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(Click for frequent words.) 70 leadframe 66 WLCSP 65 wafer dicing 64 wirebond 64 IC packaging 64 Flip Chip 64 wafer probing 63 wafer thinning 62 solder bumping 62 CMOS wafer 61 CMP consumables 61 solder bumps 61 package SiP 61 wafer 61 #.# micron node 61 metallization 61 imprint lithography 60 #.# micron CMOS 60 Ball Grid Array 60 micro machining 59 wafer fabrication 59 BEOL 59 copper metallization 59 solder bump 59 through silicon vias 59 C4NP 59 selective soldering 59 die bonders 59 rigid flex 58 Wafer Level Packaging 58 line BEOL 58 eWLB 58 leadframes 58 FEOL 58 FCBGA 58 epitaxy 58 pHEMT 58 dielectric etch 58 mount SMT 58 printed circuit 58 #.#μm [002] 58 #mm wafer 58 aluminum nitride 57 semiconductor wafer 57 CMOS logic 57 mechanical polishing CMP 57 solder alloy 57 Wafer Level Chip 57 micromachining 57 photolithography 57 density interconnect HDI 57 BGA CSP 57 underfill 57 electrodeposition 57 rigid substrates 57 die bonder 57 MEMS fabrication 57 nanoimprinting 57 CMP slurry 57 nanoimprint lithography NIL 57 wafer bonding 57 filament winding 56 SOI wafers 56 wafer metrology 56 wafering 56 SiPs 56 wafer processing 56 wirebonding 56 flex rigid 56 bonder 56 solder paste 56 optoelectronic packaging 56 semiconductor CMOS 56 1Gbit DDR2 56 integrated circuits IC 56 epiwafers 56 millimeter mm 56 Imprio 56 wafer foundries 56 #mm silicon wafers 56 systems substrate bonders 56 wafer foundry 56 micro optics 56 planarization 56 laser scribing 56 BCDMOS 56 mm wafer 56 advanced leadframe 56 nano imprint 56 resin infusion 56 line FEOL 56 nm DRAM 56 #.#um [002] 56 reactive ion 56 nano patterning 56 nm CMOS 56 CMOS fabrication 56 amorphous silicon Si 56 Fab #A 56 CMP slurries 56 SMT 55 Silicon wafer 55 rollstock 55 wafer bonder 55 #nm DRAM 55 Elpida #nm 55 Pseudo SRAM 55 flex circuits 55 nm CMOS process 55 PolyMax 55 injection molding 55 packaging WLP 55 .# micron 55 overlay metrology 55 SiP 55 CdTe Si 55 RFCMOS 55 BGA packaging 55 projected capacitive touch 55 overmolding 55 sputter deposition 55 MB#K# 55 di selenide CIGS 55 photolithographic 55 #/#nm 55 physical vapor deposition 55 #nm CMOS [002] 55 nanometer node 55 BGA packages 55 eutectic 55 furnaceware 55 lithography 55 semiconductor 55 nano imprint lithography 55 SiGe bipolar 55 backside metallization 55 multichip 55 Fab 3E 55 PolyJet Matrix TM 55 QFN packages 55 silicon wafer 55 conductive epoxy 55 micromachined 55 GaAs pHEMT 55 immersion lithography 55 UMCi 55 chipscale 55 substrates 55 epi wafers 55 cored wire 55 #.#um CMOS 55 QFN 55 polishing pads 55 Advanced Packaging 54 microfabrication 54 LiNbO3 54 #.#mm x #.