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(Click for frequent words.) 72 flex rigid 66 density interconnect HDI 64 FPCs 64 printed circuit 64 PWBs 64 multilayer printed 63 flex circuits 62 Rigid Flex 62 HDI PCBs 62 MLCCs 62 RF Microwave 60 IC substrates 60 MLCC capacitors 60 Multek 60 boards PCBs 60 wafer dicing 60 integrated circuits IC 60 leadframe 60 quickturn 60 BiFET 60 leadframes 60 chip resistors 60 multilayer PCBs 59 microvia 59 integrated circuits ASICs 59 Flex Rigid 59 Flip Chip 59 fiber optic transceivers 59 multichip 59 electro mechanical components 59 wafer bumping 59 tantalum capacitor 58 singlemode 58 wirewound 58 embedded passives 58 dielectrics 58 InGaP 58 underfill 58 microelectronic packaging 58 Compeq 58 hermetic packaging 58 surface mountable 58 BGA packages 58 InGaP HBT 58 Silicon Germanium 58 WLCSP 58 Unimicron Technology 58 HDI multi layered 58 backplanes 58 overmolded 58 SOI substrates 57 tantalum capacitors 57 thermoplastic materials 57 wirebond 57 GaAs HBT 57 GaAs pHEMT 57 stripline 57 Datamate 57 solder bumping 57 X7R 57 CMOS wafer 57 QFN packages 57 multilayer ceramic capacitors MLCC 57 SiPs 57 solder bumps 57 analog ICs 57 MMICs 57 wire bondable 57 Gallium Arsenide 57 interposers 57 transceiver IC 57 membrane switches 57 monolithic microwave integrated 57 dielectric layer 57 epitaxial substrates 57 ICs ASICs 57 BGA packaging 57 RF connectors 57 Unimicron 57 film transistor TFT 57 overmolding 57 multilayer ceramic 57 indium gallium phosphide InGaP 56 circuit MMIC 56 PCB layout 56 LiNbO3 56 GaAs substrates 56 pcb 56 polyimide 56 epitaxial wafer 56 insert molding 56 Printed circuit 56 copper metallization 56 3U CompactPCI 56 CMOS logic 56 IC substrate 56 polyethylene fiber 56 Vor ink 56 X5R 56 TGA# SL 56 PHEMT 56 Printed Circuit Boards 56 RFCMOS 56 Nanya PCB 56 Mbit SRAMs 56 rigid substrate 56 aluminum electrolytic capacitors 56 board assembly PCBA 56 FPCB 56 Epitaxial 56 ceramic capacitor 55 Aaeon 55 2oz copper 55 Ge substrates 55 PIN photodiodes 55 extruded profiles 55 through silicon vias 55 conductive inks 55 silicon germanium SiGe 55 die bonder 55 TrueStore 55 eutectic 55 epiwafers 55 5V CMOS 55 epiwafer 55 GDM# 55 monolithically integrated 55 Cicoil 55 IGBT Insulated Gate 55 nm CMOS process 55 ie HDI multilayered 55 HEMTs 55 C0G 55 thermoplastic compounds 55 CMOS fabrication 55 Samtec 55 #.# micron node 55 Avnet Cilicon 55 transistor arrays 55 Chin Poon 55 Backplane 55 BGA CSP 55 Follow Vishay 55 solderable 55 coil cords 55 laminate substrate 55 BGAs 55 electrolytic capacitors 55 aluminum electrolytic 55 PCB fabricators 55 MEMS microphone 54 oxide semiconductor 54 indium phosphide InP 54 Rugged COTS 54 rotary actuators 54 TGA# SM 54 LTPS TFT 54 epitaxial wafers 54 customizable dataplane processor 54 interposer 54 Serdes 54 controller ICs 54 transparent conductive coatings 54 structural adhesives 54 FPGA CPLD 54 TDK EPC 54 STN LCD 54 SOI MEMS 54 silicone