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(Click for frequent words.) 78 mm wafers 73 inch wafers 72 mm wafer 70 #mm wafer 70 millimeter wafers 67 #nm [001] 67 #mm fabs 66 wafers 66 #mm silicon wafers 66 millimeter silicon wafers 65 SOI wafers 64 nanometer 64 #mm fab 64 glass substrate 63 millimeter wafer 62 fabs 62 mm fab 62 Elpida #nm 62 #nm wafers 62 #/#nm 62 glass substrates 62 nanometer node 62 #mm wafer fabrication 62 silicon wafers 62 silicon wafer 62 DDR3 chips 62 .# micron 62 #nm NAND flash 61 #nm SOI 61 wafer 61 #mm silicon wafer 61 nanometer chips 61 mm wafer fab 61 #mm wafer fab 61 #,# wspm 61 #nm DRAM 60 #nm silicon 60 #.# micron node 60 #.#μm [002] 60 #nm fabrication 60 semiconductor wafers 60 IMFT 60 mm fabs 60 #.# micron CMOS 59 #nm node [001] 59 inch wafer fabs 59 3D TSV 59 #nm processors 59 #nm chips 59 Inotera 59 DDR2 DRAM 58 XDR DRAM 58 nm CMOS 58 nm lithography 58 mm silicon wafers 58 #mm fabrication 58 #nm MirrorBit 58 EUV lithography 58 NAND flash 58 #nm CMOS [001] 58 nanometer CMOS 58 nanometer nm 58 nanometer lithography 57 mm wafer fabrication 57 wafer fabrication 57 nm CMOS process 57 #nm node [002] 57 #nm Buried Wordline 57 nm SOI 57 TSMC #nm process 57 Rexchip 57 NAND 57 Fab #X 57 2Gbit 57 LTPS 57 CMOS wafer 57 NAND memory 57 NOR Flash memory 56 epitaxial wafers 56 #nm/#nm 56 immersion lithography 56 smaller geometries 56 2Gb DDR3 56 wafer fabs 56 #Gb NAND flash 56 gigabit Gb NAND flash 56 wafer probing 56 wafer fab 56 #nm fab 56 #nm transistors 56 nm SRAM 56 Soitec produces 56 nanometer NAND flash 56 computational lithography 55 photomask 55 #nm #nm [005] 55 Yokkaichi Operations 55 motherglass 55 wspm 55 4Gb DDR3 55 inch wafer fab 55 SOI wafer 55 fab utilization 55 #nm RF CMOS 55 TSMC #nm [001] 55 DongbuAnam 55 UMCi 55 WLCSP 55 Global Foundries 55 nm 55 inch wafer fabrication 55 nm nodes 55 MOCVD 55 BCDMOS 55 Fab# 55 DRAM 55 semiconductor 55 high-k/metal gate 55 Elpida 55 copper interconnects 55 millimeter silicon wafer 55 Dresden fab 55 CMOS 55 CMOS compatible 55 chipmaking 54 nm node 54 BiCMOS 54 diameter wafers 54 TSVs 54 nanometer silicon 54 dielectric etch 54 DDR2 54 Joanne Itow 54 UMC #nm 54 MirrorBit Quad 54 silicon 54 LED backlights 54 micron 54 Imprio 54 SiP 54 perpendicular recording 54 ion implanters 54 nm FPGA 54 polysilicon 54 #nm NAND 54 XinTec 54 ArF immersion lithography 54 #.#μm CMOS 54 photomasks 54 #Mbit [002] 54 Micron Boise Idaho 54 GLOBALFOUNDRIES 54 equivalent wafers 54 PHEMT 54 LCD panels 54 epi wafers 54 Aizu Wakamatsu Japan 53 #nm HKMG 53 MOCVD tools 53 SOI CMOS 53 semiconductor fabrication 53 #.