#mm [003] 54 PHEMT 54 Photolithography 54 capacitive touch sensor 54 monolithic microwave integrated 54 ownership CoO 54 interposer 54 Silicon Via TSV 54 pin BGA 54 electroplating 54 SOI CMOS 54 plasma etching 54 CIGS solar cells 54 crystalline silicon c 54 CMOS MEMS 54 nanoimprint 54 nanofilm 54 wave soldering 54 ultrasonic welding 54 #nm immersion lithography 54 Indium Phosphide InP 54 low k dielectrics 54 optical metrology 54 photomasks 54 3Xnm 54 monolithically integrated 54 QFPs 54 wafer foundries outsource 54 prototyping 54 InGaP HBT 54 sapphire substrate 54 singulated 54 semiconductor wafers 54 silicon germanium SiGe BiCMOS 54 millimeter silicon wafers 54 Silicon Germanium 54 QMEMS 54 monolithic CMOS 54 c Si 54 reflow 54 microelectronic packaging 54 Czochralski 54 CIGS copper indium 54 BiCMOS 54 circuit IC 54 pultrusion 54 e beam lithography 54 #nm silicon 54 hermetic packaging 54 DongbuAnam 54 silicon 54 ion implanters 54 metallisation 54 #nm CMOS [001] 54 indium tin oxide ITO 54 leadless package 54 lamination 54 TSVs 54 photoresist stripping 54 engineered substrates 54 ATtiny# 54 indium phosphide InP 54 #mm wafer fab 54 fusion splice 53 ASIC prototyping 53 computational lithography 53 PECVD 53 interposers 53 wafers 53 glass substrate 53 FLCOS 53 PBGA 53 reflow soldering 53 RF CMOS Analog 53 GaAs fab 53 Esatto Technology 53 PIN photodiodes 53 wafer fabs 53 #μm thick [002] 53 TQFN 53 NOR Flash memory 53 SOI substrates 53 EVG# 53 NEXX Systems 53 RFIC simulation 53 high-k/metal-gate 53 ALLVIA 53 Silicon CMOS Photonics 53 magnetron sputtering 53 ion implantation 53 eWLB technology 53 Wafer Level Camera 53 #nm MirrorBit 53 wire bonders 53 opto electronic 53 #nm HKMG 53 WaferPro 53 Leadframe 53 Helios XP 53 MEMS 53 Epitaxial 53 gallium nitride GaN 53 Gallium Arsenide GaAs 53 #mm wafers 53 rapid prototyping 53 SAW oscillators 53 singulation 53 #.#um [001] 53 fused quartz 53 BiFET 53 millimeter wave mmWave 53 hydride vapor phase 53 SnO2 53 extruded profiles 53 vapor deposition 53 8mm x 8mm 53 MLCCs 53 epitaxial deposition 53 brightness light emitting 53 nanometer silicon 53 Injection molding 53 silicon germanium SiGe 53 epiwafer 53 millisecond annealing 53 nm SOI 53 5V CMOS 53 thermoplastic compounds 53 nanolithography 53 #mm fabrication 53 Peregrine UltraCMOS 53 film transistor TFT 53 epitaxial wafers 53 silicon oxynitride 53 STATS ChipPAC 53 4mm x 4mm QFN 53 extrusion coating 53 CMOS wafers 53 epitaxial wafer 53 layer deposition ALD 53 SOI MEMS 53 micron 53 monocrystalline ingots 53 temporary wafer bonding 53 Oxide Silicon 53 photoresist 53 triplexer 53 BGA package 53 nanoparticle inks 53 III V epiwafers 53 CMOS 53 Fab #i 53 Palomar Microelectronics 53 crystal resonator 53 millimeter wafer 53 exotic alloys 53 ArF immersion lithography 52 rigid substrate 52 pin LQFP 52 CIGS cells 52 OptoCooler 52 oxide semiconductor 52 VECTOR Extreme 52 defect densities 52 wafer bonders 52 wafer probers 52 Richard Brilla CNSE 52 Picogiga 52 mm BGA 52 LSA#A 52 IC substrates 52 GaAs foundry 52 CMOS processes 52 laser annealing 52 Reflow 52 XT #i 52 CMOS compatible 52 metal matrix composites 52 electron beam welding 52 embedded passives 52 selective emitter 52 solderable 52 #.