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(Click for frequent words.) 66 parasitic capacitance 64 planarization 63 compressive stress 63 wirebond 63 parasitic inductance 63 delamination 62 parasitics 62 tensile stress 61 NiSi 61 coplanarity 61 electromigration 61 formability 61 springback 60 galvanic corrosion 60 wafer thickness 60 underfill 60 toolholder 60 pMOS 60 moldability 60 solder joints 60 corrugation 60 martensite 60 wave soldering 60 hysteresis 60 rheological 60 defectivity 60 flexural modulus 60 moisture absorption 60 concentricity 60 solderability 60 machinability 59 stiction 59 resistive element 59 eutectic 59 ohmic 59 flux residues 59 thermo mechanical 59 planarity 59 reflowed 59 workpiece 59 laminations 59 frictional resistance 59 thermal dissipation 59 passivation 59 bypass capacitor 59 thermowell 58 nMOS 58 solder paste 58 delaminations 58 epitaxial layer 58 intergranular 58 thermally induced 58 tighter tolerances 58 lattice mismatch 58 roughening 58 nitrided 58 tensile modulus 58 leakage currents 58 ownership CoO 58 corrosion abrasion 58 dielectric breakdown 58 martensitic 58 capacitances 58 dielectric 58 oxide thickness 58 reflow soldering 58 spall 58 snubber 57 tight tolerances 57 solder bumps 57 reflow temperatures 57 waviness 57 thermally activated 57 ductility 57 K dielectrics 57 tribological 57 TiN 57 MOS transistors 57 intermetallic 57 interfacial layer 57 uniaxial 57 4mm thick 57 PCB layout 57 hardcoat 57 electron scattering 57 gasketing 57 μm thick 56 microstructural 56 overmolding 56 MLCCs 56 demagnetization 56 exotherm 56 ceramic capacitor 56 Si substrate 56 friction coefficient 56 BJTs 56 retained austenite 56 ferrite core 56 weld slag 56 weldability 56 delaminate 56 modulus 56 processability 56 ferrite 56 bend radii 56 parasitic capacitances 56 solder reflow 56 solderable 56 inductance 56 mm ² 56 intergranular corrosion 56 dual damascene 56 silicide 56 BEOL 56 sub micron 56 Young modulus 56 dielectric constant 56 sensing resistors 56 passivation layer 56 dielectrics 56 viscoelastic 56 #mm# [003] 56 crystallinity 56 FEOL 56 motor windings 56 overmold 56 reflow 55 BGA CSP 55 silicon nitride 55 ENIG 55 compressive stresses 55 electrically insulating 55 deformation 55 input capacitance 55 1μm 55 swarf 55 wafer dicing 55 weldment 55 CMOS transistors 55 anneal 55 SiO 2 55 shaft misalignment 55 moisture ingress 55 power dissipation 55 conductive adhesive 55 bend radius 55 baseplate 55 transistor leakage 55 edge roughness LER 55 substrate 55 flexural 55 dentinal 55 rotational torque 55 respins 55 PEEK OPTIMA 55 microcavity 55 deterministic jitter 55 mounting flange 55 5μm 55 QFPs 55 heat dissipation 55 crystal oscillator 55 varistor 55 coextrusion 55 ballscrew 55 impedance matching 55 microvia 55 stray capacitance 55 inhomogeneity 55 elastic modulus 55 APTIV film 55 singulation 55 coating thickness 55 Schottky barrier 55 #.#Ω 55 flowability 55 EMIF# 55 polyimide 55 wafer thinning 55 epoxy matrix 55 femoral head 55 toolholders 55 EMI shielding 55 flexure 55 mechanical polishing CMP 55 compression molded 55 wirewound 55 defect densities 55 thermally conductive 55 elastic deformation 54 thermal coefficient 54 biaxial 54 temperature coefficients 54 insulative 54 gate electrode 54 debonding 54 co planarity 54 flame retardancy 54 intermetallic compounds 54 dielectric layer 54 composite laminates 54 UHMW 54 volumetric efficiency 54 graphene layers 54 elastic moduli 54 laser resonator 54 deburring 54 metallisation 54 reflow solder 54 manganite 54 electrostatic discharge 54 4mm x 54 dielectric constants 54 sidewall 54 thermal conduction 54 #.