#um [002] 53 #nm 8GB 53 3Xnm 53 wafer bonding 53 TSMC Fab 53 monocrystalline silicon 53 CdTe Si 53 CMOS wafers 53 solar wafers 53 micron wafers 53 CMP consumables 53 CIGS 53 Globalfoundries 53 NOR flash memory 53 GaAs fab 53 1Gbit 53 ArF immersion 53 inch fabs 53 density NAND flash 53 wafer bumping 53 nm DRAM 53 VECTOR Extreme 53 TSMC 53 millimeter wafer fabrication 53 GDDR4 53 TFPV 53 eWLB 53 epiwafers 53 nm NAND 53 eWLB technology 53 fab Fab 53 photolithography 53 gigabit NAND flash 53 EUV 53 X FAB 53 substrates 53 wafer foundries 53 1Gbit DDR2 53 CIGS cells 53 nm immersion lithography 53 CMOS IC 53 silane gas 53 MLC NAND flash 53 nm immersion 53 CMOS processes 53 nanometer nm NAND flash 53 FLCOS 52 Inotera Memories 52 LED BLUs 52 #nm FPGAs 52 through silicon vias 52 8Gbit 52 4Gbit 52 C4NP 52 #nm nanometer 52 CMOS fabrication 52 IC packaging 52 BiFET 52 HDI PCB 52 InGaP HBT 52 c Si 52 Nanya 52 #nm nodes 52 Winbond 52 NOR Flash 52 NAND Flash memory 52 chipsets 52 ATDF 52 pHEMT 52 perpendicular recording technology 52 sapphire wafers 52 #mm MEMS 52 TSMC Hsinchu Taiwan 52 nm MirrorBit 52 mm wafer fabs 52 silicon foundries 52 nano imprint 52 #nm NAND Flash 52 #.#μm CMOS process 52 polycrystalline silicon 52 GaAs 52 SiC substrates 52 NAND Flash 52 amorphous silicon Si 52 DDR3 DRAM 52 Yokkaichi Japan 52 Toppan Photomasks 52 silicon germanium SiGe 52 #nm photomask 52 ML#Q# 52 Efficeon TM# processor 52 DRAMs 52 #nm CMOS [002] 52 EverQ 52 1Gb DDR2 52 SiTime 52 #nm 1Gb 52 logic LSIs 52 ITRS roadmap 52 tapeouts 52 Fab #A 52 Stratix II 52 eDRAM 52 embedded NVM 52 MOS transistors 52 wafer thickness 52 crystalline Si 52 TFT LCD 52 nano imprint lithography 51 chipmakers 51 D1X 51 #nm lithography [002] 51 LPDDR2 DRAM 51 nm FPGAs 51 #nm SoC 51 epitaxy 51 TFT LCD module 51 #nm MLC 51 millimeter mm 51 FeRAM 51 backlight module 51 LCOS 51 FineSim Pro 51 Nand flash 51 GaAs substrates 51 embedded DRAM 51 eMemory 51 VIISta 51 NOR flash 51 SMIC 51 poly silicon 51 AMOLED panels 51 DRAM memory 51 wafer thinning 51 defect densities 51 ArF 51 nanometer microprocessors 51 gigabit DDR3 51 Nanya Technology 51 Chi Mei Optoelectronics CMO 51 monocrystalline silicon wafers 51 wafer bonder 51 #μm thick [002] 51 semiconductor wafer 51 Unitive 51 2Xnm 51 transistor leakage 51 Silicon Germanium 51 Crolles2 Alliance 51 #nm immersion 51 Gallium Arsenide 51 Kinsus 51 SilTerra 51 GloFo 51 #nm lithography [001] 51 #Mb DDR2 51 Amkor 51 nm NAND flash 51 nanometer nm CMOS 51 poly Si 51 deep sub micron 51 photovoltaic module 51 Si TFT LCD 51 wafer foundry 51 BEOL 51 quad core microprocessors 51 wafer fabrication facility 51 Winbond Electronics 51 optical lithography 51 gigabit GDDR5 51 1Gb DRAM 51 mask ROM 51 HKMG 51 CMOS MEMS 51 TSMC foundry 51 leadframes 51 Fab #i 51 HTPS panels 51 Kameyama plant 51 TFTs 51 GaAs foundry 51 WiMAX chipset 51 blue laser