elastomers 54 thermoset composites 54 varactors 54 capacitors 54 nanometer nm CMOS 54 package SiP 54 daughtercards 54 epi wafers 54 extrusion coating 54 hi rel 54 optoelectronic packaging 54 microstrip 54 SOI CMOS 54 GaAs IC 54 amorphous silicon Si 54 Multilayer Ceramic 54 photodiode arrays 54 radial leaded 54 Sigma fxP 54 superabrasives 54 #G DPSK 54 Gallium Arsenide GaAs 54 die bonders 54 Virtex 5 54 High Density Interconnect 54 QSFP 54 #nm CMOS [002] 54 K dielectrics 54 Inductors 54 PIN diodes 54 3U VPX 54 varistor 54 MESFET 54 heat spreaders 54 nm DRAM 54 Nan Ya PCB 54 integrated circuits 54 resistive touch panels 54 Parlex 54 FPDs 54 film transistors TFTs 54 MOS transistors 54 wafer probing 54 conductive adhesives 54 SDRAMs 54 programmable logic devices 54 nitride semiconductor 54 JESD# [002] 53 amplifier modules 53 capacitance values 53 cored wire 53 displays FPD 53 Cree GaN 53 PC/#-Plus 53 spherical bearings 53 6U CompactPCI 53 Powerful debug 53 ferrite 53 LVDS interfaces 53 JFET 53 RFIC 53 SFP SFP + 53 EMI Filters 53 Microelectronic 53 analog IC 53 ISO TS #:# certified 53 multilayers 53 NOR Flash memory 53 electro mechanical assemblies 53 SPDT switch 53 multilayer 53 ATmega#P [001] 53 μTCA 53 eWLB 53 backplane connectors 53 6U VME 53 silicon germanium SiGe BiCMOS 53 TVS Diodes 53 coating laminating 53 micromachined 53 weldments 53 SnPb 53 Gallium Nitride GaN 53 resistive element 53 thermally conductive 53 Fine Pitch 53 Micromorph 53 solder alloy 53 indium tin oxide ITO 53 coextrusion 53 crystalline silicon c 53 GaAs InP 53 Hi Rel 53 conformal coating 53 Compact PCI 53 composite laminates 53 magnetic encoders 53 QFNs 53 wire bonders 53 UMC #nm 53 AlSiC 53 Maxtek 53 SOI wafer 53 programmable logic devices PLDs 53 projected capacitive touch 53 crystal resonator 53 TFTs 53 ZMD# 53 organic TFTs 53 Soitec produces 53 PC/# PC/#-Plus 53 RF ICs 53 AdvancedMC module 53 pHEMT 53 QFPs 53 Stratix IV GX FPGA 53 rigid substrates 53 Esatto Technology 53 ENIG 53 pin TQFP packages 53 Arria GX FPGAs 53 CMOS transistors 53 SiGe 53 SiC substrates 53 multichip modules 53 TAIYO YUDEN 53 Aerosol Jet 53 Beralcast R 53 StarFabric 53 GaAs PHEMT 53 aluminum extrusions 53 slitter rewinders 53 exotic alloys 53 solder mask 53 low k dielectric 53 silicon 53 UHMW 53 solar PV module 53 Integrated Circuits ICs 53 millimeter wave integrated circuits 53 CompactPCI ® 53 #.#μ 53 solder bump 53 monolithic CMOS 53 custom ASICs 53 optoelectronic 53 coaxial connectors 53 XFP module 53 deep submicron CMOS 53 RF microwave components 53 piezo actuators 53 poly crystalline 53 GaAs MMIC 53 MPR# [001] 53 polybutylene terephthalate 53 ERNI 53 Semiconductors Printed Circuit 53 TDA# [001] 53 backplane 53 forgings castings 53 backside metallization 53 IGBT modules 53 gear reducers 53 serial backplane 53 nm CMOS 53 ODM OEM 53 semiconductor 53 Printed Circuit Board 52 heat shrinkable tubing 52 strain gage 52 capacitive touch sensor 52 substrates 52 Varistors 52 PROMATION 52 TPEs 52 MB#K# 52 CY#C#x# 52 Cable Assemblies 52 telecom datacom 52 Ethernet-over-SONET/SDH 52 magnesium alloys 52 BAW filters 52 CAN transceivers 52 gasketing 52 layer ceramic capacitors 52 GaAs substrate 52 STABLCOR 52 thermoset composite 52 foil resistors 52 #.