#in [004] 54 pore sizes 54 thermomechanical 54 silicon etch 54 SnPb 54 toroid 54 injection molded polypropylene 54 inductances 54 hydrolytic stability 54 #um [002] 54 photodiode 54 bandpass filter 54 overmolded 54 nonlinearity 54 manufacturability 54 interproximal 54 SiON 54 electromagnetic interference EMI 54 dimensionally stable 54 #mm ² [001] 54 EUV masks 54 z axis 54 accuracy repeatability 54 chipscale 54 snubber circuits 54 stair nosings 54 pellicle 54 FPC connectors 54 flame retardance 54 superior heat dissipation 54 lowpass filter 54 conformal coating 54 thermoformable 54 angulation 54 thermal gradients 54 milliohm 54 analog circuitry 54 #mm# [001] 54 stiffeners 54 heat spreader 53 UVTP 53 solder bump 53 X7R 53 subrack 53 parametric yield 53 conduction cooling 53 carbides 53 decoupling capacitance 53 parasitic inductances 53 ZnSe 53 thinner wafers 53 sintered 53 reflow profiles 53 solder mask 53 workpieces 53 snubbers 53 friction coefficients 53 microcracks 53 weldments 53 Schottky diode 53 eddy currents 53 HEMT 53 conductive epoxy 53 3mm x 53 vibration isolators 53 injection molded parts 53 optocoupler 53 spalling 53 capacitance 53 beveling 53 thin walled 53 overcurrent protection 53 magnetostrictive 53 thermal impedance 53 #x#x# mm [001] 53 tiny 3mm x 53 QFNs 53 dissipative 53 2μm 53 spherical aberrations 53 stencil printing 53 vibration dampening 53 Hardness 53 phototransistor 53 low k dielectrics 53 spindle speeds 53 thermal conductivity 53 particulate contamination 53 flexural strength 53 inductive sensor 53 #mohm 53 elastomeric 53 static dissipative 53 pcb 53 solder pastes 53 borosilicate 53 compressibility 53 SiO2 53 cyclic loading 53 quantization noise 53 abrasion resistance 53 solder 53 routability 53 rheometer 53 nanoindentation 53 alien crosstalk 53 anisotropic 53 gelsolin 53 embrittlement 53 chemically resistant 53 Cu interconnects 53 4H SiC 53 threaded fasteners 53 MICRO FOOT 53 metallization 53 Electrostatic Discharge ESD 53 SN#C 53 low k dielectric 53 wettability 53 bypass capacitors 53 rear subframe 53 titanium carbide 53 wafer probing 53 polycarbonate lens 53 chip resistors 53 corrosion 53 highpass filter 53 gelation 53 cored wire 53 inductive sensors 53 nanometric 53 solder alloy 53 TVS diodes 53 synchronous MOSFET 52 sensing resistor 52 AlN layer 52 PHY# [001] 52 impedance measurements 52 #.#uF 52 dielectric materials 52 molten solder 52 Rdson 52 line BEOL 52 thermally stable 52 EVA foam 52 distal femoral 52 bending radii 52 SOI substrate 52 capacitive coupling 52 MWNT 52 DFN# 52 BGA packaging 52 extrudate 52 anodising 52 boron nitride 52 Insulator SOI 52 interfacial 52 GaN layer 52 AlN 52 interposer 52 coplanar 52 SO8 package 52 piston rod 52 leadframe 52 QFN packages 52 electroless copper 52 cogging 52 nonmagnetic 52 #μm [002] 52 pin TDFN package 52 transconductance 52 piezoresistive 52 tensile strain 52 imprint lithography 52 reed switches 52 proximal humerus 52 parasitic extraction 52 #.