diode 51 extreme ultraviolet lithography 51 amorphous TFT LCD 51 amorphous silicon 51 CIGS solar cells 51 semiconductor foundry 51 NAND Flash Memory 51 #GB SSDs [002] 51 nanometer circuitry 51 Nand Flash 51 Siltronic 51 DDR NAND 51 #nm microprocessors 51 imprint lithography 50 nanometer transistors 50 Mbit 50 Buried Wordline technology 50 nanometer nm node 50 GaN wafers 50 Stratix IV 50 Penryn processors 50 wafering 50 DDR3 50 #.#um CMOS 50 #Mbit DDR2 50 IC substrate 50 lithography 50 micro SMD package 50 crystalline silicon 50 Sematech 50 Crolles France 50 Ball Grid Array 50 Penryn chips 50 Dongbu HiTek 50 gallium nitride 50 Mbit MRAM 50 crystalline silicon c 50 #Gbit [001] 50 Macronix 50 MagnaChip 50 sapphire substrate 50 embedded SRAM 50 silicon substrates 50 solar photovoltaic PV modules 50 Crolles2 50 DuPont Photomasks 50 CMOS logic 50 inch widescreen panels 50 #nm Process 50 moviNAND 50 GaAs pHEMT 50 Chunghwa Picture Tubes CPT 50 #mm Fab 50 Silego 50 8G LCD 50 plasma etch 50 BGA packages 50 Hiroshima Elpida Memory 50 nanoimprint 50 MirrorBit technology 50 Gb DDR3 50 amorphous alloy transformer 50 multicrystalline 50 Shin Etsu Handotai 50 Wafer shipments 50 nm geometries 50 FB DIMMs 50 capacitive touch panels 50 gigabit Gb 50 UWB chipset 50 GT# GPU 50 ARM#EJ S processor 50 ALLVIA 50 8Gb NAND 50 XLR #i 50 MB#H# 50 GDDR5 50 low k dielectrics 50 deep submicron 50 solder bumping 50 silicon chips 50 SOI substrates 50 insulator wafers 50 MEMS fabrication 50 LCD module LCM 50 InP 50 high-k/metal-gate 50 Micromorph 50 hydride vapor phase 50 flexible substrates 50 dual core Opterons 50 NAND fab 50 String Ribbon 50 SLC NAND flash 50 Alanod Solar 50 GaAs wafer 50 Gbit NAND flash 50 5G TFT LCD 50 SLC NAND 50 Auria Solar 50 Nanometer 50 IDMs 50 #Mbit equivalent 50 backlight modules 50 #nm CPUs 50 #.#um [001] 50 MetaRAM 50 joint venture Inotera Memories 50 #GbE switches 50 #nm FPGA 50 #nm MLC NAND 50 controller ICs 50 e beam lithography 50 FB DIMM 50 Silicon Oxide Nitride 50 MAPPER 50 CSTN LCD 50 wafer metrology 50 SunFab 50 NAND flash memory 50 Wafer Level Packaging 50 Flip Chip 50 VECTOR Express 50 silicon photonics 50 GX FPGAs 50 ApaceWave 49 XT #i 49 sSOI 49 LG.Philips LCD 49 SiC 49 MT#V# 49 Manz Automation 49 RX MCU 49 #GB RDIMM 49 nanometer NAND 49 Toshiba Yokkaichi Operations 49 Nehalem chips 49 AU Optronics AUO 49 DRAM fabs 49 DDR2 SDRAMs 49 FOUP 49 Renesas 49 DRAM ASPs 49 MB#K# 49 #.