Related by context. All words. (Click for frequent words.) 71 solder pastes 70 wave soldering 69 SN#C 69 reflow 67 underfill 67 flux residues 67 conformal coating 66 solderability 66 stencil printing 66 solder alloy 65 solder joints 64 solder 64 solder bumps 64 reflow soldering 63 planarization 63 SnPb 62 UV curable 62 conformal coatings 62 defectivity 61 metallization 61 dielectrics 61 eutectic 61 encapsulant 61 substrate 61 photoresists 60 solder reflow 60 reflow temperatures 60 reflow oven 60 solder mask 60 UV inks 60 reflowed 59 photoresist 59 reflow profiles 59 substrates 59 defluxing 59 printhead 59 conductive adhesives 59 solder paste printing 59 solderable 58 TiN 58 coplanarity 58 polishing pads 58 warpage 58 leaded solder 58 UV curing 58 reflow solder 58 imprint lithography 58 planarity 58 ENIG 58 overmolding 58 lamination 58 copper metallization 58 soldering 58 tantalum capacitors 57 MLCCs 57 indium tin oxide ITO 57 microvia 57 rigid substrates 57 1μm 57 SMT 57 HASL 57 dielectric 57 passivation 57 Electrovert 57 silane 57 electrically insulating 57 sapphire substrate 57 flexible substrates 57 viscosity fluids 57 UV coatings 56 laminating adhesives 56 electroless copper 56 Sn Pb 56 metallisation 56 thermo mechanical 56 wafer bumping 56 rheology modifier 56 reflow ovens 56 coating 56 BGAs 56 density interconnect HDI 56 solder alloys 56 CMP slurries 56 selective soldering 56 compressive stress 56 conductive inks 56 glass substrate 56 APTIV film 56 SiO 2 56 polyimide 56 dielectric materials 56 electroplated 56 swarf 56 conductive ink 56 #um [002] 56 transparent conductive 56 phototransistor 56 passivated 56 reflective coatings 56 cored wire 55 solventless 55 leadframe 55 ionic contamination 55 acrylic adhesives 55 silicide 55 capacitances 55 LPCVD 55 FEOL 55 chemically resistant 55 eutectic solder 55 QFN packages 55 sub micron 55 RO membrane 55 light fastness 55 regrind 55 inkjet inks 55 picoliter droplets 55 AlN 55 EUV mask 55 viscosity 55 thermoplastic polymer 55 wafer thinning 55 PWBs 55 thermally conductive 55 CIGS solar cells 55 Hysol 55 rheometers 55 extractables 55 BEOL 55 gasketing 55 pipette tip 55 anneal 55 resin infusion 55 ownership CoO 55 photoresist stripping 55 acrylic latex 55 molten solder 55 RoHS compliance 55 mount inductors 55 ultraviolet curable 55 SiO2 55 5μm 55 printability 55 glass frit 55 bulk solids 55 laminations 55 solder bumping 55 chip resistors 55 #μm thick [002] 55 UV curing inks 55 AFM probes 55 UV LED 55 ceramic capacitor 55 epoxies 55 #μm [002] 55 QFN 54 squeegee blades 54 wafer bonder 54 kerf 54 workpiece 54 conductive adhesive 54 silicone elastomers 54 inkjet printing 54 conductive epoxy 54 particulate contamination 54 epoxy coating 54 sorbent 54 moisture absorption 54 immersion lithography 54 VOC compliant 54 reflow soldering processes 54 antireflective coatings 54 Silicon Nitride 54 laminate 54 photodiode 54 photolithography 54 tin whisker 54 mount SMT 54 electrodeposition 54 cathodic 54 plastisol 54 silicone adhesive 54 flexographic 54 dielectric layers 54 aqueous coating 54 ZnSe 54 RoHs compliant 54 photolithographic 54 formability 54 platen 54 rheology 54 pellicle 54 optocoupler 54 solder spheres 54 VectorGuard 54 UV varnish 54 thixotropic 54 electroformed 54 antireflection 54 ferrite 54 inkjet printhead 54 epoxy resin 