#mm diameter [002] 52 sleeving 52 piezo actuators 52 lidding 52 halide 52 heterostructure 52 PZT 52 opto coupler 52 encapsulant 52 auxetic 52 QFN packaging 52 steric 52 lithographic processes 52 tensile compression 52 QSOP 52 microstructures 52 lamella 52 stretchability 52 PWBs 52 heat spreaders 52 surface roughness 52 thermocouple 52 metaphyseal 52 temperature coefficient 52 gearset 52 acrylic adhesives 52 termination resistors 52 printability 52 piezo actuator 52 excellent solderability 52 cavitation 52 welded joints 52 gate dielectrics 52 viscoelastic material 52 integrated passives 52 durometer 52 dispersive 52 #x# mm [003] 52 welded seams 52 reflow oven 52 woofer cones 52 impedances 52 transmissivity 52 micrometer scale 52 FLD glass 52 #um [001] 52 vibration 52 ferrite beads 52 DrMOS 52 threshold voltages 52 e beam lithography 52 eutectic solder 52 superparamagnetic 52 oxide layer 52 micropores 52 planar 52 austenitic stainless steel 52 siloxane 52 #nm immersion 52 Potentiometer 52 endplates 52 QFN 52 polyurethane PUR 52 photoresist 52 rigid foam insulation 52 ferrite magnets 52 hafnium oxide 52 torsional 52 austenite 52 temperature gradients 52 5mm x 5mm 52 bushing 52 #.#mm x #.#mm [003] 52 chromatic aberrations 52 axial loads 52 silicate glass 52 regrind 52 #.#um [001] 52 SOI CMOS 52 geometries 52 magnetic permeability 52 copper interconnects 52 passivating 52 post perovskite 52 impedance 52 glenoid 51 variable resistor 51 sealability 51 transistor arrays 51 SMA connectors 51 5mm x 6mm 51 differential impedance 51 decoupling capacitors 51 MOSFETS 51 4mm x 4mm 51 mandrel 51 directional tread 51 fusible 51 thermal conductivities 51 QFN package 51 solder alloys 51 MOS transistor 51 easily cleanable 51 current sensing resistor 51 adhesive bonding 51 zirconium oxide 51 #mΩ [002] 51 #μm thick [002] 51 8kV 51 dewetting 51 heat sealable 51 electron beam welding 51 passivated 51 voltage divider 51 ionic contamination 51 inhomogeneities 51 Hysol 51 antireflective coatings 51 Fractional N 51 kinking 51 fluid viscosity 51 hydraulic actuator 51 k dielectric 51 Stiffness 51 BGA packages 51 weldable 51 output impedance 51 abrasive particles 51 UV inhibitors 51 pinout 51 Mosfets 51 distal embolization 51 #x# mm [004] 51 #μm [001] 51 multiaxial 51 silicon interposer 51 aspherical lens 51 solvent evaporation 51 nanomesh 51 uniformities 51 zener diode 51 laminate substrate 51 hermetic seal 51 electroactive polymer 51 PID controller 51 Bulk Metal 51 trabecular bone 51 opto couplers 51 gelcoat 51 SOT# [002] 51 submicron 51 non linearities 51 MLCC capacitors 51 Alien Crosstalk 51 windings 51 oxidization 51 foam cushioning 51 ablator 51 Ball Grid Array 51 #nm lithography [001] 51 dephasing 51 ESD protection 51 optically transparent 51 RO membrane 51 cavitations 51 solder bumping 51 resistant polycarbonate 51 MΩ 51 dielectric layers 51 compressive strain 51 humeral head 51 nanoparticle arrays 51 conductive adhesives 51 alloying elements 51 polymer matrix 51 dentinal tubules 51 LDO controller 51 surface passivation 51 vibration damping 51 rearfoot 51 4mm x 4mm QFN 51 capacitive loads 51 HEMTs 51 cermet 51 dielectric thickness 51 PIN photodiode 51 ESD electrostatic discharge 51 FinFET 51 nanolayers 51 cone woofers 51 EMI RFI 51 TO #AB 51 soleplate 51 mosfet 51 Multilayer Ceramic 51 photoelectric sensor 51 nitriding 51 UV stabilized 51 oscillation frequency 51 recrystallization 