#mm# [001] 49 Dothan Pentium M 49 Hsinchu Taiwan 49 automotive MCUs 49 CS# [002] 49 fab 49 photodetectors 49 #MWp [001] 49 XsunX 49 Fab 3E 49 geometries shrink 49 areal densities 49 epitaxial wafer 49 AMOLEDs 49 chipmaking equipment 49 #nm immersion lithography 49 monolithically integrated 49 EcoRAM 49 OEL panels 49 BGA packaging 49 wafer shipments 49 LCoS 49 high voltage BCDMOS 49 Semiconductor Manufacturing 49 RV# chip 49 PV module manufacturing 49 CMOS sensors 49 GaAs HBT 49 DrMOS 49 inch HDDs 49 SIMOX 49 ATMI 49 Thin Film Solar 49 MSM# chipset 49 HKMG technology 49 NexFlash 49 8Gbit NAND flash 49 monocrystalline ingots 49 monosilane 49 substrate 49 ARM#EJ processor 49 ProMOS 49 Lextar 49 perpendicular magnetic recording 49 WLAN chipsets 49 HHDs 49 CIGS solar cell 49 Westmere processor 49 semiconductor fabs 49 graphite electrode 49 Elpida Hiroshima 49 SVA NEC 49 2Gb DDR2 49 thinner wafers 49 epitaxial deposition 49 MLC NAND 49 4Gb NAND flash 49 wafer diameters 49 epiwafer 49 Double Patterning 49 LCDs 49 SiC wafers 49 Molecular Imprints 49 CMOS imagers 49 multichip package 49 polysilicon ingot 49 Applied Material 49 Serial Flash 49 monocrystalline wafers 49 GaN wafer 49 Structured ASIC 49 Silicon wafer 49 nm Penryn 49 CIGS thin film 49 LRDIMMs 49 DDRII 49 GaAs gallium arsenide 49 hyperpure polycrystalline silicon 49 Wafer Level 49 interposers 49 #nm 2Gb 49 Munich Perlach 49 GaN layers 49 SVTC 49 MEMS oscillators 49 analogue ICs 49 SiON 49 Geldern 49 wire bonders 49 Sunfilm 49 solar PV module 49 wph 49 gigabit NAND 49 #.#μ 49 Cortex A9 processor 49 OLED TVs 49 Gigaphoton 49 PROLITH 49 logic CMOS 49 Oxide Silicon 49 asynchronous SRAM 49 #.#u 49 nanoimprinting 49 PV module 48 HBT wafers 48 Innolux 48 silicon interposers 48 Powerchip 48 wafer processing 48 packaging WLP 48 multichip 48 Wafer Fab 48 LTPS LCD 48 EUVL 48 Insulator SOI 48 SiWare 48 ISMI 48 ASML immersion 48 Pseudo SRAM 48 Pin Scale 48 #SE# 48 nonvolatile memory 48 polysilicon reactors 48 photoresist strip 48 MetaSDRAM 48 OLED displays 48 Tera Probe 48 LCD steppers 48 inch sapphire wafers 48 Megabit Mb 48 sintering 48 SECS GEM 48 DDR DRAM 48 Caneland platform 48 1Gb DDR3 48 Photolithography 48 #Gbps Ethernet [001] 48 multicrystalline solar cells 48 Microdisplay 48 Fujitsu Microelectronics 48 baseband chip 48 TC#XBG 48 Micron 48 design kits PDKs 48 micron pixel 48 Microdrive 48 FineSim SPICE 48 indium gallium phosphide InGaP 48 embedded EEPROM 48 HelioVolt 48 Rexchip Electronics 48 micromorph ® 48 foundries 48 ClearNAND 48 Spansion 48 copper metallization 48 MiaSolé 48 bipolar transistors 48 silicon ingot 48 Integrated Device Manufacturers IDMs 48 Toshiba Yokkaichi 48 silicon wafer maker 48 #Mb DRAM 48 laterally diffused metal 48 LPDDR2 48 submicron 48 microfabrication 48 GDDR3 48 areal density 48 GaN LED 48 fabless IC 48 #nm Penryn 48 TriQuint Semiconductor 48 BLUs 48 DDR3 modules 48 deep submicron CMOS 48 Qimonda 48 SO DIMMs 48 Akiruno TC 48 Nehalem architecture 48 Flex OneNAND 48 ZEVIO 48 GaN HEMT 48 CMOS foundry 48 AIX #G# 48 sub micron 48 LTPS TFT 48 Solaicx 48 transistors 48 NVIDIA nForce Professional 48 multicrystalline wafers 48 projected capacitive touch 48 NYSE UMC TSE 48 microprocessor cores 48 ASE Material 48 #nm #nm #nm 48 silicon germanium SiGe BiCMOS 48 Montevina platform 48 Core i7 #UM 48 immersion litho 48 Silverthorne processor 48 monolithic CMOS 48 MirrorBit NOR 48 MiaSole 48 registered DIMMs 48 SiGe 48 quad core CPUs 48 MOCVD reactors 48 #nm GPUs 48 IC foundry 48 multicore DSPs 48 SiGe C 48 MOCVD tool 48 #mm ² [001] 48 semiconductor wafer fabrication 48 class #Gb NAND 48 #nm SRAM 48 TWINSCAN 48 pin BGA package 48 Intel Nehalem microarchitecture 48 PWRficient 48 RRAM 48 planar transistors 48 DiCon 48 HHNEC 48 microinverters 48 pin LQFP package 48 Rexchip Electronics Corp. 48 SIMOX SOI wafers 48 Taiwanese DRAM 48 SUSS 48 Wafer Manufacturing 48 Powerchip Semiconductor Corporation 48 multilayer ceramic capacitors MLCC 48 Efficeon 48 Ardentec 48 voltage CMOS 48 RLDRAM 48 DFM DFY 48 #nm geometries 48 cathode materials 48 photomask inspection 48 graphics chipsets 48 CMOS circuits 48 DIMMs 48 Buried Wordline 48 millisecond anneal 48 #Gb MLC NAND 48 Socket AM3 48 Aerosol Jet 48 multijunction solar cells 48 ProMos 48 LTPS TFT LCD 48 ONFi 47 CMOS circuitry 47 polarizer 47 embedded Wafer Level 47 LED backlit LCD TVs 47 LDMOS 47 Hard Disk Drives 47 Gb NAND flash 47 MOS transistor 47 Arria GX FPGAs 47 SpectraWatt 47 chipset 47 MEMS 47 NAND flash chips 47 Silicon Germanium SiGe 47 RV# GPU 47 wafer dicing 47 ULi M# 47 package SiP 47 HannStar Display 47 #mm# [003] 47 SO DIMM 47 trichlorosilane 47 Micron DRAM 47 gallium nitride GaN 47 Mosel Vitelic 47 Complementary Metal Oxide Semiconductor 47 D1D 47 SiS#FX 47 FabEX 47 HDDs 47 Shin Etsu 47 Opteron EE 47 #nm Nehalem 47 ReRAM 47 purity silicon 47 Stratix III FPGAs 47 Intel Nehalem processor 47 Chin Poon 47 CRIUS 47 inch Travelstar 47 holographic storage 47 Willoner 47 Sempron processors 47 Transmeta Efficeon processor 47 GaAs substrate 47 6Gbit/sec 47 PMOLED 47 Semicon 47 pin PBGA package 47 SEMATECH 47 Solibro 47 MaxEdge 47 Silicon CMOS Photonics 47 SUMCO 47 DDR2 SDRAM 47 CMOS silicon 47 #nm MLC NAND flash 47 SEMICON 47 Copper Indium Gallium Selenide 47 RealSSD P# 47 ISMI Manufacturing Week 47 Lynnfield processors 47 ion implantation equipment 47 SiGe bipolar 47 Quanta Display 47 OneChip 47 structured ASIC 47 AUO 47 ArF dry 47 DRAM modules 47 lithography steppers 47 MRAMs 47 semiconductor fab 47 FormFactor 47 Mbit densities 47 Aviza Technology 47 Veeco 47 silicon germanium 47 #nm [002] 47 reticle inspection 47 wafer ASPs 47 EUV mask 47 FASL LLC 47 Mobile AMD Sempron 47 silicon interposer 47 Pentium Extreme Edition 47 fxP 47 Kilopass 47 SuperFlash 47 