54 UV curable ink 53 calcium fluoride 53 SAC# 53 photopolymer 53 conductivity 53 electroless nickel 53 crystallinity 53 UV curable inks 53 solder bump 53 moldability 53 aqueous inks 53 RO membranes 53 fluoropolymer 53 elastomeric 53 thermally activated 53 repeatability 53 reed switches 53 hardcoat 53 Solder Paste 53 slurries 53 LTPS TFT 53 wirebond 53 photomasks 53 resistive element 53 siloxane 53 microporous 53 Simitri HD 53 accuracy repeatability 53 Kynar 53 excellent solderability 53 annealing 53 pipette tips 53 dimensionally stable 53 NiPdAu 53 flexural modulus 53 aspherical lens 53 ultrasonic cleaning 53 mandrel 53 flowability 53 tin oxide 53 coated polyester 53 static dissipative 53 corrosion resistant 53 μm diameter 53 processability 53 flexo printing 53 encapsulant sheets 53 Aerosol Jet 53 granulate 53 coating thickness 53 parasitic capacitance 53 megasonic 53 halide 53 polyurethane resins 53 electroplating 53 deburring 53 silicon substrate 53 ultrahigh purity 53 QFN packaging 53 dopant 53 Reflow 53 SOI substrates 53 lidding 53 microfine 53 nano imprint 53 mask aligners 53 AQUANOX A# 53 wafer dicing 53 silicon nitride 53 workpieces 53 toolholder 53 epoxy primer 53 PEDOT PSS 53 wafer metrology 53 multilayer 53 QFNs 53 solvent inks 53 leadframes 53 fused silica 53 Czochralski 53 Si substrate 53 UV coating 53 intermetallic 53 label applicators 52 OPTIMASS 52 SAC alloys 52 CMOS wafers 52 UV cured 52 AlN layer 52 concentricity 52 TiO 2 52 silicon etch 52 AQUANOX ® A# 52 compressive stresses 52 AlSiC 52 Rapid prototyping 52 UVTP 52 passivation layer 52 singulation 52 transmissivity 52 overmolded 52 adhesive sealant 52 melt viscosity 52 porous substrates 52 CMOS transistors 52 stereolithography 52 anodising 52 transparent electrode 52 solder flux 52 defoaming 52 Optomec Aerosol Jet 52 metallizing 52 nucleation layer 52 solvent inkjet printers 52 ductility 52 peening 52 micron thick 52 solvent evaporation 52 superwide format 52 pigment inks 52 DEK 52 metallic ions 52 wettability 52 ohmic contacts 52 QFN package 52 PZT 52 dielectric constant 52 coextrusion 52 eco solvent inks 52 encapsulants 52 photoresist strip 52 electroless 52 interposer 52 PVD coating 52 silicon substrates 52 #um [001] 52 copper interconnects 52 pcb 52 carbides 52 4mm thick 52 aqueous dispersion 52 rigid flex 52 Kraton G# 52 sintered 52 electrolytic capacitor 52 ohmic 52 wire bondable 52 ferrule 52 PVDF 52 pre preg 52 poly Si 52 micromachining 52 carbon steels 52 thermoplastic materials 52 eco solvent 52 conductive polymer 52 ZnS 52 NiSi 52 silicon oxide 52 fluoropolymer coatings 52 Schottky diodes 52 color fastness 52 crystal resonator 52 anodic 52 coverslip 52 viscosity liquids 52 austenitic stainless steel 52 Nova NanoSEM 52 nanopowder 52 capacitance 52 EUV masks 52 corrosion resistance 52 SMT LEDs 52 sintered metal 52 rigid substrate 52 di selenide CIGS 52 thermowell 52 #.#in [004] 52 Flip Chip 52 aqueous 52 RoHS compliant 52 UV NIL 51 isotropic 51 tin plating 51 anticorrosive 51 urethane 51 parasitic inductance 51 random copolymers 51 polarizers 51 toner particles 51 fluorosilicone 51 nano patterning 51 cordierite 51 nm lithography 51 e beam lithography 51 μm 51 #L stainless steel 51 thermal conductivity 51 laser scribing 51 impeller 51 thermoform 51 cermet 51 boron nitride 51 dielectric layer 51 vias 51 coaters 51 multilayer ceramic capacitors 51 composite laminates 51 copper electroplating 51 #.