#um CMOS 52 Radiall 52 SFP + transceivers 52 aramid fiber 52 integrated circuits MMICs 52 Mbit MRAM 52 singulated 52 Radio Frequency Integrated Circuits 52 conductive adhesive 52 flexible substrates 52 Austriamicrosystems 52 #.#μm CMOS 52 coplanarity 52 PWM ICs 52 dc dc conversion 52 projected capacitive 52 multicrystalline 52 Stratix FPGAs 52 conductive coatings 52 Silicon CMOS Photonics 52 optical subassemblies 52 TestStation 52 FineSim SPICE 52 DIN rail mount 52 #.#μm [002] 52 ASIC prototyping 52 leadless package 52 discretes 52 NiSi 52 conformal coated 52 ballscrew 52 ICs 52 Saflex interlayers 52 MAX# integrates 52 polymer substrates 52 RF amplifiers 52 triplexer 52 piezoceramic 52 ARM#EJ S 52 AEC Q# qualified 52 CONNECTORS 52 mount SMT 52 HardCopy 52 inertial MEMS 52 PEEK OPTIMA 52 encapsulant sheets 52 logic NVM 52 HannStar Board 52 Linear Actuators 52 serializer deserializer SerDes 52 SMT 52 pseudo SRAM 52 DIN rail mounted 52 CMP slurry 52 magnetic bearings 52 transceiver modules 52 silicon CMOS 52 LTPS LCD 52 mechanical polishing CMP 52 GaAs MESFET 52 voltage CMOS 52 decorative laminate 52 CMP consumables 52 ADLINK Technology 52 sintered metal 52 TDFN package 52 Phihong 52 CMOS circuitry 52 Tantalum Capacitors 52 Stratix II FPGAs 52 port #GBASE T 52 Santoprene TM 52 magnetostrictive 52 QMEMS 52 optical isolators 52 solder paste 52 insulator wafers 52 microvias 52 QFN packaging 52 RF integrated circuits 52 ZMDI 52 Samsung OneDRAM 52 DongbuAnam 52 RF coaxial 52 modular conveyors 52 Ultem 52 MEMS sensor 52 Fiber Optic Transceiver 52 advanced leadframe 52 fused quartz 52 impedance matching 52 ceramic substrates 52 magnetron sputtering 52 ATtiny# 52 GaN layers 52 silicon oxynitride SiON 52 #.# micron CMOS 52 pMOS 52 SchmartBoard 52 dimensionally stable 52 BJTs 52 bicomponent 52 RFICs 52 Hypertronics 52 amplifier ICs 52 low k dielectrics 52 electroplated 52 multilayer ceramic capacitors 52 chip resistor 52 iSPAN 52 silicon carbide SiC 52 leadless packages 52 Formex GK 52 Specialty Engineered Alloys 52 oscillators filters 52 AlN 52 3U PXI 52 metal matrix composites 52 MOEMS 52 solder pastes 52 CIGS solar 52 silicon Si 52 dc dc controller 52 fpgas 52 BittWare 52 resistive touch panel 52 AlGaN 52 heterojunction bipolar transistor HBT 52 microTCA 52 SOI wafers 52 polycrystalline 52 DDR NAND 52 capacitance 52 #nm silicon 52 GaN HEMTs 52 HDI PCB 51 PA6 51 fables semiconductor 51 linear actuators 51 transparent conductive 51 interconnects 51 polymer matrices 51 precision machined components 51 Methodology Kit 51 PIN diode 51 Wafer Level Camera 51 thermoplastic resin 51 measuring #.