#x#.#mm 52 #nm [001] 52 4mm thick 52 #nm node [001] 52 Fused Deposition Modeling FDM 52 wire bondable 52 sub micron 52 laser micromachining 52 surface mountable 52 Package SiP 52 Virtex 5 52 vertical cavity 52 SiGe C 52 Aerosol Jet 52 #nm SoC 52 anodizing 52 Gallium Arsenide 52 lead LFCSP 52 String Ribbon 52 ODM OEM 52 SAC# 52 Soitec produces 52 nanometer lithography 52 microvia 52 electroformed 52 #x# mm [004] 52 LTPS TFT 52 MOCVD 52 nanometer CMOS 52 reflow oven 52 flexible substrates 52 coating laminating 52 metalcutting 52 nanometer nm CMOS 52 solder reflow 52 #nm RF CMOS 52 analog ICs 52 pre preg 52 Micromorph 52 thinner wafers 52 electro deposition 52 photoresist strip 52 #nm FPGA 52 metrology 52 MEMS microphone 52 silicon etch 52 pin SOIC 52 freeze VGF technique 52 dielectrics 52 Stratasys FDM 52 Rapid prototyping 52 TGA# SL 52 cermet 52 ASML TWINSCAN 52 fabrication 52 OptiML Focus 52 CMOS RF transceiver 52 inkjet printing 52 optoelectronic 52 LPCVD 52 BGAs 52 copper interconnects 52 capacitive touch panels 52 Thin Film Transistor 52 mm wafers 52 Unitive 52 IC foundry 52 Molecular Imprints 52 3D TSV 52 Quik Pak 52 electroless 52 solder spheres 52 FlexUPD 52 TrueStore 52 CMOS IC 52 plasma etch 52 linear motors 52 monocrystalline silicon wafers 52 low k dielectric 52 semiconductor foundry 52 wafer thickness 52 ALD Atomic 51 GaN layers 51 silicon ingots 51 controller ICs 51 #x# mm [003] 51 wirewound 51 Gallium Nitride 51 Mbit SRAMs 51 Selective Laser Sintering SLS 51 SiT# 51 eutectic solder 51 Wafer Level 51 Unimicron Technology 51 integrated passives 51 semiconductor wafer fabrication 51 #x#mm [002] 51 QFN packaging 51 crystalline Si 51 mm silicon wafers 51 TFT LCD module 51 nano fabrication 51 StratEdge 51 2μm 51 superabrasive 51 UMC #nm 51 FusionQuad 51 GaAs substrates 51 VECTOR Express 51 multicrystalline 51 flux cored wire 51 nickel hydroxide 51 EBDW 51 Powerful debug 51 Aluminum Nitride 51 silicon photonic 51 pin BGA package 51 TSSOP 51 high voltage BCDMOS 51 thermoforming 51 etching DRIE 51 HV CMOS 51 Schottky diode 51 reflow ovens 51 Novellus SABRE 51 transparent conductive 51 manufactures integrated circuits 51 #.#μm [001] 51 Airborne Particle Sensor 51 RF Microwave 51 OSAT 51 multichip package 51 gallium nitride 51 CMOS transistors 51 coextrusion 51 meltblown 51 nanometer 51 insulator wafers 51 Quantum Leap Packaging 51 ZnS 51 NiSi 51 EUV lithography 51 LTPS LCD 51 chip resistors 51 GaAs gallium arsenide 51 fabless IC 51 microelectromechanical systems MEMS 51 ion implanter 51 design kits PDKs 51 pin SOIC package 51 sapphire wafers 51 CIGSe 51 DirectFET 51 MEMS Sensor 51 multicrystalline silicon cells 51 PWBs 51 microelectromechanical system 51 shot peening 51 nm FPGA 51 Migdal Haemek Israel 51 EUV masks 51 inkjet printing systems 51 workholding 51 chip SoCs 51 nm nodes 51 diecutting 51 LQFP 