#um [001] 51 MOS transistors 51 line BEOL 51 metallized 51 ArF 51 QFPs 51 inkjet nozzles 51 epi wafers 51 printheads 51 compression molding 51 Pb 51 gate electrode 51 VICTREX PEEK polymer 51 Intertronics 51 vertical cavity 51 plasma etch 51 UV lamps 51 monochromator 51 litho 51 line FEOL 51 2μm 51 eluent 51 hafnium oxide 51 PVC CPVC 51 laser irradiation 51 sealant 51 silicon wafer 51 epitaxial layer 51 low k dielectric 51 UV VIS 51 varistors 51 Epoxy 51 waterproofing membrane 51 K dielectrics 51 gelcoat 51 Solamet ® 51 SAW oscillators 51 defect densities 51 piezo actuators 51 phenolic resin 51 silicone gasket 51 wirebonding 51 durometer 51 UHMW 51 sealless 51 tinning 51 lithography 51 BGA CSP 51 sintering 51 platemaking 51 magnetron sputtering 51 dye sublimation 51 dielectric strength 51 film transistors TFTs 51 roughening 51 nanoliter 51 capillary tube 51 physical vapor deposition 51 C0G 51 rovings 51 FusionQuad 51 breakdown voltages 51 peristaltic pumps 51 TCXO 51 PET preforms 51 stiction 51 silicone sealants 51 Multicore LF# 51 catalytic oxidation 51 nMOS 51 Kodak Flexcel NX 51 ultrapure water 51 numerical aperture 51 thermal dissipation 51 plasma etching 51 P3HT 51 UV stabilized 51 basecoat 51 oxide layer 51 LiNbO3 51 rollstock 51 polysulfone 51 laminators 51 nanocoatings 51 wafer 51 electromigration 51 passivating 51 GaN layer 51 backside metallization 51 Uvijet inks 51 ultrasonic welding 51 polyurethane coatings 51 k dielectric 51 colorfastness 51 adhesive caulk 51 X7R 51 DPSS lasers 51 thermoplastic polymers 51 submicron 51 polymeric coating 51 oxidisation 51 carbide insert 51 polybutadiene 51 Anapurna M 51 cuvette 51 Laminator 51 filter cartridges 51 magnetostrictive 51 radial leaded 51 dual damascene 51 PETG 51 processless 51 microvias 51 platens 50 nano coating 50 selective emitter 50 colloidal silica 50 Esatto Technology 50 MWNT 50 diecutting 50 wirewound 50 transmittance 50 epoxy potting 50 VESA mounting 50 Multilayer Ceramic 50 interfacial layer 50 rheometer 50 extruded polystyrene 50 MIL PRF 50 fluxing 50 silicone elastomer 50 millisecond annealing 50 tantalum capacitor 50 picolitre 50 thermoset composite 50 silanes 50 nickel hydroxide 50 micropores 50 pin TDFN package 50 polyphenylsulfone 50 pigmented inks 50 CMP polishing 50 AlGaN 50 monolayer 50 PTFE 50 capacitor 50 silicone caulk 50 GaN layers 50 hermeticity 50 flowable 50 DuPont ™ PV# 50 ferrite core 50 microstructures 50 superabrasives 50 piezoelectric ceramic 50 specially formulated adhesive 50 polymer substrate 50 mandrels 50 metallization pastes 50 UV lasers 50 nanofilm 50 UV# [001] 50 metallised 50 tensile stress 50 hotmelt 50 acrylic polymer 50 indium tin oxide 50 diaphragm valves 50 seam sealer 50 adhesive 50 polymeric 50 cm ² 50 pultrusion 50 ion chromatography 50 wafer probing 50 RISO ComColor 50 CdSe 50 EOSINT M 50 SOI wafer 50 nitride 50 electrolytic 50 computational lithography 50 sealability 50 nonconductive 50 metallic inks 50 nickel plating 50 inkjet proofing 50 ultrathin layer 50 varistor 50 powder coating 50 filter cartridge 50 microcrystalline 50 epoxy matrix 50 transparent conductive coatings 50 extruded profiles 50 galvanic corrosion 50 semiconductor wafer 50 oxide particles 