51 channel MOSFET 51 zener diodes 51 polycarbonate glazing 51 ultrasonic welding 51 chamfering 51 adsorptive 51 isostatic 51 nickel titanium alloy 51 VICTREX PEEK polymer 51 paramagnetic 51 malalignment 51 cleanability 51 epoxy coated 51 carbon nanotube arrays 51 InGaAs InP 51 sequential clock gating 51 countersink 51 EUV mask 51 EUV resists 51 reconfigurability 51 hydrophobicity 51 squeegee blades 51 density fiberboard 51 antistatic properties 51 aluminum housings 51 cathodic 51 nanopillar 51 sputter deposition 51 SOT# package [001] 51 intrinsic jitter 51 Formex GK 51 recoating 51 CNC machined 51 chromatic aberration 51 ballscrews 51 Attenuator 51 EMI RFI shielding 51 alumina ceramic 51 line FEOL 51 absorbance 51 #.#pF 51 NiPdAu 51 viscoelastic properties 51 electromagnetic shielding 51 JTAG emulation 51 SWCNT 51 articular surface 51 platens 51 Sn Pb 51 Neopor 51 ferro electric 51 QMEMS 51 SO8 51 degas 51 AlGaN 51 pneumatically actuated 51 thermowells 51 osteosynthesis 51 stepper motor 51 thermal EMF 51 spherical roller bearings 50 thermoform 50 coupling capacitance 50 superlattice 50 dampens vibration 50 Zener diode 50 electron mobility 50 deadtime 50 ferritic 50 oxidisation 50 brushless DC motors 50 self lubricating 50 extractables 50 Reflow 50 pipette tip 50 protein adsorption 50 vias 50 coated polyester 50 MgO 50 surface mountable 50 silicon substrates 50 impedance input 50 electrostatic discharge ESD 50 vapor retarders 50 MTCMOS 50 thrombus formation 50 kerf 50 k dielectrics 50 geometric distortion 50 #/#-inch thick [001] 50 WLCSP 50 coercivity 50 hotmelt 50 ferromagnet 50 ultrathin layer 50 solventless 50 composite laminate 50 di dt 50 frequency harmonics 50 linearization 50 pearlite 50 k gate dielectric 50 cancellous bone 50 selectivities 50 wirewound resistors 50 color fastness 50 conventional photolithography 50 Arria GX FPGAs 50 PIN diodes 50 2nm 50 rotor shaft 50 electrolytic capacitor 50 Gaussian filter 50 copper metallization 50 Datamate 50 anomalous dispersion 50 injection moldable 50 Inductance 50 Leadless 50 sintered metal 50 silicone adhesive 50 chamfer 50 monochromator 50 TSVs 50 #mm# [002] 50 flexures 50 Kapton 50 Z Foil 50 PMOS transistors 50 homopolymer 50 RTL synthesis 50 FusionQuad 50 PTFE 50 C0G 50 MicroFET 50 Anti Vibration 50 dopant 50 acetabulum 50 tensile stresses 50 2Xnm 50 gate dielectric 50 cooling fins 50 damping characteristics 50 #.#μm [001] 50 interposers 50 electroplated 50 #ppm ° C 50 aspheres 50 inductors 50 flexo plates 50 photoresists 50 #.#mm thick [002] 50 nitride layer 50 conformality 50 #Ω [002] 50 bimetal 50 SMT LEDs 50 multichip 50 ionomer 50 nano patterning 50 conformal coated 50 capacitive loading 50 Hastelloy C 50 JFET 50 WL CSP 50 LDO regulator 50 corrosion resistance 50 radiused 50 bending stiffness 50 photolithographic 50 electro magnetic interference 50 Zener diodes 50 VICTREX PEEK 50 parison 50 SiPs 50 tantalum capacitors 50 cylinder bores 50 synchronous buck converter 50 corneal stroma 50 millisecond anneal 50 Avobenzone 50 D2PAK 50 5mm x 50 tiny 2mm x 50 micromirror 50 curvatures 50 mΩ 50 HASL 50 x 3mm 50 vinyl esters 50 5kV 50 diffraction grating 50 oxidation 50 parametrically 50 interlayer 50 harmonic filters 50 wetted parts 50 LiNbO3 50 reactance 50 nanocoatings 50 optimize airflow 50 coupling capacitors 50 piezoelectric ceramic 50 torsional strength 50 outcoupling 50 thermistor 50 FR4 50 Power MOSFETs 50 articular surfaces 50 2mm x #.