51 overmolded 51 photoresists 51 8 pin SOIC 51 passivating 51 Inc. NASDAQ RTEC 51 insulator SOI technology 51 insulator substrate 51 Metrology System 51 7mm x 7mm 51 GaAs substrate 51 4mm x 4mm 51 coplanarity 51 ZMD# 51 GaAs MMIC 51 multilayer ceramic capacitors MLCC 51 discrete semiconductors 51 GaAs IC 51 WIN Semiconductors 51 Picogiga delivers advanced 51 TSV 51 silicon wafers 51 passivation 51 Chemical Mechanical Polishing 51 NPFLEX 51 bicomponent 51 etch deposition 51 LQFP package 51 XinTec 51 EDXRF 51 #.#μm CMOS process 51 discretes 51 silicon substrates 51 Texas Instruments OMAP# 51 laminate substrate 51 lithographic processes 51 gasketing 51 flexible monolithically integrated 51 DFM DFY 51 X7R 51 Metallization 51 Organic Chemical Vapor 51 inch sapphire wafers 51 Wafer Level Optics 51 Multek 51 epitaxial 51 #nm NAND flash 51 hi rel 51 flexographic plates 51 LabChip 51 photovoltaic module 51 metallizing 51 TSMC Fab 51 nanometer nm 51 nm lithography 51 SiC wafers 51 Rastek UV wide 51 #mm silicon wafer 51 Prismark 51 fxP 51 stencil printing 51 Bipolar CMOS DMOS BCD 51 transistor arrays 51 InGaP 51 subassembly 51 fracture proppants 51 x 1mm 51 Unisem 51 thermoplastic materials 51 gigabit Gb NAND flash 51 ferrite 51 VISIONPAD ™ 51 CIGS solar 51 leadless 51 silicon carbide SiC 51 NOxOUT 51 Control LACC 51 Microdisplay 51 carbon nanotubes CNT 51 Silicon Germanium SiGe 51 monocrystalline wafers 51 SilTerra 51 extrusion molding 51 #um [002] 51 silicon epitaxial 51 standalone metrology 50 mask aligners 50 NEXX 50 Genesys Logic 50 iCoupler 50 extrusion 50 VCSELs 50 LDMOS 50 MESFET 50 silicon CMOS 50 deep silicon etch 50 WL CSP 50 thermo mechanical 50 Optomec Aerosol Jet 50 defectivity 50 laser welding 50 multimedia SoC 50 nm node 50 wafer fab 50 SDRAMs 50 x 3mm 50 epitaxy HVPE 50 #x# mm QFN 50 Nanometer 50 insert molding 50 SO8 50 aluminum electrolytic capacitors 50 Lithography 50 thermoset composite 50 High Voltage CMOS 50 transparent electrodes 50 dual damascene 50 Flat Panel Displays 50 Chip Scale 50 tuner demodulator 50 CNC milling 50 Nasdaq NVLS 50 TDFN package 50 circuit MMIC 50 #Mbit equivalent 50 microvias 50 EMIF# 50 chemical vapor deposition 50 ModularBCD 50 2Xnm 50 spherical bearings 50 Si TFT LCD 50 Kinsus 50 superabrasives 50 wafer scribing 50 Greatek 50 pulsed laser deposition 50 MEMS oscillators 50 high-k/metal gate 50 Sigma fxP 50 carbon nanotube CNT 50 electroforming 50 reflow solder 50 chip resistor 50 boards PCBs 50 glass substrates 50 Si substrates 50 Auria Solar 50 microchannel plate 50 Non Volatile Memory NVM 50 Insulator SOI 50 AlSiC 50 multilayer ceramic 50 multi axis machining 50 layer ceramic capacitors 50 electrowinning 50 analog IC 50 UV VIS 50 PQFN package 50 Alanod Solar 50 thermoplastic molding 50 pin BGA packages 50 Gallium Nitride GaN 50 ANTARES 50 photomultipliers 50 additive fabrication 50 PROMATION 50 MEMS gyroscopes 50 optical