cellular baseband 47 SoC 47 EUV masks 47 CMOS complementary 47 JFET 47 Mbit SRAMs 47 IGP chipsets 47 HBLED 47 micro optics 47 embedded SerDes 47 GPU cores 47 researcher IC Insights 47 Cell MLC 47 Westmere architecture 47 silicon DRIE 47 PolyMax 47 line BEOL 47 POWER5 + 47 ARM# MPCore processor 47 Gb NAND 47 High Voltage CMOS 47 Sigma fxP 47 toggle DDR 47 multicore architecture 47 engineered substrates 47 TFT LCD modules 47 GDDR 47 RPTVs 47 InGaP GaAs HBT 47 wirebond 47 UltraCMOS 47 active matrix OLED 47 GaN substrates 47 LSIs 47 STATS ChipPAC 47 k gate dielectrics 47 MEMS microphones 47 antireflective coatings 47 TFT LCDs 47 deep ultraviolet DUV 47 Siliconware 47 Spansion EcoRAM 47 Silicon Photonics 47 ASML TWINSCAN 47 Photomask 47 Himax 47 AMD Fusion APU 47 rigid substrates 47 logic elements LEs 47 insulator SOI 47 silicon ingots 47 SDHC Memory Cards 47 semiconductor foundries 47 quad cores 47 AlN 47 electrodeposition 47 PECVD 47 microdisplay 47 MirrorBit ORNAND 47 8GB NAND flash 47 Bipolar CMOS DMOS 47 RDRAM 47 CIGS PV 47 Gbit DDR3 47 DRAM NAND 47 LongRun2 47 Nand flash memory 47 solar modules 47 MLC NAND Flash 47 CMOS scaling 47 #nm GPU 47 Vsby 1 47 LQFP# package 47 SiT# 47 k gate dielectric 47 DRAM makers 47 Availability Samples 47 SiC MOSFET 47 cell MLC NAND 47 Nextreme 47 Quad NROM 47 Hsin Chu Taiwan 47 silicon substrate 47 PSi 47 CMOS Image Sensor 47 MOCVD systems 47 #.#x#.#mm 47 SANYO Semiconductor 47 crystalline silicon solar panels 47 SHELLCASE 47 Gallium Nitride 47 Si substrates 47 Bridgelux 47 QFN packages 47 2Gb NAND flash 47 pin BGA packages 47 Phison 47 Stratix II GX 47 #nm Clarkdale 47 WiCkeD 47 #nm quad core 47 Immersion Lithography 47 Encounter RTL Compiler 47 CBT resin 47 Llano APU 47 structured ASICs 47 Silterra 47 cleanroom 46 centrotherm 46 fabless 46 Lithography 46 Indium Phosphide 46 OSAT 46 HEMT 46 Kilopass XPM 46 LSISAS# 46 Infinera PICs 46 AMLCD 46 3D TSVs 46 ultralow voltage 46 TLA# Series 46 Cortex M0 processor 46 foundry 46 RealSSD 46 6T SRAM 46 #bit MCUs 46 Aixtron MOCVD 46 Taiwanese foundries 46 FDSOI 46 Surfect 46 MRAM chips 46 ethylene amines 46 die bonder 46 Stratix III 46 Schottky diodes 46 TSMC UMC 46 Pentium M chips 46 Design Compiler topographical 46 FPGA prototypes 46 SiGe BiCMOS 46 SDRAMs 46 LDS# [001] 46 NAND chips 46 silicon photovoltaics 46 LCD 46 Semprons 46 RapidIO Switch 46 Chip Scale 46 Amorphous Silicon 46 silicon CMOS 46 photolithographic 46 Teradyne FLEX 46 germanium wafers 46 DRAM module 46 XFP module 46 AMOLED displays 46 electric arc furnaces 46 ASML lithography 46 JEDEC compliant 46 S#C# 46 HBLEDs 46 VCSEL 46 MEMS oscillator 46 interposer 46 nanoimprint lithography 46 quad core processor 46 MirrorBit Eclipse 46 pin QFN package 46 Fabs