#mm x [001] 51 fiber optic connectors 51 wafer probers 51 chip inductors 51 electron mobility 51 photodetectors 51 laminations 51 Thin Film Transistors 51 reflow solder 51 CS# EDC 51 LatticeECP2M 51 deep sub micron 51 VPX REDI 51 AMLCD 51 microprocessors microcontrollers 51 monolithic microwave integrated circuits 51 Amorphous silicon 51 piezoelectric ceramic 51 #nm FPGAs 51 silicon substrates 51 OptoCooler 51 DrMOS 51 LTPS 51 busbars 51 alloys titanium 51 zinc selenide 51 & IC Substrates 51 STw# 51 subminiature 51 SAW filters 51 Stratix II 51 bit RISC processor 51 ML#Q# 51 hydride vapor phase 51 thermoplastic elastomers 51 Si substrates 51 #.#um [002] 51 pHEMT devices 51 AlGaInP 51 Tantalum capacitors 51 FFC FPC 51 dsPIC#F 51 extruded sheet 51 electromechanical assemblies 51 Ibiden Co. 51 HardCopy ASIC 51 Czochralski 51 Z Foil 51 magnetic encoder 51 opto electronic 51 Tong Hsing 51 Nios II 51 .# micron 51 bipolar CMOS DMOS 51 linear motors 51 Yageo Corporation 51 CMOS RF 51 photolithographic 51 VME#x 51 acrylic polymers 51 threaded fasteners 51 chipscale 51 ferrites 51 IC packaging 51 ceramic substrate 51 RoHs compliant 51 Wafer Level Packaging 51 selective soldering 51 SiC wafers 51 TFT LCD modules 51 fabless IC 51 conductive epoxy 51 SAE Magnetics 51 silicon photonic 51 Aviza Technology 51 capacitors resistors 51 ISL#M 51 silicon tuner 51 resistor arrays 51 foams plastics 51 Advanced Packaging 51 VECTOR Express 51 NI Multisim 51 Stratix II devices 51 programmable SoC 51 photonic components 51 TOSAs 51 InSb 51 wafer thinning 51 alumina ceramic 51 Gigabyte X#A 51 #.#um [001] 51 Silicon Nitride 51 Würth Elektronik 51 SiGe C 51 Polyimide 51 Astrodyne 51 JTAG Boundary Scan 51 nvSRAM 51 Xilinx Virtex 5 51 Thin Film Transistor 51 Pseudo SRAM 51 ferrite core 51 CMOS photonics 51 Ferrite 51 optocoupler 51 AdvancedMC modules 51 SiT# 51 carbon nanotubes CNT 51 Stratix III 51 backplane connector 51 TOSA ROSA 51 Integrated Device Manufacturers IDMs 51 silicon modulators 51 rollstock 51 backshells 51 IC foundry 51 polyamides 51 Silicon Carbide SiC 51 substrate 51 Chrontel 51 epitaxial layer 51 ASIC FPGA 51 dielectric layers 51 engineered substrates 51 CSR BlueCore5 Multimedia 51 transparent electrodes 51 di selenide CIGS 51 Fiberglass Reinforced 51 cemented carbide 51 DDR3 DIMMs 51 submerged arc welding 51 #.#μm CMOS process 51 FD SOI 51 VCOs 51 optical transceiver modules 51 Application Specific Integrated Circuits 51 baluns 51 Optical Modulator 51 germanium substrates 51 injection molders 51 FPGAs ASICs 51 MEMS Sensor 51 VCSEL driver 51 VCSELs 51 compression molding 51 #nm SoC 51 dielectric materials 51 sensor actuator 51 polymer capacitors 51 thermoplastic elastomer 51 AVR microcontrollers 51 UltraCMOS 51 finger jointed 51 dsPIC#F# 51 ceramic powders 51 Si TFT LCD 51 #G DQPSK 51 gate dielectrics 51 serdes 51 mixed signal RFCMOS 51 GPIB interface 51 AirMax VS 51 QFN package 51 LED backlit LCD TVs 51 reflow ovens 51 Ibiden 51 thermoplastic