#Hz 50 leadframe 50 #L stainless steel 50 #kN [002] 50 CMOS wafers 50 diode emulation 50 nitrate nitrite 50 sulfation 50 oxide thickness EOT 50 tin plating 50 dielectrics 50 electro static 50 xenon lamp 50 density interconnect HDI 50 dissipative 50 substrate 50 toolholders 50 mosfets 50 test DUT 50 bandgaps 50 connectorized 50 poppet valves 50 #Vrms 50 HV# [001] 50 +# degC [002] 50 heat dissipation 50 bilayers 50 dropout voltage 50 ISL#M 50 geometric distortion 50 volatilization 50 CCFL tubes 50 #.#mohm