components 50 fiber optic transceivers 50 #μm [002] 50 ultrasonic spray 50 fused silica 50 reticle inspection 50 ARM#EJ processor 50 CMOS photonics 50 Integrated Device Manufacturers IDMs 50 inch wafers 50 VLSI circuits 50 mm wafer fab 50 triplexers 50 CMP polishing 50 sintering 50 UV NIL 50 5mm x 5mm 50 DDR DRAM memory 50 DPN ® 50 stripline 50 nm immersion 50 Kulim Malaysia 50 nm geometries 50 pMOS 50 backside illumination 50 aspheric 50 LTPS 50 nanofabrication 50 AlGaInP LED 50 phototransistors 50 film transistors TFTs 50 polyvinylchloride PVC 50 x #.#mm [005] 50 epitaxial substrates 50 deflashing 50 BCM# SoC 50 #mm fabs 50 RFIC 50 optical lithography 50 3mm x 3mm 50 brightness LED 50 optical waveguides 50 silicon substrate 50 fine precision abrasives 50 Nanometrics standalone 50 HDP CVD 50 × #mm [002] 50 mixed signal RFCMOS 50 CMOS circuits 50 multiaxis 50 GaN wafer 50 NanoSolve 50 #,# wspm 50 microelectronic components 50 1μm 50 Wan Choong Hoe 50 blowmolding 50 GxT 50 MLCC capacitors 50 SiC substrates 50 #G DQPSK 50 sol gel 50 IGBT Insulated Gate 50 perpendicular magnetic recording 50 MSOP packages 50 introduction NPI 50 electrolytic 50 RF SiP 50 XFP module 50 Alchimer 50 MOCVD reactor 50 adhesive bonding 50 7 x 7mm 50 #.#μm CMOS 50 thermoform 50 hollow fiber 50 millimeter wave integrated circuits 50 #.#in [004] 50 darkfield 50 HEMTs 50 nm 50 Germanium 50 QSOP 50 #μm [001] 50 #nm SOI 50 colloidal silica 50 multilayer 50 Aviza Technology 50 silicon MEMS 50 SoloPower flexible 50 semicon 50 flexo printing 50 TSMC #nm process 50 Silicon Via 50 solder paste inspection 50 transparent conductive electrodes 50 Mbit MRAM 50 RF CMOS 50 temperature poly silicon 50 TC#XBG 50 MEMS foundry 50 sintered 50 SMIC #.#um 50 ChipMos 50 InP 50 CMOS circuitry 50 SnPb 50 #.#V CMOS 50 Electrovert 50 germanium substrates 50 electro mechanical assemblies 50 #nm/#nm 50 capillary electrophoresis 50 CIGS 50 wafer fabrication equipment 50 Amorphous silicon 50 radial leaded 50 matte tin 50 extruded polystyrene 50 crystalline silicon wafers 50 nanofluidics 50 monocrystalline silicon 50 stamping fabricating 50 mask aligner 50 electroplated 50 molecular beam epitaxy 50 DDR NAND 50 Copper Indium Gallium Selenide 50 bismuth telluride 50 MOS transistors 50 amorphous silicon 50 photomask 50 #mm fab 50 electrochemical deposition 50 NdFeB 50 InSb 50 electron mobility 50 TQFP packages 50 Single Wafer 50 wph 50 programmable logic devices PLDs 50 squeegee blades 50 2Gb NAND flash 50 productization 50 bonders 50 2Gbit 50 GER SMH leading 50 piezo actuators 50 Nasdaq SPIL 49 conductive adhesives 49 RedEye RPM 49 ADLINK Technology 49 mask reconfigurable 49 wafer uniformity 49 laser spike anneal 49 IQ Aligner 49 BOPP films 49 X ray microanalysis 49 parasitic extraction 49 MEMS oscillator 49 gallium arsenide indium phosphide 49 silicon oxynitride SiON 49 Macrotron 49 ferritic 49 Tessera OptiML 49 