50 gate dielectrics 50 anilox 50 liquid silicone rubber 50 cleanability 50 capacitors 50 torque transducer 50 epoxy adhesive 50 thermowells 50 weldability 50 spectrophotometers 50 electron mobility 50 #μm [001] 50 wafer probers 50 toolholders 50 laser resonator 50 Ultem 50 thermoforming 50 solventless adhesives 50 shot peening 50 Datamate 50 interfacial 50 through silicon vias 50 thermosetting 50 injection moldable 50 thinset 50 NanoBridge 50 thermoset composites 50 wafer thickness 50 phosphors 50 extrusion molding 50 epitaxial silicon 50 QSOP 50 modulus 50 ultrasonics 50 Langmuir Blodgett 50 Solamet 50 Tetratex 50 epoxy 50 sol gel 50 Soldering 50 deep silicon etch 50 subminiature 50 ceria 50 aluminum oxide 50 MIL PRF # 50 gravure printing 50 dielectric thickness 50 coatings 50 GaAs substrates 50 Cryovac ® 50 CMP slurry 50 nanometric 50 #nm immersion 50 boards PCBs 50 Anti Reflective 50 SWCNT 50 bypass capacitor 50 density fiberboard 50 tribological 50 barium titanate 50 viscosities 50 millisecond anneal 50 fluxes 50 outgassing 50 aspheric 50 heat sealable 50 low k dielectrics 50 flexo 50 surface mountable 50 vapor degreasing 50 Vor ink 50 Volatile Organic Compounds VOCs 50 Nihon Superior 50 epoxy adhesives 50 thermochromic 50 Fluoropolymer 50 Lead Pb 50 mechanical polishing CMP 50 pH electrodes 50 anatase 50 primer sealer 50 urethane coating 50 matte tin 50 multichip 50 EVG# 50 Canon imagePRESS C1 50 PVD CVD 50 vibratory feeder 50 flowmeters 50 photomask 50 runnability 50 laser sintering 50 barium carbonate 50 tin Sn 50 halides 50 clearcoat 50 capacitance values 50 electro static 50 coater developer 50 finely dispersed 50 semiconductor wafers 50 vanadium oxide 50 soundproof drywall 50 moisture ingress 50 W mK 50 lightfastness 50 Epson Stylus Pro GS# 50 borderless printing 50 WLCSP 50 abrasive waterjet cutting 50 flexo gravure 50 transistor arrays 50 insulator substrate 50 adhesive bonding 50 nanocoating 49 structural adhesives 49 ultraviolet UV 49 motor windings 49 EFI Vutek 49 output capacitors 49 wafer uniformity 49 aluminum electrolytic capacitors 49 TDFN package 49 flux cored wire 49 Dimatix 49 anneals 49 dampens vibrations 49 microlithography 49 nanoparticle inks 49 wafer prober 49 Polyimide 49 photopolymer plates 49 chromate 49 annealed 49 amorphous silicon Si 49 autosampler 49 cementitious 49 thermoformers 49 Printing Inks 49 silicone encapsulation 49 polymer coatings 49 Aluminum Oxide 49 Azura TS 49 quartz crystal oscillator 49 tight tolerances 49 Zener diode 49 sprayable 49 unreacted 49 Victrex PEEK 49 metal oxides 49 moisture analyzer 49 acid etching 49 Genius #UV 49 Mil PRF # 49 etchant 49 polydimethylsiloxane PDMS 49 perfectors 49 adsorbent 49 silicone rubbers 49 surface roughness 49 weldable 49 Nexa Autocolor 49 flowmeter 49 PECVD 49 MLPQ package 49 LTPS 49 5mm x 6mm 49 Ball Grid Array 49 flex circuits 49 SpecMetrix 49 particle sizing 49 aqueous cleaning 49 vinyl ester resin 49 extrudate 49 dimensional tolerances 49 furnaceware 49 Speedline Technologies 49 SiON 49 vapor retarder 49 absorbance 49 scanning electron microscopes SEMs 49 Piab 49 ultrapure 49 reactive ion 49 Applied Baccini 49 magnetic particle 49 Schottky diode 49 PET flake 49 focused ion beam 49 prefilter 49 Automated Optical 49 composite laminate 49 chemically inert 49 dopants 49 underlayment 