#mm 50 nanomembranes 50 shaft encoder 50 AlSiC 50 toroidal 50 toroids 50 voltage MOSFET 50 thermosensitive 50 epoxy primer 50 Carbon fiber 50 mechanically fastened 50 thermoset 50 ppm ° C 50 proximal femur 50 endplate 50 MIC#/# 50 knurled 50 osteolysis 50 AdvancedMC module 50 conductivity 50 OP# [003] 50 SY#L 50 vapor retarder 50 crosslinked 50 CMOS wafers 50 curve tracer 50 viscosity 50 chainstay 50 bilayer 50 monolithically integrated 50 Figure 2a 50 tantalum capacitor 50 pinion shaft 50 external EEPROM 50 Cryovac ® 50 compressive strength 50 detuning 50 multilayer PCBs 50 weatherable 50 depolarization 50 cuvettes 50 rollstock 50 graphene sheets 50 brake rotor 50 output capacitance 50 gasket seals 50 multibit 50 bevel 50 diffractive optical elements 50 zeolite membranes 50 elastomer 50 deep submicron 50 PowerPAK 50 W mK 50 annealing 50 spheroidal 50 isotropic 50 CAN transceiver 50 leadless 50 electroless nickel 50 trabecular 50 Thermocouples 50 7mm x 50 toolpath 50 repeatability 50 MCP#X 50 frequency transducers 50 ± #ppm [001] 50 Magnesium alloy 50 brightness uniformity 50 pre preg 50 singulated 50 friability 50 radial leaded 50 PIN photodiodes 50 abrasion corrosion 50 workholding 50 Vdd 50 membrane permeability 50 linearisation 50 coupling capacitor 50 ultrahigh purity 50 ultrasonic vibrations 50 PoE PD 50 backpressure 49 tibiofibular 49 4mA 49 silicone gasket 49 crystal resonator 49 polyurethane resins 49 pinion angle 49 weld bead 49 flexographic plates 49 reticles 49 mandrels 49 oligomer 49 microstrip 49 machined 49 plasma ICP 49 elastic fibers 49 Interpolation 49 ionic conductivity 49 conductivities 49 optical encoder 49 finite element 49 leakage inductance 49 capsular contracture 49 weatherability 49 Lexan Thermoclear sheet 49 optical aberrations 49 cm ² 49 rotational vibration 49 backshells 49 wheel spacers 49 Cu Cu 49 thermoplastic rubber 49 Silicon Nitride 49 oxide particles 49 DFN package 49 pushbutton switch 49 mounting flanges 49 triaxial 49 spindle 49 #.#mm x [003] 49 perovskite 49 visco elastic 49 dielectric etch 49 Akulon 49 electrodeposition 49 cementite 49 repels moisture 49 PHEMT 49 extruded profiles 49 photobleaching 49 thermocouple RTD 49 aluminum swingarm 49 enzymatic degradation 49 fused silica 49 measuring #.#mm x [001] 49 hobbing 49 jointless 49 package SiP 49 birefringence 49 light transmittance 49 subwavelength 49 indenter 49 tissue ingrowth 49 sonication 49 clamping voltage 49 microcrystalline 49 Abrasion 49 parameter estimation 49 silicone elastomers 49 ferrites 49 impeller 49 wirebonding 49 polycrystalline 49 PLLA 49 flanges 49 shrinking geometries 49 unsprung mass 49 colorfastness 49 baseboard 49 cortical bone 49 intervertebral discs 49 light fastness 49 angular misalignment 49 ductile 49 twin screw extruder 49 weld seam 49 electro static 49 radiopacity 49 #mm rotor 49 linearized 49 sacrificial anode 49 rubber outsole 49 bending radius 49 #x#mm [002] 49 3Xnm 49 zinc alloy 49 resorption 49 tire sidewalls 49 smaller geometries 49 CoroMill 49 periosteal 49 SAR ADC 49 DPAK 49 busbar 49 solder paste printing 49 3mm x 3mm 49 wafer metrology 49 adiabatic 49 abrasion resistant 49 thermistors 49 tensile 49 nematic 49 CFD modeling 49 QPAC ®