Copper Indium Gallium 49 silicon germanium 49 CMOS Image Sensor 49 5μm 49 maskless lithography 49 micromirror 49 Chipbond 49 #nm node [002] 49 heterojunction bipolar transistor 49 cemented carbide 49 Plasma Enhanced 49 InP HBT 49 DSS furnaces 49 ENIG 49 conductive plastics 49 DDR2 DRAM 49 ASICs FPGAs 49 thermoset composites 49 submerged arc welding 49 crystalline silicon solar 49 semiconductive 49 VectorGuard 49 conformal coating 49 Wafer Level Cameras 49 multicrystalline silicon 49 dielectric layers 49 Hoku Membrane 49 SiGe BiCMOS SiGe 49 GaAs 49 holemaking 49 embedded nonvolatile memory 49 device manufacturers IDMs 49 chip inductors 49 focused ion beam 49 EUV mask 49 tinning 49 3 x 3mm 49 solder mask 49 #nm #nm [005] 49 Physware 49 mask ROM 49 Softransceiver 49 PIN diode 49 #.#μ 49 nonpolar GaN 49 Pls redistribute 49 electron optics 49 measuring #.#mm x [001] 49 inertial MEMS 49 copper indium diselenide 49 SUPER PRECISION ™ 49 SUSS MicroTec 49 micro electro mechanical 49 semiconductor fabrication 49 fables semiconductor 49 BIOIDENT 49 stereolithography 49 Opti Probe 49 SCHUNK 49 CIGS solar cell 49 PVD coating 49 planar magnetics 49 Tegal DRIE 49 Prototyping 49 CSM# 49 MOCVD reactors 49 MAX# integrates 49 ultraviolet curable 49 quickturn 49 PowerPro MG 49 #.#mm x [003] 49 LGS #G# 49 zirconium nitride 49 Solamet 49 Hapman 49 MetaSDRAM 49 UniFire 49 FinFET 49 Nan Ya 49 pin 5mm x 49 anneal 49 ATmega#P [001] 49 millisecond anneal 49 gate dielectrics 49 using CMOS BiCMOS 49 PIN diodes 49 SiGen 49 Alphasem 49 #nm wafers 49 backside illumination BSI 49 TOSA ROSA 49 semiconductor metrology 49 molded optics 49 Optima HDx 49 silicon tuner 49 Ardentec 49 solder pastes 49 brazing alloys 49 microwave integrated circuits 49 1Gb DDR2 49 uniaxial strain 49 amorphous silicon modules 49 slitter rewinders 49 photodiode arrays 49 ferrite core 49 transparent conductive coatings 49 indium gallium phosphide InGaP 49 micrometer thick 49 Horizon #i 49 sheet extrusion 49 Atotech 49 active matrix OLED 49 PolyJet 49 compression molded 49 encapsulants 49 EP#S# 49 cadmium zinc telluride 49 microstrip 49 SMARTi 49 MEMS resonators 49 displays FPD 49 poly crystalline 49 prepregs 49 LatticeEC 49 fab utilization 49 silicon interposer 49 extendibility 49 MMICs 49 laser diode modules 49 Wafer Fab 49 magnetic encoders 49 AccelArray 49 chamfering 49 millimeter wafers 49 VPEC 49 Cree GaN 49 micromorph 49 Schottky diodes 49 Yageo Corporation 49 Amkor 49 #nm NAND Flash 49 Surface Mount 49 using laminating molding 49 pin MLF 49 SiGe BiCMOS 49 ECPR 49 chemical mechanical planarization 49 silicon DRIE 49 pin SOT 49 2mm x 2mm 49 Strained silicon 49 PBGA package 49 nanocrystalline 49 Mach Zehnder modulators 49 Inotera Memories 49 nitride semiconductor 49 semiconductor wafer foundry 49 silicon Si 49 #nm lithography [001] 49 XtremeDSP TM 49 integrated metrology 49 Structured eASIC 49 laterally diffused metal