49 micro vias 49 μm thick 49 corrosion resistant coating 49 ADMP# 49 acrylic coating 49 optical coatings 49 crossflow 49 borosilicate 49 UV inkjet printer 49 Nozzles 49 ultrasonic vibration 49 laser interferometer 49 easily cleanable 49 Akulon 49 XRF analyzer 49 Stereolithography SLA 49 MALDI 49 sorbents 49 polyurea 49 ceramic dielectric 49 metrology 49 DFN package 49 InnerArmor 49 printed circuit 49 Metallization 49 electrostatic 49 polycarbonate lens 49 analyte 49 LTPS LCD 49 polyisocyanurate insulation 49 electrical resistivity 49 CRIUS 49 electron beam welding 49 epitaxial 49 thermistors 49 liquid silicone rubbers 49 polyurethane adhesive 49 condenser 49 latex caulk 49 ferritic 49 flexo plates 49 selenide 49 UV curable coatings 49 #.#mm thick [002] 49 micromirror 49 rigid polyurethane foam 49 flame retardance 49 Silicon Dioxide 49 barium sulfate 49 hydrolytic stability 49 metallic substrates 49 #.#mm x [003] 49 compatible inkjet cartridges 49 cartridge filters 49 HfSiON 49 HEMTs 49 low emissivity 49 anionic 49 flexographic plates 49 corrugation 49 Inconel 49 micro machining 49 thermoset 49 silicon nanocrystals 49 darkfield 49 CMYK inks 49 sputter deposition 49 inkjet 49 photoluminescence 49 X7R dielectric 49 epiwafers 49 CVD etch 49 overspray 49 silica microspheres 49 Eden# 49 Nd YAG 49 CIGS cells 49 silicate glass 49 silicon waveguide 49 crystal oscillator 49 prepolymers 49 laser diode 49 nonporous 49 Pressurex ® 49 thermoplastic polyurethane TPU 49 thermoplastic elastomer 49 #μ 49 printing inks 49 laser micromachining 49 geometries 49 self lubricating 49 nitriding 49 nanoimprint 49 texturization 49 QMEMS 49 coextruded 49 PCB layout 49 anolyte 49 solder paste inspection 49 Schottky 49 solvent borne 49 delaminations 49 HP ElectroInk 49 ferric oxide 49 adhesion 49 XTreme Power 49 solar photovoltaic PV modules 49 FR4 49 reticles 49 polytetrafluoroethylene PTFE 49 inkjet printer cutters 49 leachables 49 CoroMill 49 mask aligner 49 powder coatings 49 thermal conduction 49 electrospray 49 MESFET 49 Coriolis meters 49 elution 49 tighter tolerances 49 fused quartz 49 glass cullet 49 polymer emulsion 49 nanosilicon 49 PIN photodiodes 49 degas 49 conductive pastes 49 selectivities 49 wetted parts 49 silicone adhesives 49 Cu interconnects 49 melt processable 49 Metcar 49 aqueous coatings 49 thermosetting resin 49 CMOS fabrication 49 Boron Nitride 49 electroforming 49 HiPrint 49 nano particle 49 waterborne coatings 49 microcavity 49 TSVs 49 embedded passives 49 prepregs 49 zero valent iron 49 CoO 49 inorganic LEDs 49 input capacitance 49 Physical Vapor Deposition PVD 49 UV inkjet 49 #.#mm x #.#mm [003] 49 laser annealing 49 regenerable 49 zirconium oxide 49 PEEK OPTIMA 48 backside illumination 48 #.#μm [001] 48 CIGS 48 ferrite beads 48 spherical roller bearings 48 reagent 48 nonionic 48 PLLA 48 electrocoat 48 polymerizes 48 melt adhesive 48 ferrite magnets 48 polysulfide 48 wirewound resistors 48 IP# NEMA 48 HNBR 48 rigid foam insulation 48 compression molded 48 pearlite 48 fume extraction 48 martensitic 48 dielectric constants 48 emitting laser VCSEL 48 elastomer 48 optical metrology 48 thermocouple 48 GxT 48 fiducial 48 conductivities 48 GaN wafers 48 linerless 48 transmissive 48 nano imprint lithography 48 nanoparticulate 48 VARTM 48 collimators 48 TPEs 48 MIG welding