resins 51 nanopowders 51 laser diode modules 51 bonded abrasives 51 die castings 51 diplexers 51 ARM#EJ processor 51 membrane keypads 51 crystalline silicon wafers 51 C#F# [001] 51 #Mb DDR2 51 CMP polishing 51 Altera Stratix II 51 Epson Toyocom 51 wirebonding 51 gigabit Gb NAND flash 51 #mm# [002] 51 chip SOC 51 layer ceramic capacitor 51 multicrystalline solar cells 51 thermoset 51 polyurethane elastomer 51 tunable XFP 51 BOPP films 51 output capacitors 51 TigerSHARC 51 Surface Mounted 51 liquid crystal polymer 51 #.#x#.#mm 51 Sabritec 51 semiconductors 51 Indium phosphide 51 CBT resin 51 fusion splice 51 silicone carbide 51 circular connectors 51 TCXOs 51 Fortus #mc 51 conformal coatings 51 Santoprene TPV B# 50 Lynx2 50 #:# LVDS 50 amorphous silicon modules 50 nickel hydroxide 50 SilTerra 50 wafer bonders 50 wafer foundries outsource 50 SFP transceiver 50 vinyl ester 50 dc dc converter 50 InAs 50 ROHS compliant 50 preterminated 50 VeriSilicon ZSP 50 FPC connectors 50 membrane electrode assembly 50 Stratix II GX 50 GaN substrates 50 Power MOSFETs 50 tantalum multilayer ceramic 50 ZLynx 50 tin oxide 50 thermoelectric cooler 50 ASICs ASSPs 50 Schottky 50 ASICs FPGAs 50 microelectronic devices 50 VME PCI 50 wave soldering 50 DPSS lasers 50 ferrite beads 50 metering ICs 50 Leadless 50 EO polymer 50 Laser Modules 50 embedded computing 50 nanoparticle inks 50 CIGS solar cell 50 silicon MEMS 50 AFM probes 50 nanoimprinting 50 8kV 50 insulator SOI technology 50 #.#uF 50 InP substrates 50 uPD# [001] 50 Gallium arsenide 50 CameraChip 50 CMOS silicon 50 #GBASE CX4 50 #Base FX 50 Cymbet EnerChip 50 AMSC HTS wire 50 Industry Highest Density 50 Altera Stratix III 50 Micropulse 50 microstructures industries 50 Altera FPGAs 50 Stanyl ® 50 SlimChip 50 superabrasive 50 wide bandgap 50 bipolar transistor 50 Surface Mount 50 Nan Ya 50 OSAT 50 YAG lasers 50 IXP# [002] 50 InGaAs 50 PCBAs 50 silicon etch 50 bipolar transistors 50 Stratix III FPGAs 50 fiberglass reinforced 50 prepregs 50 bismuth telluride 50 Holtek Semiconductor 50 SiW# 50 LDMOS RF power 50 NVIDIA nForce Professional 50 CS# [002] 50 Visual Circuits 50 PCIe interconnect 50 aspheric lenses 50 ACT Technico 50 ULTEM 50 ASMedia 50 polymer composite 50 inkjet inks 50 pluggable transceiver 50 precision quartz 50 thermosetting 50 weldability 50 baseband chipset 50 Multilayer 50 4Mbit 50 Avalue Technology 50 Modules HMIs 50 Cadmium Telluride CdTe 50 etching DRIE 50 ARM7TDMI processor 50 line BEOL 50 Printing Inks 50 T#/E#/J# 50 tunable RF 50 reflow soldering 50 polytetrafluoroethylene PTFE 50 lithographic processes 50 Senpai Series 50 SMD LEDs 50 Pls redistribute 50 monocrystalline polycrystalline 50 capacitors inductors 50 ASIC SoC 50 spiral inductors 50 ferritic 50 pre preg 50 silicide 50 Interphase iSPAN 50 RFID inlay 50 ADXL# 50 HVIC 50 planarization 50 poly Si 50 baseband MAC 50 x8 PCI Express 50 SMA connectors 50 injection molded parts 50 SOI substrate 50 Kinsus 50 thermistors 50 Compound Semiconductors 50 metalcutting 50 zener diodes 50 fumed silica 50 Bipolar CMOS DMOS BCD 50 nonvolatile static random 50 Palomar Microelectronics 50 crystal oscillators 50 Picogiga delivers advanced 50 matrix composites 50 Qspeed diodes 50 VLSI circuits 50 opto electronic components 50 absolute rotary encoders 50 Silego 50 inductors 50 semicon 50 programmable DSPs 50 CAN transceiver 50 CdTe Si 50 CMOS ICs 50 mezzanines Computer 50 Verigy scalable platforms 50 dielectric 50 Sherborne Sensors 50 AEL# 50 baseband IC 50 TPUs 50 LX#T FPGA 50 GX FPGAs 50 Optical Fibers 50 MEMS oscillators 50 FEOL 50 analog circuitry 50 nickel silicide 50 embedded processor cores 50 nano patterning 50 XFP transceiver 50 gate electrode 50 prismatic cells 50 SiC 50 eutectic solder 50 electrically insulating 50 capacitances 50 tuner ICs 50 k dielectric 50 superalloy 50 reinforced composites 50 CyberDisplay 50 #AWG 50 Schottky diodes 50 micro machining 50 RF transceivers 50 polyisocyanurate insulation 50 BiCMOS 50 Analog ICs 50 electro mechanical systems 50 Gbit DDR3 50 HEMT 50 quadrature modulators 50 conductive polymer 50 GaAs 50 ASICs 50 design kits PDKs 50 WiMAX SoC 50 abrasive waterjet cutting 50 MV# [003] 50 circuit IC 50 electric motors gearmotors 50 aluminum nitride 50 #bit MCU 50 indium gallium arsenide InGaAs 50 PMOS transistors 50 RF subsystems 50 capacitance MLCCs 50 TJA# 50 3Xnm 50 bonder 50 reed switches 50 Backplanes 50 thermoelectric coolers 50 thermoplastic composite 50 Wavestream Corporation 50 Smiths Interconnect 50 precision metal stampings 50 8bit MCU 50 spherical roller bearings 50 polybutadiene 50 solar photovoltaic PV modules 50 #μm thick [002] 50 SFP transceivers 50 Printed Circuits 50 #nm/#nm 50 conductive coating 50 MEMS gyroscopes 50 OptoPHY 50 thinner wafers 50 Altera Stratix IV 50 MEMS 50 gallium phosphide 50 InGaN 50 Stratix IV FPGA 50 thermoforming 50 CMOS processes 50 discrete semiconductors 50 gallium nitride GaN 50 transistors diodes 50 laser annealing 50 Avalue 50 #nm CMOS [001] 50 photonic crystal fibers 50 VME VPX 50 XRT#L# 50 injection moldable 50 rectifier diode 50 LPKF 50 Liquidmetal alloys 50 CMOS IC 50 USB PHY 50 encapsulant 50 Rapid prototyping 50 liquid crystal polymers 50 dielectric etch 50 aluminum nitride AlN 50 zirconium hafnium 50 MicroTCA chassis 50 Bipolar Transistor 50 adhesive bonding 50 thermoplastic rubber 50 optical waveguides 50 RoHS compliance 50 GaN wafers 50 nano composites 49 filament winding 49 Stocking distributor 49 TURCK 49 digital potentiometers 49 transparent electrode 49 carbon steels 49 SigmaQuad 49 Automated Optical 49 Lextar 49 titanium carbide 49 homopolymers 49 optical transceiver module 49 crystalline Si 49 serial RapidIO 49 silicon photovoltaic modules 49 spindle motors 49 Mach Zehnder modulators 49 Schottky diode 49 LSA#A 49 Zarlink ZLynx 49 copper interconnects 49 RF amplifier 49 emPROM 49 WIN Semiconductors